Sockets for IC's or transistors

Industry

CPC
G01R1/0433

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00

Current Industry

G01R1/0433Sockets for IC's or transistors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Test carrier and carrier assembling apparatus
- Patent number 12,140,610
- Issue date Nov 12, 2024
- Advantest Corporation
- Toshiyuki Kiyokawa
- G01 - MEASURING TESTING
Information Patent Grant
Testing apparatus and method of using the same
- Patent number 12,066,457
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC socket includes a base part with a contact pin and a sheet membe...
- Patent number 12,050,234
- Issue date Jul 30, 2024
- Enplas Corporation
- Kazutaka Koshiishi
- G01 - MEASURING TESTING
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test carrier and carrier assembling apparatus
- Patent number 11,906,548
- Issue date Feb 20, 2024
- Advantest Corporation
- Toshiyuki Kiyokawa
- G01 - MEASURING TESTING
Information Patent Grant
Probing device
- Patent number 11,828,797
- Issue date Nov 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- G01 - MEASURING TESTING
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,769,718
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing device and probe elements thereof
- Patent number 11,768,223
- Issue date Sep 26, 2023
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Choon Leong Lou
- G01 - MEASURING TESTING
Information Patent Grant
Testing apparatus and method of using the same
- Patent number 11,693,025
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Ting Chen
- G01 - MEASURING TESTING
Information Patent Grant
Test apparatus for testing semiconductor packages and automatic tes...
- Patent number 11,614,483
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Dahm Yu
- G01 - MEASURING TESTING
Information Patent Grant
Test carrier and carrier assembling apparatus
- Patent number 11,531,043
- Issue date Dec 20, 2022
- Advantest Corporation
- Toshiyuki Kiyokawa
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for depopulating pins from contactor test socke...
- Patent number 11,493,535
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Kay Chan Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,469,166
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test socket and method of manufacturing the same
- Patent number 11,467,185
- Issue date Oct 11, 2022
- Sharp Kabushiki Kaisha
- Kazuo Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card having dummy traces for testing an integrated circuit to...
- Patent number 11,422,155
- Issue date Aug 23, 2022
- MELLANOX TECHNOLOGIES, LTD.
- Konstantin Turchin
- G01 - MEASURING TESTING
Information Patent Grant
Interposer, socket, socket assembly, and wiring board assembly
- Patent number 11,327,093
- Issue date May 10, 2022
- Advantest Corporation
- Takashi Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probing apparatus and method of operating the same
- Patent number 11,307,246
- Issue date Apr 19, 2022
- Star Technologies, Inc.
- Choon Leong Lou
- G01 - MEASURING TESTING
Information Patent Grant
IC socket
- Patent number 11,280,808
- Issue date Mar 22, 2022
- Enplas Corporation
- Hisao Ohshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for electrical component
- Patent number 11,244,882
- Issue date Feb 8, 2022
- Enplas Corporation
- Osamu Hachuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plate-shaped connection system for the connection of two test units...
- Patent number 11,163,000
- Issue date Nov 2, 2021
- Turbodynamics GmbH
- Stefan Thurmaier
- G01 - MEASURING TESTING
Information Patent Grant
Socket
- Patent number 10,976,346
- Issue date Apr 13, 2021
- Yokowo Co., Ltd.
- Tsugio Yamamoto
- G01 - MEASURING TESTING
Information Patent Grant
Probe pin, inspection jig, inspection unit and inspection device
- Patent number 10,962,564
- Issue date Mar 30, 2021
- Omron Corporation
- Naoya Sasano
- G01 - MEASURING TESTING
Information Patent Grant
Substrate inspection apparatus
- Patent number 10,962,565
- Issue date Mar 30, 2021
- Tokyo Electron Limited
- Michio Murata
- G01 - MEASURING TESTING
Information Patent Grant
Connector pin device for testing semiconductor chip and method of m...
- Patent number 10,948,520
- Issue date Mar 16, 2021
- Jaesuk Oh
- G01 - MEASURING TESTING
Information Patent Grant
Electrical connector assembly having fan support thereon
- Patent number 10,895,594
- Issue date Jan 19, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Ming-Yue Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Automated test system having orthogonal robots
- Patent number 10,845,410
- Issue date Nov 24, 2020
- Teradyne, Inc.
- David Paul Bowyer
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for manufacturing substrates
- Patent number 10,823,779
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Youngchul Lee
- G01 - MEASURING TESTING
Information Patent Grant
Reduced cost package device simulator, manufacturing method and met...
- Patent number 10,788,531
- Issue date Sep 29, 2020
- MODUS TEST, LLC
- Lynwood Adams
- G01 - MEASURING TESTING
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 10,748,841
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common test board, IP evaluation board, and semiconductor device te...
- Patent number 10,718,789
- Issue date Jul 21, 2020
- Kabushiki Kaisha Toshiba
- Masato Onda
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
TESTING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240345130
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC INSPECTION SOCKET
