Electrochromic coated glass articles and methods for laser processing the same

Information

  • Patent Grant
  • 11556039
  • Patent Number
    11,556,039
  • Date Filed
    Friday, October 7, 2016
    7 years ago
  • Date Issued
    Tuesday, January 17, 2023
    a year ago
Abstract
Disclosed herein are glass articles coated on at least one surface with an electrochromic layer and comprising minimal regions of laser damage, and methods for laser processing such glass articles. Insulated glass units comprising such coated glass articles are also disclosed herein.
Description
FIELD OF THE DISCLOSURE

The disclosure relates generally to electrochromic coated glass articles and more particularly to methods for laser processing such articles. The disclosure also relates to insulated glass units comprising glass substrates coated with an electrochromic layer.


BACKGROUND

Glass substrates coated with electrochromic films may be useful in a variety of applications, including architectural and automotive applications. For example, electrochromic films may be used to vary light intensity and/or light absorption in a room or vehicle. Insulated glass units (IGUs) can comprise two sheets of glass with a perimeter seal forming a cavity between the glass sheets, which can be filled with an insulated gas such as argon to improve the energy rating of the IGU. In certain applications, one of the glass sheets in the IGU may be coated with an electrochromic layer. Such coated IGUs may additionally include one or more components for applying voltage to the electrochromic layer, e.g., bus bars, thereby providing a tinting effect which may lower the transmission of various wavelengths and/or heat by the IGU.


During the manufacture of IGUs or any other glass articles comprising an electrochromic layer, the electrochromic layer may be applied to the glass after cutting and grinding steps due to the sensitivity of these films to moisture and particles generated during these steps. For instance, exposure of electrochromic films to aqueous coolants used during the grinding process may result in blistering and/or breakdown of the films, thereby inhibiting their functionality and/or aesthetic qualities. As such, for traditional IGU production, a glass sheet is often first cut to the desired IGU shape and size and then coated with the electrochromic film (“cut-and-coat”), rather than coating a large glass substrate with an electrochromic film and then cutting the coated substrate to size (“coat-and-cut”).


However, the cut-and-coat process can result in a glass substrate having a significant area that is not coated or is not uniformly coated by the electrochromic layer due to fixturing. For example, the components for positioning and holding the glass substrate in place in the coating apparatus may interfere with the ability to coat the glass substrate edge-to-edge. Additionally, the coat-and-cut process may have reduced manufacturing flexibility, because the fixturing must is specific to each glass substrate shape and/or size and must be adjusted to accommodate different glass shapes and/or sizes. In contrast, a coat-and-cut process can implement a single standard fixturing for a large glass substrate and the glass substrate can be subsequently cut to size (coat-and-cut).


Accordingly, it would be advantageous to provide methods for producing glass substrates coated with an electrochromic film which do not substantially damage the electrochromic film and/or do not result in glass substrates comprising uncoated or non-uniformly coated regions. Additionally, it would be advantageous to provide methods for manufacturing such electrochromic coated glass articles which can exhibit increased manufacturing flexibility and/or reduced manufacturing cost, e.g., methods which can be used to coat a glass substrate having a generic shape and/or size and subsequently cut the glass to a specific shape and/or size for a desired application.


SUMMARY

The disclosure relates, in various embodiments, to glass articles comprising a first surface, an opposing second surface, and an electrochromic coating disposed on at least a portion of the second surface, wherein upon application of voltage to the glass article a first region of a coated portion of the glass substrate has a first visible light transmission that is less than a second visible light transmission of a second region of the coated portion. According to some embodiments, the first region may be tinted and the second region may not be tinted upon application of voltage. In various embodiments, the first and second regions may be separated by a contour comprising a plurality of defect spots or lines, In some embodiments, the defect lines may be linear or curved when viewed orthogonally to the first or second surface. According to additional embodiments, the first and/or second regions may comprise a pattern on the glass article when viewed orthogonally to the first or second surface.


Further disclosed herein are glass articles comprising a first surface, an opposing second surface, and an electrochromic coating disposed on substantially all of the second surface, wherein the electrochromic coating comprises a laser damaged peripheral region proximate at least one edge of the glass article, the laser damaged peripheral region having a width of less than about 10 mm, 1 mm, or 0.1 mm. Insulated glass units comprising such glass articles are further disclosed herein.


In an aspect (1), the disclosure provides an electrochromic glass article comprising: a glass substrate comprising a first surface, an opposing second surface, and one or more edges, wherein at least one or more of the one or more edges comprises a laser-modified edge; an electrochromic coating disposed on at least a portion of the second surface, and comprising at least two electrically discontinuous regions, each having a contour; and wherein the two electrically discontinuous regions are separated by a laser-modified discontinuity line having a width from about 0.1 μm to about 25 μm. In an aspect (2), the disclosure provides the electrochromic glass article of aspect (1), wherein the electrochromic coating comprises tungsten oxide. In an aspect (3), the disclosure provides the electrochromic glass article of aspect (1) or (2), wherein the electrically discontinuous regions are not substantially laser damaged. In an aspect (4), the disclosure provides the electrochromic glass article of any of aspects (1)-(3), wherein the second surface of the glass substrate proximate to the laser-modified discontinuity line is not substantially laser damaged. In an aspect (5), the disclosure provides the electrochromic glass article of aspect (4), wherein the contour of at least one of the at least two electrically discontinuous regions is non-linear. In an aspect (6), the disclosure provides the electrochromic glass article of any of aspects (1)-(5), wherein the laser cut discontinuity is a continuous line formed by a laser with a pulse width from 10−10 to 10−15 seconds at FWHM. In an aspect (7), the disclosure provides the electrochromic glass article of any of aspects (1)-(6), wherein the second region comprises a pattern in the first region or the first region comprises a pattern in the second region. In an aspect (8), the disclosure provides the electrochromic glass article of any of aspects (1)-(7), wherein the glass article comprises a glass sheet having a thickness ranging from about 0.1 mm to about 10 mm. In an aspect (9), the disclosure provides the electrochromic glass article of any of aspects (1)-(8), wherein one of the at least two electrically discontinuous regions comprises a region of the second surface proximate to the one or more edges of the glass substrate. In an aspect (10), the disclosure provides the electrochromic glass article of aspect (9), wherein the electrically discontinuous region proximate to the one or more edges of the glass substrate has a width of less than about 0.1 mm. In an aspect (11), the disclosure provides the electrochromic glass article of aspect (9), wherein the he electrically discontinuous region proximate to the one or more edges of the glass substrate comprises about 5% or less of the coated portion of the glass article.


In an aspect (12), the disclosure provides a glass article comprising a first surface, an opposing second surface, and an electrochromic coating disposed on substantially all of the second surface, wherein the electrochromic coating comprises a laser damaged peripheral region proximate at least one edge of the glass article, the laser damaged peripheral region having a width of less than about 0.1 mm. In an aspect (13), the disclosure provides the glass article of aspect (12), wherein the laser damaged peripheral region comprises about 5% or less of the second surface of the glass article. In an aspect (14), the disclosure provides the glass article of aspect (12) or (13), wherein the at least one edge has a linear or curved contour. In an aspect (15), the disclosure provides the glass article of any of aspects (12)-(14), wherein the glass article comprises a glass sheet having a thickness ranging from about 0.1 mm to about 10 mm. In an aspect (16), the disclosure provides the glass article of any of aspects (12)-(15), wherein a coated portion of the second surface comprises a first region and a second region, and wherein upon application of voltage to the glass article the first region has a first visible light transmission that is less than a second visible light transmission of the second region. In an aspect (17), the disclosure provides the glass article of aspect (16), wherein the first and second regions are separated by a discontinuity line comprising one or more laser lines. In an aspect (18), the disclosure provides the glass article of aspect (17), wherein the contour is linear or curved.


In an aspect (19), the disclosure provides an insulated glass unit comprising the electrochromic glass article of any of aspects (1)-(11).


In an aspect (20), the disclosure provides an insulated glass unit comprising the glass article of any of aspect (12)-(18).


Additional features and advantages of the disclosure will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the methods as described herein, including the detailed description which follows, the claims, as well as the appended drawings.


It is to be understood that both the foregoing general description and the following detailed description present various embodiments of the disclosure, and are intended to provide an overview or framework for understanding the nature and character of the claims. The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated into and constitute a part of this specification. The drawings illustrate various embodiments of the disclosure and together with the description serve to explain the principles and operations of the disclosure.





BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed description can be further understood when read in conjunction with the following drawings, wherein, when possible, like numerals refer to like components, it being understood that the appended figures are not necessarily drawn to scale.



FIGS. 1A-B illustrate a glass substrate with a contour comprising a plurality of defect lines;



FIGS. 2A-B illustrate the positioning of a laser beam focal line to induce absorption in a glass substrate along the focal line;



FIG. 3 illustrates an optical assembly for focusing a laser beam into a laser beam focal line according to various embodiments of the disclosure;



FIGS. 4A-C illustrate a glass substrate comprising electrochromic coated and uncoated regions according to certain embodiments of the disclosure.





DETAILED DESCRIPTION
Methods

The glass articles disclosed herein can be manufactured using one or more methods for creating small (e.g., 100, 10, or 1 micron or smaller) “holes” in the glass for the purpose of drilling, cutting, separating, perforating, or otherwise processing the materials optionally in combination with one or more methods of inducing defects or discontinuities in a electrochromic layer that is coated on the glass. In certain embodiments, an ultrashort (i.e., pulse width from 10−10 to 10−15 second FWHM, e.g., nanosecond to femtosecond) pulsed laser beam (operating at wavelengths such as 1064, 532, 355 or 266 nm, for example) can be focused to an energy density above a threshold at which defects can be created in the region of focus at the surface of or within the glass. By repeating the process, a series of laser-induced defects aligned along a predetermined path or contour can be created. In some embodiments, the laser-induced defect lines can be spaced sufficiently close together, such that a controlled region of mechanical weakness within the glass can be created and optionally used to fracture or separate (mechanically or thermally) the material along the defined contour. For example, after contact with the ultrashort pulsed laser, the material may be contacted with a second laser beam, e.g., an infrared laser such as a carbon dioxide (CO2) laser, or other source of thermal stress, to separate the glass into one or more portions.


According to various embodiments, one or more vertical fault or defect spots, series of spots, or lines can be created in a glass substrate, which can delineate a contour or path of least resistance along which the substrate can be separated to define a desired shape, wherein the contour comprises a plurality of defect lines or regions extending from the first surface to the opposing second surface of the glass substrate. The substrate to be processed may be irradiated with an ultrashort pulsed laser beam (e.g., pulse width<100 psec; wavelength≤1064 nm) that may be condensed into a high aspect ratio focal line penetrating all or a portion of the substrate thickness.


Within this volume of high energy density, the substrate may be modified via nonlinear effects, which can be triggered by the high optical intensity. Below this intensity threshold, the substrate may be transparent to the laser radiation and may not be modified to produce defect lines. As used herein, a substrate is “substantially transparent” to the laser wavelength when the substrate absorption is less than about 10%, e.g., less than about 5%, or less than about 1%, per mm of substrate depth at the wavelength of the laser. By scanning the laser over a desired contour or path, one or more narrow defect lines can be created in the substrate and the contour can define a perimeter or shape along which the glass substrate can be separated and/or a tinted or untinted region of the coated substrate.


The ultrashort pulsed laser can create multi-photon absorption (“MPA”) in substantially transparent materials such as glass. MPA is the simultaneous absorption of two or more photons of identical or different frequencies in order to excite a molecule from one state, usually the ground state, to a higher energy electronic state. The energy difference between the involved lower and upper states of the molecule is equal to the sum of the energies of the two photons. MPA, also called induced absorption, can be a second or third-order process, for example, that is several orders of magnitude weaker than linear absorption. It differs from linear absorption in that the strength of induced absorption can be proportional to the square of the light intensity, for example, and thus it is a nonlinear optical process.


The pulsed laser beam may have a wavelength chosen from those at which the substrate is substantially transparent, e.g., wavelengths less than or equal to about 1064 nm, such as 532, 355, or 266 nanometers, including all ranges and subranges therebetween. Exemplary power levels for the pulsed laser can range, in some embodiments, from about 10 W to about 150 W, such as from about 25 W to about 125 W, or from about 50 W to about 100 W, including all ranges and subranges therebetween. According to various embodiments, the pulsed laser beam can have a pulse duration of less than 10 nanoseconds, for example about 100 picoseconds. In some embodiments the pulsed laser beam has a pulse duration from greater than about 1 picosecond to less than about 100 picoseconds, e.g., ranging from about 5 picoseconds to about 50 picoseconds, from about 10 picoseconds to about 30 picoseconds, or from about 15 picoseconds to about 20 picoseconds, including all ranges and subranges therebetween. In additional embodiments, the pulse repetition rate of the pulsed laser beam can range from about 1 kHz to about 4 MHz, such as from about 10 kHz to about 650 kHz, from about 50 kHz to about 500 kHz, from about 100 kHz to about 400 kHz, or from about 200 kHz to about 300 kHz, including all ranges and subranges therebetween.


The pulsed laser beam can operate, in some embodiments, in a single pulse mode or, in other embodiments, in burst mode. In the latter embodiments, a pulse burst can comprise two or more pulses, such as, for example, 3, 4, 5, 10, 15, 20, 25, or more pulses per burst, including all ranges and subranges therebetween. A duration between individual pulses in a pulse burst may range, for instance, from about 1 nanosecond to about 50 nanoseconds, such as from about 10 nanoseconds to about 30 nanoseconds, or from about 20 nanoseconds to about 40 nanoseconds, including all ranges and subranges therebetween. A duration between pulse bursts can range, in certain embodiments, from about 1 microsecond to about 20 microseconds, such as from about 5 microseconds to about 10 microseconds, including all ranges and subranges therebetween. Accordingly, a burst repetition frequency of the pulsed laser beam can range from about 1 kHz to about 200 kHz, such as from about 20 kHz to about 150 kHz, or from about 50 kHz to about 100 kHz, including all ranges and subranges therebetween.


In burst mode, an average laser power per burst can range from about 50 μJ/burst to about 1000 μJ/burst, such as from about 100 μJ/burst to about 750 μJ/burst, from about 200 μJ/burst to about 500 μJ/burst, or from about 250 μJ/burst to about 400 μJ/burst, including all ranges and subranges therebetween. According to additional embodiments, the average laser power applied to a given material can be measured as μJ/burst per mm of material and can, for instance, be greater than about 40 μJ/burst per unit thickness (mm) of a given material (e.g., glass), such as ranging from about 40 μJ/burst/mm to about 2500 μJ/burst/mm, from about 100 μJ/burst/mm to about 2000 μJ/burst/mm, from about 250 μJ/burst/mm to about 1500 μJ/burst/mm, or from about 500 μJ/burst/mm to about 1000 μJ/burst/mm, including all ranges and subranges therebetween. For example, a 0.1-0.2 mm thick Corning Eagle XG® glass substrate can be processed using a 200 μJ/burst pulsed laser to give an exemplary laser power of 1000-2000 μJ/burst/mm. In another non-limiting example, a 0.5-0.7 mm thick Corning Eagle XG® glass substrate can be processed using a 400-700 μJ/burst pulsed laser to give an exemplary laser power of 570-1400 μJ/burst/mm.


According to non-limiting embodiments, the glass substrate and pulsed laser beam may be translated relative to each other, e.g., the glass substrate may be translated relative to the pulsed laser beam and/or the pulsed laser beam may be translated relative to the glass substrate, to create a contour. In one specific embodiment, the glass substrate is translated and the pulsed laser is applied thereto while the pulsed laser is itself translated. For example, in roll to roll processing, the glass substrate may be very long, for example tens of meters long or more, and translate substantially continuously during laser processing. The laser is translated at the appropriate speed and along the appropriate vectors to create one or more contours in the glass substrate. Either the substrate or the laser may change their speed during this processing.


The contour can comprise a plurality of defect lines that may trace or define the perimeter of a shape to be created, either by subsequent separation or by subsequent application of voltage (e.g., tinting). The translation or scan speed can depend on various laser processing parameters including, for instance, laser power and/or repetition rate. Exemplary translation or scan speeds can range, for instance, from about 1 mm/s to about 5000 mm/s, such as from about 100 mm/s to about 4000 mm/s, from about 200 mm/s to about 3000 mm/s, from about 300 mm/s to about 2500 mm/s, from about 400 mm/s to about 2000 mm/s, or from about 500 mm/s to about 1000 m/s, including all ranges and subranges therebetween.


The repetition rate and/or scan speed of the pulsed laser beam can be varied to create a desired periodicity (or pitch) between defect lines. In some embodiments, the defect lines may be spaced apart by about 0.5 μm to about 25 μm, such as from about 1 μm to about 20 μm, from about 2 μm to about 15 μm, from about 3 μm to about 12 μm, from about 4 μm to about 10 μm, or from about 5 μm to about 8 μm, including all ranges and subranges therebetween. For example, for a linear cutting (or scan) speed of 300 mm/s, a 3 μm periodicity between defect lines corresponds to a pulsed laser having a burst repetition rate of at least 100 kHz. Similarly, for a scan speed of 600 mm/s, a 3 μm periodicity between defect lines corresponds to a pulsed laser having a burst repetition rate of at least 200 kHz.


