for modifying or reforming the material inside the workpiece

Industry

CPC
B23K26/53

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K26/00Working by laser beam

Current Industry

B23K26/53for modifying or reforming the material inside the workpiece

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for treating an internal defect in a part
- Patent number 12,168,267
- Issue date Dec 17, 2024
- SAFRAN AIRCRAFT ENGINES
- Hugo Jean-Louis Sistach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing wafers with modification lines of defined orie...
- Patent number 12,159,805
- Issue date Dec 3, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device
- Patent number 12,157,187
- Issue date Dec 3, 2024
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for applying pressure to stress-producing layers...
- Patent number 12,151,314
- Issue date Nov 26, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser annealing method, laser annealing device, and crystallized si...
- Patent number 12,148,616
- Issue date Nov 19, 2024
- V. Technology Co., Ltd.
- Jun Gotoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for laser cleaving diamonds
- Patent number 12,145,216
- Issue date Nov 19, 2024
- The Trustees of the University of Pennsylvania
- Lee Bassett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and wafer-attached structure
- Patent number 12,148,667
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser annealing
- Patent number 12,148,615
- Issue date Nov 19, 2024
- Coherent Lasersystems GmbH & Co. KG
- Paul Van Der Wilt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing method, and laser processing device
- Patent number 12,128,498
- Issue date Oct 29, 2024
- Hamamatsu Photonics K.K.
- Takafumi Ogiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating a glass element and glass sub-element
- Patent number 12,110,247
- Issue date Oct 8, 2024
- Schott AG
- David Sohr
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 12,106,967
- Issue date Oct 1, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dicing wafer forming modified layer in chucked wafer
- Patent number 12,107,009
- Issue date Oct 1, 2024
- SK HYNIX INC.
- Min Gyu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus and processing method
- Patent number 12,103,111
- Issue date Oct 1, 2024
- Tokyo Electron Limited
- Yohei Yamashita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method and wafer producing apparatus
- Patent number 12,097,642
- Issue date Sep 24, 2024
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for cutting structure composed of brittle material
- Patent number 12,098,087
- Issue date Sep 24, 2024
- Meere Company Inc.
- Joon Jung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser slicing apparatus and laser slicing method
- Patent number 12,090,574
- Issue date Sep 17, 2024
- Panasonic Holdings Corporation
- Kazuki Fujiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing glass substrate and method for manufacturi...
- Patent number 12,084,376
- Issue date Sep 10, 2024
- Hoya Corporation
- Shuhei Azuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,087,588
- Issue date Sep 10, 2024
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,076,820
- Issue date Sep 3, 2024
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing disk-shaped glass blank and method for man...
- Patent number 12,077,465
- Issue date Sep 3, 2024
- Hoya Corporation
- Shuhei Azuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus and processing method
- Patent number 12,070,820
- Issue date Aug 27, 2024
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 12,062,533
- Issue date Aug 13, 2024
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for laser processing rough transparent workpieces using pul...
- Patent number 12,054,415
- Issue date Aug 6, 2024
- Corning Incorporated
- Elisabeth Johanna Rosier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece cutting method
- Patent number 12,042,882
- Issue date Jul 23, 2024
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for laser-assisted separation of a portion from a...
- Patent number 12,037,279
- Issue date Jul 16, 2024
- Schott AG
- Fabian Wagner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating wafers from donor substrates
- Patent number 12,030,216
- Issue date Jul 9, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing device
- Patent number 12,030,136
- Issue date Jul 9, 2024
- Hamamatsu Photonics K.K.
- Yasunaga Nara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass plate production method, glass plate, glass article productio...
- Patent number 12,030,803
- Issue date Jul 9, 2024
- AGC Inc.
- Jun Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection device and inspection method
- Patent number 12,023,761
- Issue date Jul 2, 2024
- Hamamatsu Photonics K.K.
- Iku Sano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240416450
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Kazuya HISANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING METHOD AND PROCESSING APPARATUS
- Publication number 20240408697
- Publication date Dec 12, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD AND CHAMFER REMOVING APPARATUS
- Publication number 20240399494
- Publication date Dec 5, 2024
- Disco Corporation
- Kazuya HIRATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISK-SHAPED GLASS PLATE, METHOD FOR MANUFACTURING DISK-SHAPED GLASS...
- Publication number 20240400435
- Publication date Dec 5, 2024
- HOYA CORPORATION
- Shuhei AZUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WAFER
- Publication number 20240399509
- Publication date Dec 5, 2024
- Disco Corporation
- Kazuki MORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A GLASS ELEMENT AND GLASS SUB-ELEMENT
- Publication number 20240391817
- Publication date Nov 28, 2024
- SCHOTT AG
- David Sohr
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SUBSTRATE FOR LASER LIFT-OFF, SUBSTRATE PROCESSING METHOD,...
- Publication number 20240387176
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Noboru OOIKE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20240367266
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CHIPS
- Publication number 20240342835
- Publication date Oct 17, 2024
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING METHOD
- Publication number 20240326174
- Publication date Oct 3, 2024
- DENSO CORPORATION
- Koichiro YASUDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CUTTING A PANEL MADE OF LAMINATED GLASS
- Publication number 20240326173
- Publication date Oct 3, 2024
- SAINT-GOBAIN GLASS FRANCE
- Cécile OZANAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...
- Publication number 20240308200
- Publication date Sep 19, 2024
- Skiileux Electricity Inc.
- SHENG-HSIANG YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240304457
- Publication date Sep 12, 2024
- Disco Corporation
- Hayato TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240297052
- Publication date Sep 5, 2024
- Disco Corporation
- Hayato TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20240261891
- Publication date Aug 8, 2024
- TOKYO SEIMITSU CO., LTD.
- Yusuke ARAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS PANEL PROCESSING METHOD
- Publication number 20240261904
- Publication date Aug 8, 2024
- JOONGWOO NARA CO.,LTD.
- Sung Soo PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR LASER PROCESSING A TRANSPARENT MATERIAL
- Publication number 20240261893
- Publication date Aug 8, 2024
- Rofin-Sinar Technologies LLC
- S. Abbas HOSSEINI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING OPTOELECTRONIC COMPONENTS, AND OPTOELECTRO...
- Publication number 20240258764
- Publication date Aug 1, 2024
- ams-OSRAM International GmbH
- Markus Keidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20240258134
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Masayuki NISHIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240253164
- Publication date Aug 1, 2024
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING APPARATUS AND LASER MACHINING METHOD
- Publication number 20240238897
- Publication date Jul 18, 2024
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENTS MADE OF GLASS OR GLASS CERAMIC HAVING PREDAMAGE ALONG PR...
- Publication number 20240239701
- Publication date Jul 18, 2024
- SCHOTT AG
- Jens Ulrich THOMAS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DIVIDING WORKPIECES COMPOSED OF BRITTLE-HARD MATERIALS A...
- Publication number 20240227084
- Publication date Jul 11, 2024
- SCHOTT AG
- Fabian Wagner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20240207978
- Publication date Jun 27, 2024
- Hamamatsu Photonics K.K.
- Takafumi OGIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ANNEALING APPARATUS AND LASER ANNEALING METHOD
- Publication number 20240207977
- Publication date Jun 27, 2024
- APS Research Corporation
- Seung Hwan KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER CUT GLASS SHEETS FOR ELECTRICALLY CONTROLLABLE OPTICALLY ACTI...
- Publication number 20240198458
- Publication date Jun 20, 2024
- CARDINAL IG COMPANY
- Andrew DeMiglio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
- Publication number 20240189940
- Publication date Jun 13, 2024
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING RING STRUCTURES
- Publication number 20240174543
- Publication date May 30, 2024
- Corning Incorporated
- Maximilian Joachim Gustav Breitwieser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20240178000
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Jesung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELE...
- Publication number 20240178066
- Publication date May 30, 2024
- Nichia Corporation.
- Kazuki YAMAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