- Publication number 20240168054
- Publication date May 23, 2024
- Yokowo Co., Ltd.
- Kohei AMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TESTING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20240103069
- Publication date Mar 28, 2024
- RENESAS ELECTRONICS CORPORATION
- Osamu MIZOGUCHI
- G01 - MEASURING TESTING
Information Patent Application
PNEUMATIC SEMICONDUCTOR SOCKET LID ASSEMBLY
- Publication number 20240094242
- Publication date Mar 21, 2024
- Ironwood Electronics, Inc.
- Jacob Vavra
- G01 - MEASURING TESTING
Information Patent Application
SOCKET AND INSPECTION SOCKET
- Publication number 20240019459
- Publication date Jan 18, 2024
- ENPLAS CORPORATION
- Kazutaka KOSHIISHI
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS FOR A SEMICONDUCTOR PACKAGE
- Publication number 20230384368
- Publication date Nov 30, 2023
- TSE CO., LTD.
- Min Cheol Kim
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE
- Publication number 20230358784
- Publication date Nov 9, 2023
- STATS ChipPAC Pte Ltd.
- ZunBae MOON
- G01 - MEASURING TESTING
Information Patent Application
PROBING DEVICE
- Publication number 20230358802
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- G01 - MEASURING TESTING
Information Patent Application
PROBING DEVICE AND INSPECTION METHOD USING THE SAME
- Publication number 20230358803
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- G01 - MEASURING TESTING
Information Patent Application
Architecture and Testing for an Integrated Circuit Package
- Publication number 20230341463
- Publication date Oct 26, 2023
- Kalyana Ravindra Kantipudi
- G01 - MEASURING TESTING
Information Patent Application
CERAMIC, PROBE GUIDING MEMBER, PROBE CARD AND SOCKET FOR PACKAGE IN...
- Publication number 20230312423
- Publication date Oct 5, 2023
- FERROTEC MATERIAL TECHNOLOGIES CORPORATION
- Wataru YAMAGISHI
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
TESTING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230280370
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION DEVICE
- Publication number 20230221350
- Publication date Jul 13, 2023
- Yokowo Co., Ltd.
- Tomohisa HOSHINO
- G01 - MEASURING TESTING
Information Patent Application
PRESSURIZING DEVICE FOR SEMICONDUCTOR TESTING AND SEMICONDUCTOR TES...
- Publication number 20230221366
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Changgeun YANG
- G01 - MEASURING TESTING
Information Patent Application
AUTOMATED TEST EQUIPMENT FOR TESTING SEMICONDUCTOR DEVICES
- Publication number 20230073230
- Publication date Mar 9, 2023
- Cohu GmbH
- Markus WAGNER
- G01 - MEASURING TESTING
Information Patent Application
TESTING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230067209
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND COMPOSITIONS FOR INCREASING THE POTENCY OF ANTIFUNGAL A...
- Publication number 20230060217
- Publication date Mar 2, 2023
- Pacific Northwest Research Institute
- Catherine Ludlow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION DEVICE, SEMICONDUCTOR TESTING SYSTEM AND ITS TESTING METHOD
- Publication number 20230045244
- Publication date Feb 9, 2023
- HERMES TESTING SOLUTIONS INC.
- Bo-Lung Chen
- G01 - MEASURING TESTING
Information Patent Application
SOCKET AND INSPECTION SOCKET
- Publication number 20230018751
- Publication date Jan 19, 2023
- ENPLAS CORPORATION
- Hiroyuki ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING DEVICE AND PROBE ELEMENTS THEREOF
- Publication number 20220390487
- Publication date Dec 8, 2022
- teCat Technologies (Suzhou) Limited
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
Packages with Si-Substrate-Free Interposer and Method Forming Same
- Publication number 20220375839
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED FINE-PITCH HIGH-PERFORMANCE IMPEDANCE TUNABLE INTERCONNECT
- Publication number 20220244291
- Publication date Aug 4, 2022
- Ismael Franco
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
TEST CARRIER AND CARRIER ASSEMBLING APPARATUS
- Publication number 20220011342
- Publication date Jan 13, 2022
- Advantest Corporation
- Toshiyuki Kiyokawa
- G01 - MEASURING TESTING
Information Patent Application
TEST CARRIER AND CARRIER ASSEMBLING APPARATUS
- Publication number 20220011340
- Publication date Jan 13, 2022
- Advantest Corporation
- Toshiyuki Kiyokawa
- G01 - MEASURING TESTING
Information Patent Application
TEST CARRIER AND CARRIER ASSEMBLING APPARATUS
- Publication number 20220011341
- Publication date Jan 13, 2022
- Advantest Corporation
- Toshiyuki Kiyokawa
- G01 - MEASURING TESTING
Information Patent Application
TEST CARRIER AND CARRIER ASSEMBLING APPARATUS
- Publication number 20220011343
- Publication date Jan 13, 2022
- Advantest Corporation
- Toshiyuki Kiyokawa
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS FOR TESTING SEMICONDUCTOR PACKAGES AND AUTOMATIC TES...
- Publication number 20210325450
- Publication date Oct 21, 2021
- Samsung Electronics Co., Ltd.
- Dahm Yu
- G01 - MEASURING TESTING
Information Patent Application
IC SOCKET
- Publication number 20210247421
- Publication date Aug 12, 2021
- ENPLAS CORPORATION
- Hisao OHSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET
- Publication number 20210199689
- Publication date Jul 1, 2021
- YOKOWO CO., LTD
- Tsugio YAMAMOTO
- G01 - MEASURING TESTING
Information Patent Application
PROBING APPARATUS AND METHOD OF OPERATING THE SAME
- Publication number 20210088581
- Publication date Mar 25, 2021
- STAR TECHNOLOGIES, INC.
- CHOON LEONG LOU
- G01 - MEASURING TESTING

