Electronic Design, "New Methods Vie for Dense, Fast Connector Slots", Lyman, May 11, 1989, pp. 71-74. |
Test & Measurement World, "Fixturing for High-Speed Test Signals", Corwith, Nov., 1990, pp. 45-48. |
Surface Mount Technology, "SMT Market Trends", Stout, Nov., 1990, p. 4. |
EDN, "Designs Meet Needs of High-Speed, High-Density Systems", Ormond, Jul. 5, 1990, pp. 50-58. |
The Electronic System Design Magazine, "Packaging Standards: The Calm Before the Storm", Furlow, May, 1989, pp. 24-26. |
Connection Technology, "Testing a High-Rel Decoupling Capacitor Socket", Gallotello, Apr., 1990, pp. 39-40. |
Technical Information, Decoupling: 256K DRAMS, Martin AVX Corporation. |
EMC Technology & Interference Control News, "The Role of Integrated Circuits Decoupling in Electromagnetic Compatibility", Johnston, Oct., 1983. |
High Performance Decoupling Capacitor for Installation Under the Dual in Line IC Package, Hyslop, et al., Rogers Corporation. |
Test & Measurement World, "Meeting the Electrical Challenges of IC Handler Contactor Design", Reblee, Sep., 1898, pp. 46-50. |
Electronic Packaging & Production, "Take a Look at Socketing", Hursh, Jun., 1989, pp. 56-60. |
"Enhanced Performance Implanted CMOS (EPIC) Advanced CMOS Logic (ACL) Design Considerations", Weinstein et al., Texas Instruments. |