for modifying or reforming the material inside the workpiece

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for treating an internal defect in a part

Method for producing wafers with modification lines of defined orie...

Laser machining device

Device and method for applying pressure to stress-producing layers...

Laser annealing method, laser annealing device, and crystallized si...

Systems and methods for laser cleaving diamonds

Semiconductor device manufacturing method and wafer-attached structure

Method and apparatus for laser annealing

Laser processing method, and laser processing device

Method for separating a glass element and glass sub-element

Wafer producing method

Method of dicing wafer forming modified layer in chucked wafer

Processing apparatus and processing method

Wafer producing method and wafer producing apparatus

Method for forming a crack in an edge region of a donor substrate

Method and device for cutting structure composed of brittle material

Laser slicing apparatus and laser slicing method

Method for manufacturing glass substrate and method for manufacturi...

Substrate processing apparatus and substrate processing method

Substrate processing apparatus and substrate processing method

Method for manufacturing disk-shaped glass blank and method for man...

Processing apparatus and processing method

Method of producing a substrate and system for producing a substrate

Methods for laser processing rough transparent workpieces using pul...

Workpiece cutting method

Method and device for laser-assisted separation of a portion from a...

Method for separating wafers from donor substrates

Processing device

Glass plate production method, glass plate, glass article productio...

Inspection device and inspection method

Patents Applicationslast 30 patents

PROCESSING METHOD AND PROCESSING SYSTEM

WAFER MANUFACTURING METHOD AND PROCESSING APPARATUS

WAFER PROCESSING METHOD AND CHAMFER REMOVING APPARATUS

DISK-SHAPED GLASS PLATE, METHOD FOR MANUFACTURING DISK-SHAPED GLASS...

METHOD OF MANUFACTURING WAFER

METHOD FOR SEPARATING A GLASS ELEMENT AND GLASS SUB-ELEMENT

STACKED SUBSTRATE FOR LASER LIFT-OFF, SUBSTRATE PROCESSING METHOD,...

PROCESSING APPARATUS AND PROCESSING METHOD

METHOD FOR MANUFACTURING CHIPS

WAFER MANUFACTURING METHOD

METHOD FOR CUTTING A PANEL MADE OF LAMINATED GLASS

DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...

PROCESSING METHOD OF BONDED WAFER

PROCESSING METHOD OF BONDED WAFER

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

GLASS PANEL PROCESSING METHOD

METHOD FOR LASER PROCESSING A TRANSPARENT MATERIAL

METHOD FOR MANUFACTURING OPTOELECTRONIC COMPONENTS, AND OPTOELECTRO...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...

WAFER PROCESSING METHOD

LASER MACHINING APPARATUS AND LASER MACHINING METHOD

COMPONENTS MADE OF GLASS OR GLASS CERAMIC HAVING PREDAMAGE ALONG PR...

METHOD FOR DIVIDING WORKPIECES COMPOSED OF BRITTLE-HARD MATERIALS A...

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASER ANNEALING APPARATUS AND LASER ANNEALING METHOD

LASER CUT GLASS SHEETS FOR ELECTRICALLY CONTROLLABLE OPTICALLY ACTI...

LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL

SYSTEMS AND METHODS FOR FABRICATING RING STRUCTURES

WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...

METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELE...