Capacitive arrangements or effects of, or between wiring layers

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H01L23/5222

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5222Capacitive arrangements or effects of, or between wiring layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,154,875
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having air gap structures integrated with i...
- Patent number 12,148,690
- Issue date Nov 19, 2024
- Tahoe Research, LTD.
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a capacitor
- Patent number 12,142,559
- Issue date Nov 12, 2024
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,558
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Naoya Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device and integrated passive device comprising magnetic...
- Patent number 12,142,561
- Issue date Nov 12, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical metal splitting using helmets and wrap-around dielectric s...
- Patent number 12,131,989
- Issue date Oct 29, 2024
- Intel Corporation
- Leonard P. Guler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with integrated decoupling and alignment features
- Patent number 12,113,028
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating semiconductor device
- Patent number 12,112,981
- Issue date Oct 8, 2024
- United Microelectronics Corp.
- Zhi-Biao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cut optimization for standard cells
- Patent number 12,106,033
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheok-Kei Lei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual circuit digital isolator
- Patent number 12,068,237
- Issue date Aug 20, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Sundar Chetlur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line structure and method
- Patent number 12,051,646
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with reduced capacitances
- Patent number 12,046,506
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,040,226
- Issue date Jul 16, 2024
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant inductive-capacitive isolated data channel
- Patent number 12,033,936
- Issue date Jul 9, 2024
- Texas Instruments Incorporated
- Klaas De Haan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including guard ring structure and three-dimensio...
- Patent number 12,027,475
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL etch stop layer without capacitance penalty
- Patent number 12,027,416
- Issue date Jul 2, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a self-assembly layer to facilitate selective formation of an...
- Patent number 12,009,202
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,996,391
- Issue date May 28, 2024
- MediaTek Singapore Pte Ltd.
- Zhigang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer overlying dielectric structure to increase reliability
- Patent number 11,990,400
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,984,444
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with suppression of decrease of withstand volt...
- Patent number 11,984,502
- Issue date May 14, 2024
- Rohm Co., Ltd.
- Takeshi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing capacitor stru...
- Patent number 11,978,764
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Kuang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 11,961,798
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,948,879
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 11,948,880
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning for integrated circuits
- Patent number 11,942,424
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and methods of manufacturing the same
- Patent number 11,929,393
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor array structure and method for forming the same
- Patent number 11,925,012
- Issue date Mar 5, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chaojun Sheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240387352
- Publication date Nov 21, 2024
- LITE-ON SINGAPORE PTE. LTD.
- YOU-FA WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using A Self-Assembly Layer To Facilitate Selective Formation of An...
- Publication number 20240321573
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...
- Publication number 20240312931
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
- Publication number 20240282624
- Publication date Aug 22, 2024
- Intel Corporation
- Sean KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240274466
- Publication date Aug 15, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yichao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL
- Publication number 20240274529
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Klaas De Haan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING LAYER OVERLYING DIELECTRIC STRUCTURE TO INCREASE RELIABILITY
- Publication number 20240274524
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Forming Semiconductor Structure And A Semiconductor
- Publication number 20240268104
- Publication date Aug 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240258305
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUNG-HUI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240250017
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240234295
- Publication date Jul 11, 2024
- MEDIATEK INC.
- Shi-Bai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT WITH METAL-INSULATOR-METAL CAPACITOR ASSEMBLY
- Publication number 20240222260
- Publication date Jul 4, 2024
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240203785
- Publication date Jun 20, 2024
- United Microelectronics Corp.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20240203864
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark GRISWOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240186369
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD...
- Publication number 20240153871
- Publication date May 9, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhanfeng CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20240145406
- Publication date May 2, 2024
- Rohm Co., Ltd.
- Takatsugu WACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD...
- Publication number 20240145321
- Publication date May 2, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Chuncheng CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240136275
- Publication date Apr 25, 2024
- MEDIATEK INC.
- Shi-Bai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20240113080
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES
- Publication number 20240105574
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- M. Ataul Karim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS
- Publication number 20240105582
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES
- Publication number 20240079318
- Publication date Mar 7, 2024
- Western Digital Technologies, Inc.
- Md. Sayed Mobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240063126
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Chen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH REDUCED CAPACITANCES
- Publication number 20240021468
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED...
- Publication number 20240021608
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTION STRUCTURE
- Publication number 20240014068
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Yanghee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR
- Publication number 20240006303
- Publication date Jan 4, 2024
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND MEDICAL DEVICE INCLUDING SAME
- Publication number 20230420383
- Publication date Dec 28, 2023
- Medtronic, Inc.
- Randolph E. Crutchfield
- H01 - BASIC ELECTRIC ELEMENTS

Capacitive arrangements or effects of, or between wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming an interconnect structure having an air gap and s...

Package and method of fabricating the same

Microelectronic devices having air gap structures integrated with i...

Semiconductor device comprising a capacitor

Semiconductor device

Integrated device and integrated passive device comprising magnetic...

Vertical metal splitting using helmets and wrap-around dielectric s...

Semiconductor device with integrated decoupling and alignment features

Semiconductor device and method for fabricating semiconductor device

Metal cut optimization for standard cells

Dual circuit digital isolator

Metal line structure and method

Devices with reduced capacitances

Conformal low temperature hermetic dielectric diffusion barriers

Resonant inductive-capacitive isolated data channel

Semiconductor die including guard ring structure and three-dimensio...

BEOL etch stop layer without capacitance penalty

Using a self-assembly layer to facilitate selective formation of an...

Semiconductor structure

Capping layer overlying dielectric structure to increase reliability

Semiconductor device and method of manufacturing the same

Semiconductor device with suppression of decrease of withstand volt...

Semiconductor structure and method for manufacturing capacitor stru...

Semiconductor structure and method for manufacturing semiconductor...

Etch damage and ESL free dual damascene metal interconnect

Semiconductor device structure and methods of forming the same

SOI substrate and related methods

Via patterning for integrated circuits

Integrated circuit devices and methods of manufacturing the same

Capacitor array structure and method for forming the same

Patents Applicationslast 30 patents

CAPACITIVE COUPLING PACKAGE STRUCTURE

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

Using A Self-Assembly Layer To Facilitate Selective Formation of An...

SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...

CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL

CAPPING LAYER OVERLYING DIELECTRIC STRUCTURE TO INCREASE RELIABILITY

Method For Forming Semiconductor Structure And A Semiconductor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR COMPONENT WITH METAL-INSULATOR-METAL CAPACITOR ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SOI SUBSTRATE AND RELATED METHODS

INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME

SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD...

SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE

SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE STRUCTURE

Semiconductor Device with Discrete Blocks

REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES

LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS

NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

DEVICES WITH REDUCED CAPACITANCES

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED...

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTION STRUCTURE

SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR

INTEGRATED CIRCUIT PACKAGE AND MEDICAL DEVICE INCLUDING SAME