Patent Application
20230068211
This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s).110130605 filed in Taiwan, R.O.C. on Aug. 19, 2021, the entire contents of which are hereby incorporated by reference.
The present disclosure relates to devices for transferring an electronic component, and in particular to a device adapted to transfer an electronic component and comprising a beam-splitting element. The present disclosure further relates to methods for transferring an electronic component and, more particularly, to a method adapted to transfer an electronic component and comprising the step of splitting an energy beam into at least two sub-beams.
In recent years, various electronic devices come with increasingly robust functions, thereby requiring an increasingly large number of electronic components. Furthermore, with the ongoing trend toward miniaturization of their electronic components, the electronic devices not only attain reduction of their volume which might otherwise be unnecessarily large but also meet consumer needs.
Therefore, it is important to come up with a solution to transferring electronic components precisely during an electronic device manufacturing process.
For instance, in recent years, there is a trend toward LED (light emitting diode) display units each composed of micron-scale LED chips arranged in an array so as to meet the demand for high resolution.
Transferring LED chips entails carrying out an important technique essential to a manufacturing process of LED display units. For example, a radiation ray, such as laser, is projecting onto LED chips to be transferred in order to overcome the adhesion between each LED chip and a carrier and thus enable the LED chips to separate from the carrier.
However, there is room for improvement in the accuracy and efficiency of conventional devices for transferring an electronic component and conventional methods for transferring an electronic component. Therefore, one of the important trends of development in this field is to transfer electronic components quickly and accurately.
To overcome a drawback of the conventional devices for transferring an electronic component and the conventional methods for transferring an electronic component, that is, unsatisfactory accuracy and efficiency, the present disclosure provides a novel device for transferring an electronic component and a novel method for transferring an electronic component.
In order to achieve the above and other objectives, the present disclosure provides a device for transferring an electronic component, comprising:
an energy source for projecting an energy beam;
a first frame for carrying a carrier loaded with the electronic component;
a second frame for carrying a substrate for use in receiving the electronic component, wherein the substrate faces an electronic component-loaded side of the carrier;
a beam-splitting element disposed between the first frame and the energy source and lying on a projection path of the energy beam to split and project the energy beam onto an electronic component-free side of the carrier, wherein an irradiation area is defined on the beam-splitting element and adapted to be irradiated by the energy beam, with the irradiation area having therein at least two discrete penetrable portions and a nonpenetrable portion; and a focusing apparatus disposed between the first frame and the beam-splitting element and lying on the projection path of the energy beam to focus the energy beam thus split.
Regarding the device, the energy source is a laser source.
Regarding the device, the irradiation area has therein two penetrable portions.
Regarding the device, the irradiation area has therein three penetrable portions.
The device further comprises a beam-expanding component disposed between the energy source and the beam-splitting element and adapted to expand a radial length of the energy beam projected from the energy source.
Regarding the device, the distance between the first frame and the focusing apparatus is adjustable.
In order to achieve the above and other objectives, the present disclosure provides a method for transferring an electronic component, comprising the steps of:
providing a carrier, wherein a surface of the carrier is loaded with an electronic component;
providing a substrate;
allowing a side of the substrate to face an electronic component-loaded side of the carrier, and maintaining an appropriate distance between the carrier and the substrate;
providing an energy source for projecting an energy beam;
splitting the energy beam into at least two sub-beams;
focusing the at least two sub-beams, such that projection paths of the sub-beams are not parallel to each other;
adjusting the distance between the carrier and the energy source as needed; and
irradiating appropriate points on the electronic component-free side of the carrier with the at least two sub-beams to allow the electronic component to be separated from the carrier and transferred to the substrate.
Regarding the method, the energy source is a laser source.
Regarding the method, the energy beam is split into two sub-beams.
Regarding the method, the electronic component is an LED component with a P terminal and an N terminal, both lying on the same side.
Regarding the method, the two sub-beams fall on points on a side of the carrier, respectively, and the P terminal and N terminal of the LED component are absent from the side of the carrier.
Regarding the method, the energy beam is split into three sub-beams.
Regarding the method, a beam-splitting element is placed on a projection path of the energy beam and adapted to split the energy beam, wherein the beam-splitting element has a nonpenetrable portion and at least two discrete penetrable portions falling within the scope of the irradiation by the energy beam.
Regarding the method, the electronic component is affixed to the carrier with an adhesive, and the adhesive melts after being irradiated with the sub-beams, allowing the electronic component to separate from the carrier.
The device for transferring an electronic component and the method for transferring an electronic component according to the present disclosure are effective in quickly and accurately adjusting the spacing between at least two sub-speckles formed on the carrier by the at least two sub-beams, so as to transfer electronic components accurately and thereby enhance the efficiency of manufacturing electronic devices.
A device for transferring an electronic component and a method for transferring an electronic component are provided according to the present disclosure and hereunder illustrated by specific embodiments. Persons skilled in the art can gain insight into its advantages and effects accordingly. The present disclosure can be implemented or applied in accordance with any other variant embodiments. Various modifications and changes may be made to the details described in the specification from different perspectives and for different applications without departing from the spirit of the present disclosure.
Referring to
Referring to
Referring to
In this embodiment, the device 10 for transferring an electronic component enables the two sub-beams to fall on two different points on the electronic component-free side of the carrier 121, respectively, so as to enhance the precision of transferring the electronic component 122. Therefore, the device 10 for transferring an electronic component overcomes a drawback of the prior art, that is, when an electronic component is irradiated with only one speckle, the irradiation location deviates from the center of the electronic component, causing the electronic component to rotate or rupture in the course of transferal.