Sockets for IC's or transistors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Test carrier and carrier assembling apparatus

Testing apparatus and method of using the same

IC socket includes a base part with a contact pin and a sheet membe...

Resonant-coupled transmission line

Test carrier and carrier assembling apparatus

Probing device

Packages with Si-substrate-free interposer and method forming same

Testing device and probe elements thereof

Testing apparatus and method of using the same

Test apparatus for testing semiconductor packages and automatic tes...

Test carrier and carrier assembling apparatus

Systems and methods for depopulating pins from contactor test socke...

Packages with Si-substrate-free interposer and method forming same

Test socket and method of manufacturing the same

Probe card having dummy traces for testing an integrated circuit to...

Interposer, socket, socket assembly, and wiring board assembly

Probing apparatus and method of operating the same

IC socket

Socket for electrical component

Plate-shaped connection system for the connection of two test units...

Socket

Probe pin, inspection jig, inspection unit and inspection device

Substrate inspection apparatus

Connector pin device for testing semiconductor chip and method of m...

Electrical connector assembly having fan support thereon

Automated test system having orthogonal robots

Apparatus and method for manufacturing substrates

Reduced cost package device simulator, manufacturing method and met...

Packages with Si-substrate-free interposer and method forming same

Common test board, IP evaluation board, and semiconductor device te...

Patents Applicationslast 30 patents

TESTING APPARATUS AND METHOD OF USING THE SAME

IC INSPECTION SOCKET

METHOD OF TESTING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

PNEUMATIC SEMICONDUCTOR SOCKET LID ASSEMBLY

SOCKET AND INSPECTION SOCKET

TEST APPARATUS FOR A SEMICONDUCTOR PACKAGE

METHOD AND APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE

PROBING DEVICE

PROBING DEVICE AND INSPECTION METHOD USING THE SAME

Architecture and Testing for an Integrated Circuit Package

CERAMIC, PROBE GUIDING MEMBER, PROBE CARD AND SOCKET FOR PACKAGE IN...

TESTING APPARATUS AND METHOD OF USING THE SAME

INSPECTION DEVICE

PRESSURIZING DEVICE FOR SEMICONDUCTOR TESTING AND SEMICONDUCTOR TES...

AUTOMATED TEST EQUIPMENT FOR TESTING SEMICONDUCTOR DEVICES

TESTING APPARATUS AND METHOD OF USING THE SAME

METHODS AND COMPOSITIONS FOR INCREASING THE POTENCY OF ANTIFUNGAL A...

INJECTION DEVICE, SEMICONDUCTOR TESTING SYSTEM AND ITS TESTING METHOD

SOCKET AND INSPECTION SOCKET

TESTING DEVICE AND PROBE ELEMENTS THEREOF

Packages with Si-Substrate-Free Interposer and Method Forming Same

SHIELDED FINE-PITCH HIGH-PERFORMANCE IMPEDANCE TUNABLE INTERCONNECT

TEST CARRIER AND CARRIER ASSEMBLING APPARATUS

TEST CARRIER AND CARRIER ASSEMBLING APPARATUS

TEST CARRIER AND CARRIER ASSEMBLING APPARATUS

TEST CARRIER AND CARRIER ASSEMBLING APPARATUS

TEST APPARATUS FOR TESTING SEMICONDUCTOR PACKAGES AND AUTOMATIC TES...

IC SOCKET

SOCKET

PROBING APPARATUS AND METHOD OF OPERATING THE SAME