TREA

for modifying or reforming the material inside the workpiece

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Industry

  • CPC
  • B23K26/53
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K26/00Working by laser beam

Current Industry

B23K26/53for modifying or reforming the material inside the workpiece
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20250239468
    • Publication date Jul 24, 2025
    • Disco Corporation
    • Akira MIZUTANI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIE CLEANING SYSTEMS AND RELATED METHODS
    • Publication number 20250233021
    • Publication date Jul 17, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Michael J. SEDDON
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20250226242
    • Publication date Jul 10, 2025
    • Disco Corporation
    • Akira MIZUTANI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEPARATION START POINT FORMING METHOD AND SEPARATION METHOD
    • Publication number 20250205826
    • Publication date Jun 26, 2025
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF WAFER
    • Publication number 20250187230
    • Publication date Jun 12, 2025
    • Disco Corporation
    • Asahi NOMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...
    • Publication number 20250174473
    • Publication date May 29, 2025
    • YAMAHA HATSUDOKI KABUSHIKI KAISHA
    • Yoshikuni SUZUKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD AND PROCESSING SYSTEM
    • Publication number 20250153278
    • Publication date May 15, 2025
    • TOKYO ELECTRON LIMITED
    • Yohei YAMASHITA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING SUBSTRATE
    • Publication number 20250144747
    • Publication date May 8, 2025
    • Disco Corporation
    • Yuya SETO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIE CLEANING SYSTEMS AND RELATED METHODS
    • Publication number 20250149386
    • Publication date May 8, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Michael J. SEDDON
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20250140613
    • Publication date May 1, 2025
    • Disco Corporation
    • Tsubasa HIROSE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING DEVICE AND METHOD
    • Publication number 20250135585
    • Publication date May 1, 2025
    • Industrial Technology Research Institute
    • Pin-Hao HU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE FOR TRANSFERRING AND METHOD
    • Publication number 20250135568
    • Publication date May 1, 2025
    • ams-OSRAM International GmbH
    • Thomas Schwarz
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD, SUBSTRATE MANUFACTURING METHOD, AND LASER...
    • Publication number 20250114875
    • Publication date Apr 10, 2025
    • Disco Corporation
    • Yuki OGAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER MACHINING DEVICE AND LASER OUTPUT DEVICE
    • Publication number 20250108455
    • Publication date Apr 3, 2025
    • HAMMATSU PHOTONICS K.K.
    • Junji OKUMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER
    • Publication number 20250108459
    • Publication date Apr 3, 2025
    • Intel Corporation
    • Andrey Vyatskikh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PROCESSING WORKPIECE
    • Publication number 20250112048
    • Publication date Apr 3, 2025
    • Disco Corporation
    • Atsushi MAEDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MACHINING CONDITION ACQUISITION METHOD AND LASER MACHINING DEVICE
    • Publication number 20250100085
    • Publication date Mar 27, 2025
    • Hamamatsu Photonics K.K.
    • Yo SUGIMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHODS FOR LASER FORMING TRANSPARENT ARTICLES FROM A TRANSPARENT M...
    • Publication number 20250100921
    • Publication date Mar 27, 2025
    • Corning Incorporated
    • Alejandro Antonio Becker
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
    • Publication number 20250095995
    • Publication date Mar 20, 2025
    • TOKYO ELECTRON LIMITED
    • Hayato TANOUE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER MACHINING DEVICE
    • Publication number 20250091164
    • Publication date Mar 20, 2025
    • HAMAMATSU PHOTONICS K. K.
    • Takeshi SAKAMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR THE LASER MACHINING OF A WORKPIECE
    • Publication number 20250083260
    • Publication date Mar 13, 2025
    • TRUMPF (China) Co., Ltd.
    • Feng Feng
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20250073820
    • Publication date Mar 6, 2025
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20250073821
    • Publication date Mar 6, 2025
    • Disco Corporation
    • Akira MIZUTANI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICRO-PROCESSING DEVICE AND METHOD USING LASER
    • Publication number 20250074811
    • Publication date Mar 6, 2025
    • ITI CO., LTD.
    • Seak Joon LEE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
    • Publication number 20250079150
    • Publication date Mar 6, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Tung Wu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser Machining a Transparent Workpiece
    • Publication number 20250058406
    • Publication date Feb 20, 2025
    • TRELLEBORG SEALING PROFILES GERMANY GMBH
    • Klaus Bergner
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD
    • Publication number 20250050454
    • Publication date Feb 13, 2025
    • Hamamatsu Photonics K.K.
    • Takeshi SAKAMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD AND APPARATUS FOR LASER ANNEALING
    • Publication number 20250054756
    • Publication date Feb 13, 2025
    • COHERENT LASERSYSTEMS GMBH & CO. KG
    • Paul VAN DER WILT
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
    • Publication number 20250046657
    • Publication date Feb 6, 2025
    • ROHM CO., LTD.
    • Masatoshi AKETA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER SLICING APPARATUS
    • Publication number 20250041975
    • Publication date Feb 6, 2025
    • Industrial Technology Research Institute
    • Jyun-Jhih WANG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR