The present disclosure relates generally to robots, and more particularly to robots equipped with mechanisms for securing a wafer within an end effector.
The use of robots is widespread in the semiconductor industry, due to their ability to process a large number of semiconductor wafers through many different processing technologies, and to perform repetitive tasks quickly and accurately. The use of robots is especially advantageous in portions of semiconductor fabrication lines where human handling of semiconductor wafers is inefficient or undesirable. For example, many semiconductor fabrication processes, such as etching, deposition, and passivation, occur in reaction chambers having sealed environments. The use of robots allows these environments to be carefully maintained in order to minimize the likelihood of contamination and to optimize processing conditions.
Modern semiconductor processing systems include cluster tools that integrate a number of process chambers together in order to perform several sequential processing steps without removing the substrate from the highly controlled processing environment. These chambers may include, for example, degas chambers, substrate pre-conditioning chambers, cool-down chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, and etch chambers. The combination of chambers in a cluster tool, as well as the operating conditions and parameters under which those chambers are run, are selected to fabricate specific structures using a specific process recipe and process flow.
Once the cluster tool has been set up with a desired set of chambers and auxiliary equipment for performing certain process steps, the cluster tool will typically process a large number of substrates by continuously passing them, one by one, through a series of chambers or process steps. The process recipes and sequences will typically be programmed into a microprocessor controller that will direct, control and monitor the processing of each substrate through the cluster tool. Once an entire cassette of wafers has been successfully processed through the cluster tool, the cassette may be passed to yet another cluster tool or stand alone tool, such as a chemical mechanical polisher, for further processing.
One example of a known fabrication system of the type described above is the cluster tool 101 disclosed in U.S. Pat. No. 6,222,337 (Kroeker et al.), and reproduced in FIGS. 1-2 herein. The magnetically coupled robots 103, 153 disclosed therein are equipped with upper 105 and lower 107 robotic arms having a frog-leg type construction that are adapted to provide both radial and rotational movement of the robot blade 109 within a fixed plane. The radial and rotational movements can be coordinated or combined to allow for pickup, transfer and delivery of substrates from one location within the cluster tool to another location. For example, the robotic arm may be used to move substrates from one processing chamber to an adjacent chamber.
A second robot 153 is located in transfer chamber 163, and is adapted to transfer substrates between various chambers which may include, for example, a cool-down chamber 165, a pre-clean chamber 167, a CVD Al chamber 169 and a PVD AlCu processing chamber 171. The specific configuration of chambers illustrated in
Robots of the type depicted in
In one aspect, a robot is provided which comprises a wafer blade having a pocket therein for receiving a semiconductor wafer; and at least one retractable protrusion which is movable from a first position in which said protrusion prevents the removal of said wafer from said pocket, to a second position in which said protrusion permits the removal of said wafer from said pocket.
In another aspect, an end effector is provided which comprises a wafer blade having a pocket therein for receiving a semiconductor wafer; and a retractable protrusion which is movable from a first position in which it secures said wafer in said pocket, to a second position in which said wafer is removable from said pocket.
In a further aspect, a robot is provided which comprises (a) a robotic arm which extends along a path including first, second and third points, wherein said arm is in a relatively retracted position at said first point and is in a relatively extended position at said third point, and wherein said second point is disposed between said first and third points; (b) an end effector which is attached to said arm; and (c) a mechanical actuator disposed in said end effector, said actuator assuming a first state when said robotic arm is at said first point, and assuming a second state when said robotic arm is at said second point.
In still another aspect, a robot is provided which comprises (a) a robotic arm which extends along a path including first, second and third points; (b) an end effector which is attached to said arm; and (c) a mechanical actuator disposed in said end effector, said actuator assuming a first state when said robotic arm is at said first point, and assuming a second state when said robotic arm is at said second point; wherein said arm is in a more retracted position when it is at said first point compared to when it is at said third point, wherein said second point is disposed between said first and third points.
In a further aspect, a robot is provided which comprises (a) a robotic arm which is extendible to assume at least first, second and third positions, wherein said arm is more extended when it is in the second position relative to the first position, and wherein said arm is more extended when it is in the third position relative to the second position; (b) an end effector which is attached to said arm; and (c) a mechanical actuator disposed in said end effector, said actuator assuming a first state when said robotic arm is in said first position, and assuming a second state when said robotic arm is in said second position.
In yet another aspect, a robot is provided which comprises (a) a hub; (b) a robotic arm which is extendible from said hub to assume at least first, second and third positions, wherein said arm is more extended when it is in the second position relative to the first position, and wherein said arm is more extended when it is in the third position relative to the second position; (c) an end effector which is attached to said arm; and (d) a mechanical actuator disposed in said end effector, said actuator assuming a first state when said robotic arm is in said first position, and assuming a second state when said robotic arm is in said second position.
For a more complete understanding of the present disclosure and the advantages thereof, reference is now made to the following description taken in conjunction with the accompanying drawings in which like reference numerals indicate like features and wherein:
While the robots depicted in
It has now been found that the foregoing problem may be addressed through the provision of a robot (or an end effector thereof) which is equipped with a wafer holding means for preventing a wafer from moving inside of a wafer blade pocket while the robot is moving at higher speeds. Preferably, the wafer holding means can be deactivated when the robot is moving at slower speeds, or when removal of the wafer blade from the wafer blade pocket is desired.
In one preferred embodiment, for example, the wafer holding means is in the form of a finger which engages a wafer disposed in the wafer blade pocket while the wafer blade is moving at higher speeds. In this particular embodiment, the finger disengages the wafer when, and only when, the arms of the robot are extended a predefined distance k, where k is typically chosen to be sufficiently large such that, when k is reached, the wafer is nearing its target and/or the wafer blade is moving at a slower speed. The wafer blade is preferably fitted with a plurality of elastomeric pads and/or a plurality of elastomeric posts so that, at such slower speeds, the wafer is prevented from moving within the wafer blade pocket even when the finger is disengaged.
The devices and methodologies disclosed herein may be further understood with reference to the first particular, non-limiting embodiment, depicted in
The protrusion 107 in the particular embodiment depicted is driven by a rack-and-pinion system 111 which is housed within the wrist assembly 103. The rack-and-pinion system 111 moves the protrusion 107 between an extended position, as shown in
The wrist assembly 103 (with cover plate removed) is shown in greater detail in
In one possible configuration of a robot made in accordance with the teachings herein, the end effector assembly 101 of
The wafer pocket 109 is defined by opposing sidewalls 147 and 149. Sidewall 147 is equipped with a notch 151 which permits the protrusion 107 (see
The use of elastomeric posts 173 in combination with protrusion 107 to grip the wafer allows the protrusion 107 to press against the wafer with greater force than would be the case if the wafer were being pressed against a rigid surface. Moreover, this force is adjustable by virtue of spring 161. This arrangement maintains the wafer in the pocket while the protrusion is extended and prevents damage to the wafer which might otherwise result from the clamping force. The wafer is also engaged and disengaged much more slowly than pneumatic clamps of the type used in the prior art, thus preventing damage to the wafer from “knocking”. As a further benefit, the wafer is gripped from at least three points along its edges. Since the wafer typically has the greatest momentum along an axis parallel to its major surfaces when the wafer blade is in motion, this arrangement minimizes the force required to maintain the wafer in the wafer blade pocket.
One advantage of the foregoing embodiment is that the wrist assembly can be configured so that the point at which the finger 107 engages the wafer can be adjusted over a wide range. This allows the robot to accommodate a wide variety of tool settings. In a cluster tool, where the robotic arm may have to interact with several chambers, this point may be set in reference to the closest chamber (that is, the chamber requiring the least extension of the robotic arm). By contrast, conventional robots equipped with actuating mechanisms typically have fixed set points, and thus cannot accommodate a need for changes in the set point.
It will be appreciated that the devices and methodologies disclosed herein may be utilized for other purposes besides maintaining wafers within a wafer pocket. For example, in many retrofit applications involving existing robots, it is desirable to add functionality to the robot. However, such modifications are often constrained by available assets. For example, it may be challenging to retrofit a robotic arm with a pneumatic tool if the robotic arm lacks wiring or other means to control the tool. However, the approach described herein may be utilized to mechanically activate the tool when the robotic arm is extended a certain distance (or range of distances). For example, a rack and pinion system of the type described above may be used in such a robot as a mechanical actuator to move the tool between a first and second state which may be, for example, an “on” state and an “off” state.
The above description of the present invention is illustrative, and is not intended to be limiting. It will thus be appreciated that various additions, substitutions and modifications may be made to the above described embodiments without departing from the scope of the present invention. Accordingly, the scope of the present invention should be construed in reference to the appended claims.
The present application claims priority to U.S. Ser. No. 61/137,416, entitled “Edge Grip End Effector”, which was filed on Jul. 30, 2008, and which is incorporated herein by reference in its entirety; and to U.S. Ser. No. 61/118,755, entitled “Edge Grip End Effector”, which was filed on Dec. 1, 2008, and which is incorporated herein by reference in its entirety.
Number | Date | Country | |
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61137416 | Jul 2008 | US | |
61118755 | Dec 2008 | US |