Claims
- 1. A process for preparing an electrical interconnect, the process comprising the steps of:
(a) providing a first substrate having a surface and at least one first electrical contact projecting from the first substrate surface; (b) positioning a second substrate, having a surface and at least one second electrical contact projecting from the second substrate surface, opposite to the first substrate such that the first substrate surface is substantially parallel with the second substrate surface and the first electrical contact is aligned with the second electrical contact; (c) positioning an adhesive between: (i) the first substrate surface and first electrical contact projecting therefrom and (ii) the second substrate surface and second electrical contact therefrom, the adhesive comprising particles, the particles comprising at least one electrically conductive material coated with at least one electrically non-conductive material; (d) moving the at least one of the first substrate or the second substrate closer to the other such that the first electrical contact is positioned close enough to the second electrical contact to break the electrically non-conductive coating material of the particles in the interposed adhesive such that the electrically conducting material of the particles is exposed and in contact with both the first electrical contact and the second electrical contact.
- 2. The process of claim 1 wherein the electrically conductive material is selected from the group consisting of nickel, silver, copper and molybdenum.
- 3. The process of claim 1 wherein the electrically conductive material is pre-cracked.
- 4. The process of claim 3 wherein the electrically conductive material is pre-cracked to a treatment with chemical or thermal stress.
- 5. The process of claim 1 wherein the electrically conductive material is an agglomeration of small sharp fragments.
- 6. The process of claim 1 wherein the adhesive resin does not expand upon curing.
- 7. The process of claim 1 wherein the adhesive is in the form of a paste or a film.
- 8. The process of claim 1 wherein the particle has a average particle size of between 0.5 to about 100 microns before being broken.
- 9. A process for preparing an electrical interconnect, the process comprising the steps of:
(a) providing a first substrate having a surface and at least one first electrical contact projecting from the first substrate surface; (b) positioning a second substrate, having a surface and at least one second electrical contact projecting from the second substrate surface, opposite to the first substrate such that the first substrate surface is substantially parallel with the second substrate surface and the first electrical contact is aligned with the second electrical contact; (c) positioning a first adhesive between: (i) the first substrate surface and first electrical contact projecting therefrom and (ii) the second substrate surface and second electrical contact therefrom, the first adhesive comprising an electrically non-conductive resin and particles, the particles comprising a core and a breakable coating of at least one electrically non-conductive material, the core comprising: (1) at least one first subparticle comprising a reactive resin, having conductive material therein, encapsulated inside a rupturable membrane; and, (2) at least one second subparticle comprising a catalyst encapsulated inside a rupturable membrane, (d) moving the at least one of the first substrate or the second substrate closer to the other such that the first electrical contact is positioned close enough to the second electrical contact to break the breakable coating of the particles in the interposed first adhesive such that the first subparticle membrane and the second subparticle membrane are ruptured, whereby the reactive resin and the catalyst react to form a conductive second adhesive between the first electrical contact and the second electrical contact provided that the coating of the particles interposed between the first substrate surface and the second substrate surface, but not interposed between the first electrical contact and the second electrical contact, is not broken.
- 10. The process of claim 9 wherein the conductive material comprises chunks of a metal selected from the group consisting of silver, copper, nickel, and molybdenum.
- 11. The process of claim 9 wherein the reactive resin and the catalyst are each one component of a two part conductive adhesive resin.
- 12. The process of claim 1I wherein the conductive second adhesive resin is a two part epoxy.
- 13. The process of claim 9 wherein neither the first nor second adhesive expands upon curing.
- 14. The process of claim 9 wherein the first adhesive is in the form of a paste or a film.
- 15. A process for preparing an electrical interconnect, the process comprising the steps of:
(a) providing a first substrate having a surface and at least one first electrical contact projecting from the first substrate surface; (b) positioning a second substrate, having a surface and at least one second electrical contact projecting from the second substrate surface, opposite to the first substrate such that the first substrate surface is substantially parallel with the second substrate surface and the first electrical contact is aligned with the second electrical contact; (c) positioning a first adhesive between: (i) the first substrate surface and first electrical contact projecting therefrom and (ii) the second substrate surface and second electrical contact therefrom, the first adhesive comprising: (1) an electrically non-conductive resin; (2) multiple first particles, each first particle comprising a core comprising at least one reactive resin, having an electrically conductive material therein, and a breakable coating of at least one electrically non-conductive material; and (3) multiple second particles, each second particle comprising a core comprising a catalyst and a breakable coating of at least one electrically non-conductive material, (d) moving the at least one of the first substrate or the second substrate closer to the other such that the first electrical contact is positioned close enough to the second electrical contact to break the breakable coatings of the first particles and the second particles in the interposed first adhesive, whereby the reactive resin and the catalyst react to form a conductive second adhesive between the first electrical contact and the second electrical contact, contact provided that the coating of the particles interposed between the first substrate surface and the second substrate surface, but not interposed between the first electrical contact and the second electrical contact, is not broken.
- 16. The process of claim 15 wherein the conductive material comprises chunks of a metal selected from the group consisting of silver, copper, nickel, and molybdenum.
- 17. The process of claim 15 wherein the reactive resin and the catalyst are each one component of a two part conductive adhesive resin.
- 18. The process of claim 17 wherein the conductive second adhesive resin is a two part epoxy.
- 19. The process of claim 15 wherein neither the first nor second adhesive expands upon curing.
- 20. The process of claim 15 wherein the first adhesive is in the form of a paste or a film. in the first adhesive is in the form of a paste or a film.
CROSS-REFERENCE TO RELATED U.S. APPLICATIONS
[0001] This application is a Divisional of co-pending U.S. application Ser. No. 10/132,835, filed Apr. 25, 2002 incorporated by reference herein.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10132835 |
Apr 2002 |
US |
Child |
10873552 |
Jun 2004 |
US |