This is a continuation-in-part of application Ser. No. 08/056,677 filed on May 3, 1993, which issued as U.S. Pat. No. 5,388,996 on Feb. 14, 1995, which is a continuation-in-part of Ser. No. 07/801,694 filed on Dec. 2, 1991, which issued as U.S. Pat. No. 5,207,584 on May 4, 1993, which is a continuation of Ser. No. 07/639,126 filed on Jan. 9, 1991, which issued as U.S. Pat. No. 5,069,629 on Dec. 3, 1991.
Number | Name | Date | Kind |
---|---|---|---|
3551750 | Sterling | Dec 1970 | |
3795037 | Luttmer | Mar 1974 | |
4150420 | Berg | Apr 1979 | |
4295700 | Sado | Oct 1981 | |
4330165 | Sado | May 1982 | |
4402562 | Sado | Sep 1983 | |
4445735 | Bonnefoy | May 1984 | |
4477774 | Revirieux | Oct 1984 | |
4506938 | Madden | Mar 1985 | |
4509099 | Takamato | Apr 1985 | |
4511197 | Grabbe et al. | Apr 1985 | |
4593961 | Cosmo | Jun 1986 | |
4598246 | Staples et al. | Jul 1986 | |
4633175 | Ritchie et al. | Dec 1986 | |
4634199 | Anhalt et al. | Jan 1987 | |
4664458 | Worth | May 1987 | |
4686467 | DeLapp et al. | Aug 1987 | |
4793814 | Zifcak et al. | Dec 1988 | |
4800335 | Davila et al. | Jan 1989 | |
4835464 | Slye et al. | May 1989 | |
4866374 | Cedrone | Sep 1989 | |
4870353 | Cook | Sep 1989 | |
4929892 | Larsen | May 1990 | |
4943768 | Niki et al. | Jul 1990 | |
4950980 | Pfaff | Aug 1990 | |
4998886 | Werner | Mar 1991 | |
5069629 | Johnson | Dec 1991 | |
5137456 | Desai et al. | Aug 1992 | |
5139427 | Boyd et al. | Aug 1992 | |
5207584 | Johnson | May 1993 | |
5336094 | Johnson | Aug 1994 | |
5388996 | Johnson | Feb 1995 |
Number | Date | Country |
---|---|---|
0431566A1 | Dec 1991 | EPX |
WO89704568 | Jul 1987 | WOX |
Entry |
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Electronic Design, "New Methods Vie for Dense, Fast Connector Slots", Lyman, May 11, 1989, pp. 71-74. |
Test & Measurement World, "Fixturing for High-Speed Test Signals", Corwith, Nov. 1990, pp. 45-48. |
Surface Mount Technology, "SMT Market Trends", Stout, Nov. 1990, p. 4. |
EDN, "Designs Meet Needs of High-Speed, High-Density Systems", Ormond, Jul. 5, 1990, pp. 50-58. |
The Electronic System Design Magazine, "Packaging Standards: The Calm Before the Storm", Furlow, May 1989, pp. 24-26. |
Connection Technology, "Testing a High-Rel Decoupling Capacitor Socket", Gallotello, Apr. 1990, pp. 39-40. |
Technical Information, Decoupling: 256K DRAMS, Martin, AVX Corporation. |
EMC Technology & Interference Control News, "The Role of Integrated Circuits Decoupling in Electromagnetic Campatibility", Johnston, Oct. 1983. |
High Performance Decouping Capacitor for Installation Under the Dual in Line IC Package, Hyslop et al., Rogers Corporation. |
Test & Measurement World, "Meeting the Electrical Challenges of IC-Handler Contractor Design", Roblee, Sep. 1989, pp. 46-50. |
Electronic Packaging & Production; "Take a Look at Socketing", Hursh, Jun. 1989, pp. 56-60. |
"Enhanced Performance Implanted CMOS (EPIC.TM.) Advanced CMOS Logic (ACL) Design Considerations", Weinstein et al., Texas Instruments. |
Number | Date | Country | |
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Parent | 639126 | Jan 1991 |
Number | Date | Country | |
---|---|---|---|
Parent | 56677 | May 1993 | |
Parent | 801694 | Dec 1991 |