Claims
- 1. A method for removing solder and other debris from electrical contacts comprising:
coupling a positive lead of a power source to the electrical contacts to be cleaned; coupling a negative lead of the power source to a collection plate; placing the electrical contacts and the collection plate in a electrolyte solution; and applying a bias voltage from the power supply to the leads causing the solder and other debris from the electrical contacts to be removed.
- 2. The method of claim 1 further comprising circulating the electrolyte solution.
- 3. The method of claim 1 further comprising:
coupling a current meter in series with the with the power supply; and monitoring the current meter until a current level is approximately zero; and turning off the power supply when the current level is approximately zero.
- 4. The method of claim 1 further comprising applying a reverse polarity.
- 5. The method of claim 4 wherein applying a reverse polarity comprises:
removing the positive lead from the electrical contacts; removing the negative lead from the collection plate; coupling the positive lead to the collection plate; and coupling the negative lead to the electrical contacts.
- 6. The method of claim 1 further comprising providing an electrolyte solution of approximately 0.50 molar ammonium acetate, approximately 0.06 molar lead acetate, and approximately 0.6 molar tin fluoride.
- 7. The method of claim 1 further comprising applying a voltage of approximately 0.33 volts from the power source to the electrical contacts.
- 8. The method of claim 1 further comprising coupling the positive lead of the power supply to the electrical contacts by using a stainless steel fiber pad.
- 9. The method of claim 1 wherein the power supply is a DC power supply.
- 10. A method for removing solder and other debris from electrical contacts comprising:
coupling a positive lead of a power source to the electrical contacts to be cleaned; coupling a negative lead of the power source to a collection plate; coupling a current meter in series with the with the power supply; placing the electrical contacts and the collection plate in a electrolyte solution; circulating the electrolyte solution; applying a bias voltage from the power supply to the leads causing the solder and other debris from the electrical contacts; monitoring the current meter until a current level is approximately zero; and turning off the power supply when the current level is approximately zero.
- 11. The method of claim 10 further comprising applying a reverse polarity.
- 12. The method of claim 11 wherein applying a reverse polarity comprises:
removing the positive lead from the electrical contacts; removing the negative lead from the collection plate; coupling the positive lead to the collection plate; and coupling the negative lead to the electrical contacts.
- 13. The method of claim 10 further comprising providing an electrolyte solution of approximately 0.50 molar ammonium acetate, approximately 0.06 molar lead acetate, and approximately 0.6 molar tin fluoride.
- 14. The method of claim 10 further comprising applying a voltage of approximately 0.33 volts from the power source to the electrical contacts.
- 15. The method of claim 1 further comprising coupling the positive lead of the power supply to the electrical contacts by using a stainless steel fiber pad.
- 16. The method of claim 10 wherein the power supply is a DC power supply.
RELATED APPLICATIONS
[0001] This patent application is claiming the benefit of the U.S. Provisional Application having an application number of 60/361,883, filed Mar. 5, 2002, in the name of Erik Orwoll, and entitled “ELECTRO-CHEMICAL CLEANING PROCESS FOR ELECTRICAL CONNECTIONS”.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60361883 |
Mar 2002 |
US |