Claims
- 1. An integrated circuit structure, comprising:at least two metal interconnect lines; a liner comprising silicon boron-carbide located on and between said metal interconnect lines; and a dielectric layer positioned between said metal interconnect lines, the liner positioned between at least a portion of the dielectric layer and the metal interconnect lines.
- 2. The integrated circuit structure of claim 1, wherein the dielectric layer comprises an intralevel dielectric layer positioned between metal interconnect lines in a level of the integrated circuit structure.
- 3. The integrated circuit structure of claim 1, wherein the dielectric layer comprises an interlevel dielectric layer positioned between conductive elements in different levels of the integrated circuit structure.
- 4. The integrated circuit structure of claim 1, wherein the dielectric layer comprises a fluorinated dielectric material.
- 5. The integrated circuit structure of claim 1, wherein the dielectric layer comprises polytetraflouroethylene (PTFE).
- 6. An integrated circuit structure, comprising:at least two metal interconnect lines; a liner comprising silicon oxy-carbide located on and between said metal interconnect lines; and a dielectric layer positioned between said metal interconnect lines, the liner positioned between at least a portion of the dielectric layer and the metal interconnect lines.
- 7. The integrated circuit structure of claim 6, wherein the dielectric layer comprises an intralevel dielectric layer positioned between metal interconnect lines in a level of the integrated circuit structure.
- 8. The integrated circuit structure of claim 6, wherein the dielectric layer comprises an interlevel dielectric layer positioned between conductive elements in different levels of the integrated circuit structure.
- 9. The integrated circuit structure of claim 6, wherein the dielectric layer comprises a fluorinated dielectric material.
- 10. The integrated circuit structure of claim 6, wherein the dielectric layer comprises polytetraflouroethylene (PTFE).
Parent Case Info
This application claims priority under 35 USC § 119(e)(1) of provisional application No. 60/228,912 filed Aug. 29, 2000.
US Referenced Citations (16)
Provisional Applications (1)
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Number |
Date |
Country |
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60/228912 |
Aug 2000 |
US |