Number | Date | Country | Kind |
---|---|---|---|
10-272788 | Sep 1998 | JP | |
11-067744 | Mar 1999 | JP | |
11-133283 | May 1999 | JP |
Number | Name | Date | Kind |
---|---|---|---|
4796432 | Fixsen et al. | Jan 1989 | A |
5055140 | Kumada | Oct 1991 | A |
5698852 | Tanaka | Dec 1997 | A |
Number | Date | Country |
---|---|---|
197 25 679 | Jan 1999 | DE |
2-284439 | Nov 1990 | JP |
4-312942 | Nov 1992 | JP |
4-369849 | Dec 1992 | JP |
5-47929 | Feb 1993 | JP |
5-136240 | Jun 1993 | JP |
5-243535 | Sep 1993 | JP |
7-14898 | Jan 1995 | JP |
7-167924 | Jul 1995 | JP |
8-255818 | Oct 1996 | JP |
8-316281 | Nov 1996 | JP |
10-170612 | Jun 1998 | JP |
Entry |
---|
“OBIC Analysis Technique by Thermo Electro-motive Force”, by Tohru Koyama, et al., ULSI Laboratory, Mitsubishi Electric Corp., pp. 2-7. |
Patent Abstract of Japan No. JP 07,192914 A, Jul. 28, 1995. |
“Nondestructive Wafer Inspection utililzing SQUIDs”, Schurig, et al., Proceedings of the Seventh International Conference on defect recognition and image processing in semiconductors. pp 149-152 XP001006353, 1998, Bristol, UK, Institute of physics Publishing, UK. |