In this embodiment, the energy source 11 is a laser source, but the present disclosure is not limited thereto. Persons skilled in the art may choose to use any other energy sources as needed, provided that the energy sources provide sufficient energy to enable the electronic component 122 to separate from the carrier 121.
In this embodiment, the irradiation area 141 has therein two discrete penetrable portions 142, but the present disclosure is not limited thereto. In another embodiment, the irradiation area 141 has therein three, four, five or more discrete penetrable portions in order for the energy beam to be split into three, four, five or more sub-beams.
In another preferred embodiment of the present disclosure, the device 10 for transferring an electronic component further comprises a beam-expanding component disposed between the energy source and the beam-splitting element and adapted to expand the radial length of the energy beam projected from the energy source. The preferred embodiment is not restrictive of the position of the beam-expanding component. In yet another preferred embodiment, the beam-expanding component is disposed between the energy source and the focusing apparatus, whereas the beam-splitting element is disposed in the beam-expanding component. In still yet another preferred embodiment, the beam-expanding component is disposed between the beam-splitting element and the focusing apparatus.
In this embodiment, the nonpenetrable portion 143 is of a width of 1.6 mm, but the present disclosure is not limited thereto. With the width being fixed, the distance between dual speckles formed on the carrier 121 by the two sub-beams is determined by the distance (i.e., out-of-focus distance) between the carrier 121 and the focus of the two sub-beams, so as to meet practical needs. The relationship between the out-of-focus distance and the distance between the dual speckles is evaluated with a test and shown in Table 1 below.
For instance, the electronic component 122 is an LED component whose P terminal and N terminal are on the same side and are separated by a distance of 35 μm. Thus, the distance (i.e., out-of-focus distance) between the carrier 121 and the focus of the two sub-beams is set to fall within the range of 750 μm-1000 μm. The two sub-beams fall on points of the carrier 121 (the points of the carrier 121 correspond in position to the P terminal and N terminal of the LED component), respectively, to enhance the precision of transferal of the LED component. Therefore, the device 10 for transferring an electronic component overcomes a drawback of the prior art, that is, when an LED component is irradiated with only one speckle, the irradiation location deviates from the center of the LED component, causing the LED component to rotate or rupture in the course of transferal.
In another preferred embodiment, the distance between the focusing apparatus and the first frame in the device for transferring an electronic component according to the present disclosure is adjustable. Specifically speaking, the first frame is driven with a driving apparatus, such that the distance between the first frame and the focusing apparatus is adjusted, so as to adjust the distance between the dual speckles formed on the carrier by the two sub-beams and thereby meet practical needs.
In another preferred embodiment, the beam-splitting element is a beam-splitting disk. A plurality of irradiation areas are defined on the beam-splitting disk and adapted to be irradiated by the energy beam. The irradiation areas are equidistant from the center of the beam-splitting disk. The nonpenetrable portions in the irradiation areas are of different widths. In this preferred embodiment, the device for transferring an electronic component is advantageous in that the beam-splitting disk is rotated to allow the energy beam to fall on different irradiation areas, such that the difference in the width of the nonpenetrable portions between the irradiation areas facilitates the adjustment of the distance between the dual speckles formed on the carrier by the two sub-beams, so as to meet practical needs.
Referring to
The method of embodiment 2 is implemented with the device of embodiment 1 without placing any limitations on the present disclosure.
In this embodiment, the energy source is a laser source, but the present disclosure is not limited thereto. Persons skilled in the art may choose to use any other energy sources as needed, provided that the energy sources provide sufficient energy to enable the electronic component to separate from the carrier.
In this embodiment, the energy beam is split into two sub-beams, but the present disclosure is not limited thereto. Persons skilled in the art may allow the energy beam to split into three, four, five or more sub-beams as needed.
The method of embodiment 2 enables the two sub-beams to fall on different points on the electronic component-free side of the carrier, respectively, to enhance the precision of transferring the electronic component. Therefore, the method of embodiment 2 overcomes a drawback of the prior art, that is, when an electronic component is irradiated with only one speckle, the irradiation location deviates from the center of the electronic component, causing the electronic component to rotate or rupture in the course of transferal.
In a preferred embodiment, the electronic component is an LED component whose P terminal and N terminal lie on the same side to allow the two sub-beams to fall on two points on one side of the carrier (the side of the carrier faces away from the P terminal and N terminal of the LED component), respectively, to enhance the precision of transferring the LED component. Therefore, the method of this preferred embodiment overcomes a drawback of the prior art, that is, when an LED component is irradiated with only one speckle, the irradiation location deviates from the center of the LED component, causing the LED component to rotate or rupture in the course of transferal.
In a preferred embodiment, a beam-splitting element is placed on a projection path of the energy beam to split the energy beam. The beam-splitting element has a nonpenetrable portion and the at least two discrete penetrable portions falling within the scope of the irradiation by the energy beam, but the present disclosure is not limited thereto.
In a preferred embodiment, the electronic component is affixed to the carrier with an adhesive. After being irradiated with the sub-beams, the adhesive melts to enable separation of the electronic component from the carrier, but the present disclosure is not limited thereto.
In conclusion, a device for transferring an electronic component and a method for transferring an electronic component according to the present disclosure are effective in quickly and accurately adjusting the spacing between at least two sub-speckles formed on the carrier by the at least two sub-beams and accurately transferring an electronic component (for example, LED component), so as to enhance the efficiency of manufacturing electronic devices (for example, LED display units).
The embodiments are illustrative rather than restrictive of the present disclosure. Thus, modifications and changes may be made by persons skilled in the art to the embodiments without departing from the spirit and scope of the present disclosure. Accordingly, the legal protection for the present disclosure shall be defined by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 110130605 | Aug 2021 | TW | national |
