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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4864Cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resistor layer, and method of manufacturing sem...
- Patent number 12,164,232
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate
- Patent number 12,125,626
- Issue date Oct 22, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 12,087,596
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate for radio frequency applications
- Patent number 12,051,653
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate and method for manufacturing inductor b...
- Patent number 12,020,843
- Issue date Jun 25, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,887,934
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for isolating a conductive via from a glass substrate
- Patent number 11,798,816
- Issue date Oct 24, 2023
- University of Central Florida Research Foundation, Inc.
- Omar Saad Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,798,893
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resist layer, and method of manufacturing semic...
- Patent number 11,789,366
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,715,700
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 11,621,230
- Issue date Apr 4, 2023
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,521,935
- Issue date Dec 6, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 11,488,899
- Issue date Nov 1, 2022
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,476,202
- Issue date Oct 18, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,456,269
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate for radio frequency applications
- Patent number 11,417,605
- Issue date Aug 16, 2022
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,398,433
- Issue date Jul 26, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resist layer, and method of manufacturing semic...
- Patent number 11,378,886
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,348,876
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing inductor built-in substrate
- Patent number 11,322,301
- Issue date May 3, 2022
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,289,426
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, assembly structure and method for manufacturing...
- Patent number 11,282,772
- Issue date Mar 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,264,333
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,264,331
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20250060676
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20240404960
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
- Publication number 20240332153
- Publication date Oct 3, 2024
- Intel Corporation
- Tchefor NDUKUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237221
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SOLDER MASK
- Publication number 20240170438
- Publication date May 23, 2024
- NXP USA, Inc.
- Aznita Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138071
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240055360
- Publication date Feb 15, 2024
- FARADAY SEMI, INC.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038674
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20240021533
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006300
- Publication date Jan 4, 2024
- Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRON...
- Publication number 20230420353
- Publication date Dec 28, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANED PACKAGING SUBSTRATE AND CLEANED PACKAGING SUBSTRATE MANUFAC...
- Publication number 20230411172
- Publication date Dec 21, 2023
- ABSOLICS INC.
- Sungjin KIM
- B08 - CLEANING
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20230384684
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20230187370
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE
- Publication number 20230027220
- Publication date Jan 26, 2023
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING SEMICONDUCTOR RESISTOR AND TANTAL...
- Publication number 20220393653
- Publication date Dec 8, 2022
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20220359409
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20220299880
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
- Publication number 20220285310
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR REMOVING PHOTORESIST
- Publication number 20220285172
- Publication date Sep 8, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Yukihide NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216159
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...
- Publication number 20220130686
- Publication date Apr 28, 2022
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20220100097
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20220068823
- Publication date Mar 3, 2022
- FARADAY SEMI, INC.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ISOLATING A CONDUCTIVE VIA FROM A GLASS SUBSTRATE
- Publication number 20210407820
- Publication date Dec 30, 2021
- University of Central Florida Research Foundation, Inc.
- Omar Saad Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
- Publication number 20210343545
- Publication date Nov 4, 2021
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20210257306
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20210257307
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210210454
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package device

Semiconductor package and manufacturing method thereof

Electrical devices and methods of manufacture

Method for removing resistor layer, and method of manufacturing sem...

Power amplifier modules including semiconductor resistor and tantal...

Inductor built-in substrate

Controlling of height of high-density interconnection structure on...

Reconstituted substrate for radio frequency applications

Inductor built-in substrate and method for manufacturing inductor b...

Package structure and fabrication methods

Method for isolating a conductive via from a glass substrate

Semiconductor package and manufacturing method thereof

Method for removing resist layer, and method of manufacturing semic...

Reconstituted substrate structure and fabrication methods for heter...

Electrical devices and methods of manufacture

Package structure and fabrication methods

Package device

Reconstituted substrate structure and fabrication methods for heter...

Prevention of bridging between solder joints

Power amplifier systems with control interface and bias circuit

Reconstituted substrate for radio frequency applications

Reconstituted substrate structure and fabrication methods for heter...

Method for removing resist layer, and method of manufacturing semic...

Semiconductor package and method of fabricating the same

Bonding with pre-deoxide process and apparatus for performing the same

Method for manufacturing inductor built-in substrate

Semiconductor package and manufacturing method thereof

Package structure, assembly structure and method for manufacturing...

Reconstituted substrate structure and fabrication methods for heter...

Package structure and fabrication methods

Patents Applicationslast 30 patents

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION

METHOD FOR MANUFACTURING WIRING SUBSTRATE

PACKAGE WITH SOLDER MASK

METHOD FOR MANUFACTURING WIRING SUBSTRATE

ELECTRICAL DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRON...

CLEANED PACKAGING SUBSTRATE AND CLEANED PACKAGING SUBSTRATE MANUFAC...

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

PACKAGE STRUCTURE AND FABRICATION METHODS

PACKAGE DEVICE

POWER AMPLIFIER MODULES INCLUDING SEMICONDUCTOR RESISTOR AND TANTAL...

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

COMPOSITION FOR REMOVING PHOTORESIST

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

ELECTRICAL DEVICES AND METHODS OF MANUFACTURE

METHOD FOR ISOLATING A CONDUCTIVE VIA FROM A GLASS SUBSTRATE

CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...

PACKAGE STRUCTURE AND FABRICATION METHODS

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS