Materials of the insulating layers or coatings

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49894Materials of the insulating layers or coatings

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Polymer material in a redistribution structure of a semiconductor p...
- Patent number 12,265,330
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having an embedded etch stop to control cavity...
- Patent number 12,255,147
- Issue date Mar 18, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package configuration
- Patent number 12,255,180
- Issue date Mar 18, 2025
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-mold substrate and method of manufacturing pre-mold substrate
- Patent number 12,249,571
- Issue date Mar 11, 2025
- HAESUNG DS CO., LTD.
- Kwang Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,230,557
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Sangwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and substrate
- Patent number 12,224,236
- Issue date Feb 11, 2025
- Kioxia Corporation
- Hideo Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested interposer with through-silicon via bridge die
- Patent number 12,218,040
- Issue date Feb 4, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetrical substrate for semiconductor packaging
- Patent number 12,205,879
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package having redistribution pattern between semicond...
- Patent number 12,191,246
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Kwanjai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid glass core for wafer level and panel level packaging applica...
- Patent number 12,191,240
- Issue date Jan 7, 2025
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid mold chase surface for semiconductor bonding and related sys...
- Patent number 12,191,164
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Byung Hoon Moon
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming an artificial intelligence processor with three-d...
- Patent number 12,166,011
- Issue date Dec 10, 2024
- Kepler Computing Inc.
- Rajeev Kumar Dokania
- G11 - INFORMATION STORAGE
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,165,962
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-to-metal adhesion promotion material
- Patent number 12,159,825
- Issue date Dec 3, 2024
- Intel Corporation
- Rahul Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding module pins to an electronic substrate
- Patent number 12,160,060
- Issue date Dec 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structure and method of manufacture
- Patent number 12,131,984
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing package impedance discontinuity through dielectric struc...
- Patent number 12,125,777
- Issue date Oct 22, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,119,291
- Issue date Oct 15, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBC substrate for power semiconductor devices, method for fabricati...
- Patent number 12,119,284
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacture of semiconductor devices having redistributi...
- Patent number 12,119,235
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and mounting substrate
- Patent number 12,119,293
- Issue date Oct 15, 2024
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices and methods of manufacturing electronic devices
- Patent number 12,119,319
- Issue date Oct 15, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Yeul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dielectric liners on through glass vias
- Patent number 12,087,623
- Issue date Sep 10, 2024
- YIELD ENGINEERING SYSTEMS, INC.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE
- Publication number 20250118647
- Publication date Apr 10, 2025
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...
- Publication number 20250112138
- Publication date Apr 3, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...
- Publication number 20250112155
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING HIGH ACCURACY EMBEDDED RESISTORS IN FLEX SUBS...
- Publication number 20250113501
- Publication date Apr 3, 2025
- Eagle Technology, LLC
- Matt BAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250112137
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...
- Publication number 20250112144
- Publication date Apr 3, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...
- Publication number 20250113434
- Publication date Apr 3, 2025
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOTWIN LINER FOR THROUGH GLASS VIAS
- Publication number 20250106982
- Publication date Mar 27, 2025
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INSULATING MATERIAL
- Publication number 20250105133
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jinyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
- Publication number 20250105119
- Publication date Mar 27, 2025
- Intel Corporation
- Yuqin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING FCBGA PACKAGE SUBSTRATE
- Publication number 20250087500
- Publication date Mar 13, 2025
- Shanghai Meadville Science & Technology Co., Ltd.
- Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS THROUGH GLASS VIAS (TGVS)
- Publication number 20250089156
- Publication date Mar 13, 2025
- Intel Corporation
- Mohamed R. SABER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20250087568
- Publication date Mar 13, 2025
- Murata Manufacturing Co., Ltd.
- Issei YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Fine Pitch Organic Inte...
- Publication number 20250087499
- Publication date Mar 13, 2025
- STATS ChipPAC Pte Ltd.
- KiRak SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250079289
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Jincheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250079244
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGN...
- Publication number 20250079281
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH NOTCHED, INTERDIGITATED, AND RETRACTED METAL LAYERS
- Publication number 20250079282
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250079190
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Jincheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC
- Publication number 20250079366
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
- Publication number 20250070493
- Publication date Feb 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE CRACKING IN GLASS CORES
- Publication number 20250062207
- Publication date Feb 20, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Implantation
- Publication number 20250062136
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD...
- Publication number 20250059347
- Publication date Feb 20, 2025
- FUJIFILM CORPORATION
- Kazuya OOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE INCLUDING BRIDGE STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250054867
- Publication date Feb 13, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250046742
- Publication date Feb 6, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250038100
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Daehun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Materials of the insulating layers or coatings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Polymer material in a redistribution structure of a semiconductor p...

Electronic substrate having an embedded etch stop to control cavity...

3D package configuration

Pre-mold substrate and method of manufacturing pre-mold substrate

Semiconductor package

Semiconductor device and substrate

Multi-chip package with high density interconnects

Semiconductor device

Nested interposer with through-silicon via bridge die

Symmetrical substrate for semiconductor packaging

Fine pitch copper pillar package and method

Chip-on-film package having redistribution pattern between semicond...

Hybrid glass core for wafer level and panel level packaging applica...

Hybrid mold chase surface for semiconductor bonding and related sys...

Method of forming an artificial intelligence processor with three-d...

Hermetic sealing structures in microelectronic assemblies having di...

Dielectric-to-metal adhesion promotion material

Bonding module pins to an electronic substrate

Electrical interconnect bridge

Power amplifier modules including semiconductor resistor and tantal...

Heterogeneous fan-out structure and method of manufacture

Minimizing package impedance discontinuity through dielectric struc...

Hermetic sealing structures in microelectronic assemblies having di...

DBC substrate for power semiconductor devices, method for fabricati...

Methods of manufacture of semiconductor devices having redistributi...

Through electrode substrate and mounting substrate

Electronic devices and methods of manufacturing electronic devices

Hybrid nanosilver/liquid metal ink composition and uses thereof

Dielectric liners on through glass vias

Through-hole electrode substrate

Patents Applicationslast 30 patents

NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE

MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...

CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...

METHOD OF FABRICATING HIGH ACCURACY EMBEDDED RESISTORS IN FLEX SUBS...

INTEGRATED CIRCUIT PACKAGE AND METHOD

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...

THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...

NANOTWIN LINER FOR THROUGH GLASS VIAS

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

SEMICONDUCTOR PACKAGE INCLUDING INSULATING MATERIAL

SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY

INTEGRATED CIRCUIT DEVICE

METHOD FOR PREPARING FCBGA PACKAGE SUBSTRATE

LOW STRESS THROUGH GLASS VIAS (TGVS)

MULTILAYER SUBSTRATE

Semiconductor Device and Method of Making a Fine Pitch Organic Inte...

SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME

METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGN...

PACKAGES WITH NOTCHED, INTERDIGITATED, AND RETRACTED METAL LAYERS

SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC

BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE

METHODS AND APPARATUS TO REDUCE CRACKING IN GLASS CORES

Packages with Implantation

RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD...

FAN-OUT PACKAGE INCLUDING BRIDGE STRUCTURE AND METHOD OF MANUFACTUR...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Heterogeneous Fan-Out Structure and Method of Manufacture