Capacitive arrangements or effects of, or between wiring layers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5222Capacitive arrangements or effects of, or between wiring layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Nitride semiconductor device
- Patent number 12,356,692
- Issue date Jul 8, 2025
- Kabushiki Kaisha Toshiba
- Akira Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,356,707
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap through at least two metal layers
- Patent number 12,341,058
- Issue date Jun 24, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wei-Hui Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure and a semiconductor
- Patent number 12,324,148
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high density, high shorting margin, and low capac...
- Patent number 12,322,699
- Issue date Jun 3, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and methods of manufacturing the same
- Patent number 12,322,745
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated with passive devices and manufacturing method...
- Patent number 12,322,669
- Issue date Jun 3, 2025
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Chuncheng Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures including air gaps
- Patent number 12,308,286
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned conductive features
- Patent number 12,300,600
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,300,537
- Issue date May 13, 2025
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with an etch-stop layer forming a cavity
- Patent number 12,266,565
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,261,109
- Issue date Mar 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kun Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a low-k dielectric with pillar-type air-gaps
- Patent number 12,261,121
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap structures for high speed signal integrity
- Patent number 12,255,130
- Issue date Mar 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,230,538
- Issue date Feb 18, 2025
- Kioxia Corporation
- Shinya Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local density control for metal capacitance reduction
- Patent number 12,230,577
- Issue date Feb 18, 2025
- Intel Corporation
- Burak Baylav
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,738
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,211,796
- Issue date Jan 28, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 12,211,784
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,205,883
- Issue date Jan 21, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Zhi Lin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing same
- Patent number 12,199,028
- Issue date Jan 14, 2025
- Rohm Co., Ltd.
- Minoru Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 12,176,214
- Issue date Dec 24, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,154,875
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having air gap structures integrated with i...
- Patent number 12,148,690
- Issue date Nov 19, 2024
- Tahoe Research, LTD.
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a capacitor
- Patent number 12,142,559
- Issue date Nov 12, 2024
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,558
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Naoya Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device and integrated passive device comprising magnetic...
- Patent number 12,142,561
- Issue date Nov 12, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250226336
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...
- Publication number 20250191995
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH CAVITY STRUCTURE
- Publication number 20250191971
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20250167102
- Publication date May 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20250167101
- Publication date May 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL DENSITY CONTROL FOR METAL CAPACITANCE REDUCTION
- Publication number 20250149459
- Publication date May 8, 2025
- Intel Corporation
- Burak Baylav
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250132259
- Publication date Apr 24, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRACKING SCHEME CIRCUIT OF MEMORY DEVICE AND METHODS FOR OPERATING...
- Publication number 20250118361
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ying Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118596
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250107163
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Kazuyuki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20250096110
- Publication date Mar 20, 2025
- ROHM CO., LTD.
- Minoru AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES
- Publication number 20250096139
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES HAVING AIR GAP STRUCTURES INTEGRATED WITH I...
- Publication number 20250079292
- Publication date Mar 6, 2025
- Tahoe Research, Ltd.
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...
- Publication number 20250070014
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...
- Publication number 20250070015
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250046738
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR
- Publication number 20250029916
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL METAL SPLITTING USING HELMETS AND WRAP-AROUND DIELECTRIC S...
- Publication number 20250029915
- Publication date Jan 23, 2025
- Intel Corporation
- Leonard P. Guler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Structure And Method For Fabricating The Same
- Publication number 20250022749
- Publication date Jan 16, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jun WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015046
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250006625
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION
- Publication number 20250006626
- Publication date Jan 2, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Didier BELOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240387352
- Publication date Nov 21, 2024
- LITE-ON SINGAPORE PTE. LTD.
- YOU-FA WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using A Self-Assembly Layer To Facilitate Selective Formation of An...
- Publication number 20240321573
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...
- Publication number 20240312931
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
- Publication number 20240282624
- Publication date Aug 22, 2024
- Intel Corporation
- Sean KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240274466
- Publication date Aug 15, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yichao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL
- Publication number 20240274529
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Klaas De Haan
- H01 - BASIC ELECTRIC ELEMENTS

Capacitive arrangements or effects of, or between wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nitride semiconductor device

Semiconductor device

Air gap through at least two metal layers

Semiconductor device with discrete blocks

Method for forming semiconductor structure and a semiconductor

Method of forming high density, high shorting margin, and low capac...

Integrated circuit devices and methods of manufacturing the same

Substrate integrated with passive devices and manufacturing method...

Interconnect structures including air gaps

Semiconductor device with self-aligned conductive features

Conformal low temperature hermetic dielectric diffusion barriers

Integrated chip with an etch-stop layer forming a cavity

Semiconductor structure

Structure and method for a low-k dielectric with pillar-type air-gaps

Airgap structures for high speed signal integrity

Reducing RC delay in semiconductor devices

Semiconductor device and method of manufacturing the same

Local density control for metal capacitance reduction

Semiconductor structure and manufacturing method thereof

Microelectronic assemblies having topside power delivery structures

SOI substrate and related methods

Semiconductor structure and fabrication method thereof

Semiconductor device and method for producing same

Selective metal removal for conductive interconnects in integrated...

Method of forming an interconnect structure having an air gap and s...

Package and method of fabricating the same

Microelectronic devices having air gap structures integrated with i...

Semiconductor device comprising a capacitor

Semiconductor device

Integrated device and integrated passive device comprising magnetic...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...

INTEGRATED CHIP WITH CAVITY STRUCTURE

SOI SUBSTRATE AND RELATED METHODS

SOI SUBSTRATE AND RELATED METHODS

LOCAL DENSITY CONTROL FOR METAL CAPACITANCE REDUCTION

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

TRACKING SCHEME CIRCUIT OF MEMORY DEVICE AND METHODS FOR OPERATING...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES

MICROELECTRONIC DEVICES HAVING AIR GAP STRUCTURES INTEGRATED WITH I...

SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...

PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR

VERTICAL METAL SPLITTING USING HELMETS AND WRAP-AROUND DIELECTRIC S...

Semiconductor Structure And Method For Fabricating The Same

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION

CAPACITIVE COUPLING PACKAGE STRUCTURE

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

Using A Self-Assembly Layer To Facilitate Selective Formation of An...

SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...

CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL