Insulating materials

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H01L23/5329

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5329Insulating materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enlarging contact area and process window for a contact via
- Patent number 12,266,563
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with an etch-stop layer forming a cavity
- Patent number 12,266,565
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with composite isolation feature and meth...
- Patent number 12,261,118
- Issue date Mar 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with impurity doped o...
- Patent number 12,261,119
- Issue date Mar 25, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi Koezuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a low-k dielectric with pillar-type air-gaps
- Patent number 12,261,121
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,255,139
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with composite isolation feature and meth...
- Patent number 12,255,146
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing having the con...
- Patent number 12,255,136
- Issue date Mar 18, 2025
- Macronix International Co., Ltd.
- Cheng-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including composite pad structures on stair...
- Patent number 12,255,143
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,255,064
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap structure for interconnect dielectrics and methods of fabrication
- Patent number 12,249,577
- Issue date Mar 11, 2025
- Intel Corporation
- Shashi Vyas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with air gap in pattern- dense region and m...
- Patent number 12,249,512
- Issue date Mar 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,249,548
- Issue date Mar 11, 2025
- SK Hynix Inc.
- Sang Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with porous dielectric layers and method for f...
- Patent number 12,243,817
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory structure with air gaps and method for preparing th...
- Patent number 12,245,431
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Yuan-Yuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,245,437
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional vertical nor flash thin-film transistor strings
- Patent number 12,245,430
- Issue date Mar 4, 2025
- SUNRISE MEMORY CORPORATION
- Eli Harari
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,237,013
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising multilevel bitlines, and related meth...
- Patent number 12,237,259
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 12,237,368
- Issue date Feb 25, 2025
- Adeia Semiconductor Solutions LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures using directed self-assembly fo...
- Patent number 12,237,223
- Issue date Feb 25, 2025
- Intel Corporation
- Paul A. Nyhus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,230,538
- Issue date Feb 18, 2025
- Kioxia Corporation
- Shinya Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packaging with ball attach before repassivation
- Patent number 12,230,539
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap spacer formation for nano-scale semiconductor devices
- Patent number 12,224,203
- Issue date Feb 11, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,204
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Nan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 12,224,205
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO IMPROVE INTERCONNECT STRUCTURES IN INTEGRA...
- Publication number 20250112145
- Publication date Apr 3, 2025
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH THICK CONDUCTIVE STAIRCASED STEPS FOR 3...
- Publication number 20250112151
- Publication date Apr 3, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FILLING METHOD
- Publication number 20250105060
- Publication date Mar 27, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zhiqi YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING DECOUPLING CAPACITORS
- Publication number 20250105138
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Xuan Huang
- G11 - INFORMATION STORAGE
Information Patent Application
RADIO FREQUENCY INDUCTOR
- Publication number 20250105142
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Bo-Yu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
- Publication number 20250105154
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Giyoung JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20250105148
- Publication date Mar 27, 2025
- Intel Corporation
- Marvin PAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC CAP STRUCTURE IN SEMICONDUCTOR DEVICES AND METHODS OF MA...
- Publication number 20250096043
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECT ELEVATOR BASED ON THROUGH SILICON VIAS
- Publication number 20250096131
- Publication date Mar 20, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096038
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER FABRICATION WITH EXPOSURE DEFINED GRAPHENE FEAT...
- Publication number 20250096039
- Publication date Mar 20, 2025
- NXP USA, Inc.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250098270
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Che CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087579
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sanghyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Chip Comprising Backside Power Delivery Network and 3D Stacked N...
- Publication number 20250081600
- Publication date Mar 6, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250079315
- Publication date Mar 6, 2025
- WINBOND ELECTRONICS CORP.
- Jian-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20250079317
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Changyeon SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH
- Publication number 20250079359
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jeong Wan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ISOLATION STRUCTURE AND CONTACT ETCH STOP...
- Publication number 20250079316
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES HAVING AIR GAP STRUCTURES INTEGRATED WITH I...
- Publication number 20250079292
- Publication date Mar 6, 2025
- Tahoe Research, Ltd.
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250079306
- Publication date Mar 6, 2025
- KIOXIA Corporation
- Megumi ISHIDUKI
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...
- Publication number 20250070028
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070002
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kyungtae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20250069951
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...
- Publication number 20250072001
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hanbyeol LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...
- Publication number 20250070014
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20250070020
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070023
- Publication date Feb 27, 2025
- KIOXIA Corporation
- Hisashi KATO
- G11 - INFORMATION STORAGE

Insulating materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and methods of manufacture

Enlarging contact area and process window for a contact via

Integrated chip with an etch-stop layer forming a cavity

Interconnection structure with composite isolation feature and meth...

Method for manufacturing semiconductor device with impurity doped o...

Structure and method for a low-k dielectric with pillar-type air-gaps

Multi-layer line structure

Semiconductor devices

Trench contact structures for advanced integrated circuit structure...

Interconnection structure with composite isolation feature and meth...

Semiconductor structure and method for manufacturing having the con...

Microelectronic devices including composite pad structures on stair...

Semiconductor device and method of forming the same

Cap structure for interconnect dielectrics and methods of fabrication

Semiconductor structure with air gap in pattern- dense region and m...

Semiconductor device and method for fabricating the same

Semiconductor device with porous dielectric layers and method for f...

Vertical memory structure with air gaps and method for preparing th...

Semiconductor device

Three-dimensional vertical nor flash thin-film transistor strings

Integrated assemblies and methods of forming integrated assemblies

Electronic devices comprising multilevel bitlines, and related meth...

Semiconductor structures including middle-of-line (MOL) capacitance...

Contact over active gate structures using directed self-assembly fo...

Reducing RC delay in semiconductor devices

Semiconductor device and method of manufacturing the same

Wafer chip scale packaging with ball attach before repassivation

Air gap spacer formation for nano-scale semiconductor devices

Semiconductor device and method

Semiconductor memory device and manufacturing method thereof

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO IMPROVE INTERCONNECT STRUCTURES IN INTEGRA...

MICROELECTRONIC DEVICE WITH THICK CONDUCTIVE STAIRCASED STEPS FOR 3...

CONTACT FILLING METHOD

SEMICONDUCTOR DEVICES INCLUDING DECOUPLING CAPACITORS

RADIO FREQUENCY INDUCTOR

INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...

DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...

DIELECTRIC CAP STRUCTURE IN SEMICONDUCTOR DEVICES AND METHODS OF MA...

VERTICAL INTERCONNECT ELEVATOR BASED ON THROUGH SILICON VIAS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR WAFER FABRICATION WITH EXPOSURE DEFINED GRAPHENE FEAT...

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

IC Chip Comprising Backside Power Delivery Network and 3D Stacked N...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH

SEMICONDUCTOR DEVICE AND ISOLATION STRUCTURE AND CONTACT ETCH STOP...

MICROELECTRONIC DEVICES HAVING AIR GAP STRUCTURES INTEGRATED WITH I...

SEMICONDUCTOR MEMORY DEVICE

INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...

SEMICONDUCTOR PACKAGE

Method of Fabricating Redistribution Circuit Structure

SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

SEMICONDUCTOR DEVICE