Claims
- 1. A method of dispensing a dot of material on an electronic substrate, the method comprising:
loading the material into a dispenser, the dispenser having a dispensing needle with an outlet having an inner diameter; positioning the dispenser over the electronic substrate; controlling the dispenser to dispense a dot of material on the substrate, such that the dot has a contact surface area on the substrate, the contact surface area having a diameter less than or equal to the inner diameter of the outlet of the needle.
- 2. The method of claim 1, wherein the material is one of silver epoxy, surface mount adhesive, flux and solder paste.
- 3. The method of claim 2, wherein controlling the dispenser includes coupling a motor having an encoder to the dispenser, and coupling a gear reducer between the motor and the encoder.
- 4. The method of claim 3, wherein the dispenser includes an auger screw, and wherein controlling the dispenser includes rotating the auger screw by a predetermined amount.
- 5. The method of claim 4, further comprising lowering the dispenser towards the electronic substrate.
- 6. The method of claim 5, wherein the step of lowering includes maintaining the motor at a fixed position while the dispenser is lowered.
- 7. The method of claim 1, wherein controlling the dispenser includes coupling a motor having an encoder to the dispenser, and coupling a gear reducer between the motor and the encoder.
- 8. The method of claim 1, wherein the dispenser includes an auger screw, and
wherein controlling the dispenser includes rotating the auger screw by a predetermined amount.
- 9. The method of claim 1, further comprising lowering the dispenser towards the electronic substrate.
- 10. The method of claim 9, wherein the step of lowering includes maintaining the motor at a fixed position while the dispenser is lowered.
- 11. An apparatus for dispensing dots of material on an electronic substrate, the apparatus comprising:
a dispenser having an outlet having an inner diameter from which material is dispensed, having an inlet from which material is received for dispensing, and having a control input; a motor having an encoder; a gear reducer coupled between the motor and the control input of the dispenser that provides a gear reduction ratio greater than one to provide precision control of the dispenser.
- 12. The apparatus of claim 11, wherein the dispenser includes an auger screw coupled to the control input that is rotated to cause material to be dispensed.
- 13. The apparatus of claim 12, further comprising a z-axis motor that moves the dispenser vertically to position the dispenser at a dispensing height over the electronic substrate.
- 14. The apparatus of claim 13, wherein the apparatus is constructed and arranged such that the motor remains in a fixed position while the dispenser is lowered by the z-axis motor.
- 15. The apparatus of claim 14, further comprising a z-axis sensor that determines the height of the electronic substrate for positioning of the dispenser at the dispensing height.
- 16. An apparatus for dispensing dots of material on an electronic substrate, the apparatus comprising:
a dispenser having a needle with an inner diameter from which material is dispensed; means for controlling the dispenser to dispense a dot of material on the electronic substrate, such that the dot has a contact surface area on the substrate, the contact surface area having a diameter less than or equal to the inner diameter of the outlet of the needle.
- 17. The apparatus of claim 16, wherein the material is one of silver epoxy, surface mount adhesive, flux and solder paste.
- 18. The method of claim 16, wherein the apparatus further includes:
a motor with an encoder; an auger screw that is rotated by the motor to cause material to be dispensed; and means for reducing a gear ratio of the motor to increase a number of encoder counts per degree of revolution of the auger screw.
- 19. The method of claim 18, further comprising means for lowering the dispenser towards the electronic substrate.
- 20. The method of claim 19, further comprising means for maintaining the motor at a fixed position while the dispenser is lowered.
- 21. The method of claim 20, further comprising means for measuring a height of the electronic substrate.
RELATED APPLICATIONS
[0001] This application is a continuation-in-part of U.S. patent application Ser. No. 10/156,715, filed May 28 2002, which is a continuation of U.S. patent application Ser. No. 09/643,324, filed Aug. 22, 2000, now U.S. Pat. No. 6,395,334, which is a divisional application of U.S. Ser. No. 09,253,119, filed Feb. 19, 1999, now U.S. Pat. No. 6,214,117, each of which is incorporated herein by reference.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09253119 |
Feb 1999 |
US |
Child |
09643324 |
Aug 2000 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09643324 |
Aug 2000 |
US |
Child |
10156715 |
May 2002 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
10156715 |
May 2002 |
US |
Child |
10196571 |
Jul 2002 |
US |