Claims
- 1. An array of a printed circuit and a substrate therefor, said substrate consisting essentially of an alloy of the formula:
- Mg.sub.x Al.sub.y Ti.sub. O.sub.4
- wherein
- x+y+z=3
- x=1 -2
- y=0.1-1.9
- z=0.1-0.9
- said alloy having a dielectric constant of 8.5 to 13.8 and a density which is at least 98% of the theoretical density of the alloy.
- 2. A method of forming and array of electrical circuits stacked on and electrically insulated from one another, said method comprising forming a plurality of unfired substrates having thicknesses of 0.007 to 0.025 inches, and of the formula:
- Mg.sub.x Al.sub.y Ti.sub.z O.sub.4
- wherein
- x+y+z=3
- x=1-2
- y=0.1-1.9
- z=0.1-0.9
- printing an electrical circuit on each of said substrates, and firing the substrates while in stacked configuration at a temperature 1325.degree. C. to 1450.degree. C. to form dielectric alloys between each pair of adjacent electrical circuits.
Parent Case Info
This is a division of application Ser. No. 049,984 filed May 15, 1987.
US Referenced Citations (13)
Divisions (1)
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Number |
Date |
Country |
Parent |
49984 |
May 1987 |
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