Claims
- 1. A structure comprising:
- a substrate having a surface;
- at least a part said substrate being a dielectric body housing an electronic device;
- said solid solution containing materials selected from the group consisting of a substituted and unsubstituted polyparaphenylenevinylenes, polyanilines, polyazines, polythiophenes, poly-p-phenylene sulfides, polyfuranes, polypyrroles, polyselenophene, polyacetylenes formed from soluble precursors and combinations thereof and containing a dissociated doping precursor selected from the group consisting of onion salts, iodonium salts, triflate salts, borate salts and tosylate salts and sulfonyloximides;
- 2. The structure of claim 1, further including a first resist material disposed between said surface and said solid solution.
- 3. The structure of claim 1 further including a resist material disposed over said solid solution.
- 4. The structure of claim 1 wherein said substrate is a plastic.
- 5. The structure of claim 1, wherein said solid solution provides electromagnetic shielding.
- 6. The structure of claim 1, wherein said solid solution provides electromagnetic discharge properties to said surface.
- 7. The structure of claim 1, wherein said solution has a conductivity greater than about 10.sup.-6 OHM.sup.-1.
- 8. The structure of claim 1 wherein said surface is a dielectric surface.
- 9. The structure of claim 1, wherein said electronic device is an integrated circuit.
Parent Case Info
This is a division of application Ser. No. 07/357,565, filed May 26, 1989.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4804594 |
Jow et al. |
Feb 1989 |
|
4962158 |
Kobayashi |
Oct 1990 |
|
4963206 |
Shacklette et al. |
Oct 1990 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
357565 |
May 1989 |
|