Insulating materials

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H01L23/5329

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5329Insulating materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,237,013
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising multilevel bitlines, and related meth...
- Patent number 12,237,259
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 12,237,368
- Issue date Feb 25, 2025
- Adeia Semiconductor Solutions LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures using directed self-assembly fo...
- Patent number 12,237,223
- Issue date Feb 25, 2025
- Intel Corporation
- Paul A. Nyhus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,230,538
- Issue date Feb 18, 2025
- Kioxia Corporation
- Shinya Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packaging with ball attach before repassivation
- Patent number 12,230,539
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap spacer formation for nano-scale semiconductor devices
- Patent number 12,224,203
- Issue date Feb 11, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,204
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Nan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 12,224,205
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,218,001
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 12,218,052
- Issue date Feb 4, 2025
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal spacers and method for fabricating...
- Patent number 12,218,053
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate string drivers having shared pillar structure
- Patent number 12,219,772
- Issue date Feb 4, 2025
- Akira Goda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including MIM capacitor and resistor
- Patent number 12,211,838
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,738
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of an etching stop layer for improving overlay sh...
- Patent number 12,211,700
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,211,795
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Jinsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising a compressive dielectric material, an...
- Patent number 12,205,900
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driver placement in memories having stacked memory arrays
- Patent number 12,200,938
- Issue date Jan 14, 2025
- Haitao Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices including decoupling capacitors
- Patent number 12,199,030
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Xuan Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,199,164
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-layer etch stop structure
- Patent number 12,198,979
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a metal-oxide-semiconductor field-effect tr...
- Patent number 12,191,196
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate having groove around pad
- Patent number 12,191,255
- Issue date Jan 7, 2025
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...
- Publication number 20250070028
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070002
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kyungtae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20250069951
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...
- Publication number 20250072001
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hanbyeol LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...
- Publication number 20250070014
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20250070020
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070023
- Publication date Feb 27, 2025
- KIOXIA Corporation
- Hisashi KATO
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...
- Publication number 20250070015
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS
- Publication number 20250070026
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PO...
- Publication number 20250068074
- Publication date Feb 27, 2025
- Asahi Kasei Kabushiki Kaisha
- Takeki SHIMIZU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250062231
- Publication date Feb 20, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250062234
- Publication date Feb 20, 2025
- CXMT CORPORATION
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECT ELEVATOR BASED ON THROUGH SILICON VIAS
- Publication number 20250054860
- Publication date Feb 13, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20250054866
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BAND GAP SEMICONDUCTOR DEVICE
- Publication number 20250056869
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Fabian RASINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250046712
- Publication date Feb 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshiki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...
- Publication number 20250046673
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Devices with Good Reliability and Related Compositi...
- Publication number 20250046717
- Publication date Feb 6, 2025
- Fujifilm Electronic Materials U.S.A., Inc.
- Stefan Vanclooster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250046681
- Publication date Feb 6, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAVITY WITH NEGATIVE SLOPED SIDEWALL OVER GATE AND RELATED METHOD
- Publication number 20250038047
- Publication date Jan 30, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Anthony J. Villalon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250040144
- Publication date Jan 30, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
- Publication number 20250029877
- Publication date Jan 23, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE
- Publication number 20250029873
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...
- Publication number 20250031393
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR COMPONENT AND METHODS
- Publication number 20250029920
- Publication date Jan 23, 2025
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS

Insulating materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated assemblies and methods of forming integrated assemblies

Electronic devices comprising multilevel bitlines, and related meth...

Semiconductor structures including middle-of-line (MOL) capacitance...

Contact over active gate structures using directed self-assembly fo...

Reducing RC delay in semiconductor devices

Semiconductor device and method of manufacturing the same

Wafer chip scale packaging with ball attach before repassivation

Air gap spacer formation for nano-scale semiconductor devices

Semiconductor device and method

Semiconductor memory device and manufacturing method thereof

Semiconductor package and method of fabricating semiconductor package

Method of forming an integrated circuit device having an etch-stop...

Advanced lithography and self-assembled devices

Integrated chip with graphene based interconnect

Semiconductor device with metal spacers and method for fabricating...

Multi-gate string drivers having shared pillar structure

Device including MIM capacitor and resistor

Semiconductor structure and manufacturing method thereof

Selective removal of an etching stop layer for improving overlay sh...

Semiconductor device

Electronic devices comprising a compressive dielectric material, an...

Semiconductor device and a manufacturing method thereof

Gate line plug structures for advanced integrated circuit structure...

Driver placement in memories having stacked memory arrays

Semiconductor devices including decoupling capacitors

Semiconductor device and manufacturing method thereof

Plugs for interconnect lines for advanced integrated circuit struct...

Semiconductor device with multi-layer etch stop structure

Method of manufacturing a metal-oxide-semiconductor field-effect tr...

Interconnect substrate having groove around pad

Patents Applicationslast 30 patents

INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...

SEMICONDUCTOR PACKAGE

Method of Fabricating Redistribution Circuit Structure

SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...

SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

SEMICONDUCTOR DEVICE

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...

SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PO...

WIRING SUBSTRATE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

VERTICAL INTERCONNECT ELEVATOR BASED ON THROUGH SILICON VIAS

FORMING LARGE CHIPS THROUGH STITCHING

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

WIDE BAND GAP SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...

Microelectronic Devices with Good Reliability and Related Compositi...

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

CAVITY WITH NEGATIVE SLOPED SIDEWALL OVER GATE AND RELATED METHOD

MEMORY DEVICE

THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE

DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR COMPONENT AND METHODS