Additionally, the dimensions of the defect lines can be affected, for instance, by the laser focusing parameters, such as the length of the laser beam focal line and/or the average spot diameter of the laser beam focal line. The pulsed laser can be used, for example, to create one or more defect lines having a relatively high aspect ratio (length:diameter), such that a very thin, long defect line can be produced that extends, in some embodiments, from the first surface to the opposing second surface of the substrate. Such defect lines can, in principle, be created by a single laser pulse, or additional pulses can be used to increase the affected area (e.g., increased defect line length and/or width).


As generally illustrated in FIGS. 1A-B, methods for cutting a glass substrate 130 comprising an electrochromic layer 150 can comprise creating a contour or fault line 110 comprising a plurality of defect lines 120 in the substrate to be processed using a pulsed laser 140. The defect lines 120 may extend, for example, through the thickness of the glass substrate, e.g., approximately orthogonal to the major (flat) surfaces a, b of the glass sheet. While a linear contour, such as the contour 110 illustrated in FIG. 1A, can be created by translating the glass substrate 130 and/or pulsed laser 140 in one dimension, a curved or nonlinear contour can also be created by translating the glass substrate and/or pulsed laser in two dimensions. As shown in FIG. 1B, the glass substrate 130 can then be separated along the contour 110 to produce two separate portions 130a and 130b, wherein the separated edges or surfaces are defined by the contour 110, each portion comprising an electrochromic layer 150.


Referring to FIGS. 2A-B, methods for laser processing a substrate can include focusing a pulsed laser beam 2 into a laser beam focal line 2b oriented along the beam propagation direction. A laser (not shown) may emit pulsed laser beam 2, which may have a portion 2a incident to an optical assembly 6. The optical assembly 6 may convert the incident portion 2a of the laser beam into a laser beam focal line 2b along the beam direction, which may have a length L and a diameter D. A substrate 1 may be positioned in the beam path to at least partially overlap with the laser beam focal line 2b, which may thus be directed into the substrate 1. A first surface 1a may be positioned to face the optical assembly 6, whereas an opposing second surface 1b may be positioned to face away from the optical assembly 6, or vice versa. A thickness d of the substrate may extend perpendicularly between surfaces 1a and 1b.


As depicted in FIG. 2A, substrate 1 may be aligned perpendicular to the longitudinal axis of the laser beam and the focal line 2b produced by the optical assembly 6. In various embodiments (as depicted), the focal line 2b may begin before the surface 1a of the substrate 1 and may not extend beyond surface 1b. Of course other focal line orientations can be used, such that the focal line 2b begins after the surface 1a and/or does extend beyond surface 1b (not shown). The area in which the laser beam focal line and substrate overlap may be modified by nonlinear multiphoton or induced absorption of the laser energy, assuming sufficient laser intensity along the laser beam focal line 2b, which intensity can be produced by focusing the laser beam 2 on a section of length l, i.e., a line focus of length l.


The induced absorption can produce defect line formation in the substrate material along section 2c. In some embodiments, the defect line may be a microscopic series of (e.g., 100 nm<diameter<10 μm) “holes” (also called a perforation or defect line). According to various embodiments, individual perforations can be created at rates of several hundred kHz (several hundred thousand perforations per second). By translating the substrate and pulsed laser relative to each other, these perforations can be created adjacent to one another with a desired spatial separation (also referred to as periodicity or pitch). The periodicity of the defect lines can be selected as desired to facilitate separation of the substrate and/or to create a desired tinting effect. Exemplary periodicity between the defect lines can range, for instance, from about 0.5 μm to about 25 μm, such as from about 1 μm to about 20 μm, from about 2 μm to about 15 μm, from about 3 μm to about 12 μm, from about 4 μm to about 10 μm, or from about 5 μm to about 8 μm, including all ranges and subranges therebetween.


In certain non-limiting embodiments, the defect line may be a “through hole” or open channel extending from the first surface 1a to the opposing second surface 1b, e.g., extending across the entire thickness d of the substrate 1. Defect line formation can also extend across a portion of the substrate thickness, as indicated by section 2c having length L in FIG. 2A. The length L of section 2c thus corresponds to the length of the overlap between the laser beam focal line 2b with the substrate 1 and the length of the resulting defect line. The average diameter D of section 2c may correspond more or less to the average diameter of the laser beam focal line 2b. Referring to FIG. 2B, the substrate 1 exposed to the laser beam 2 in FIG. 2A will eventually expand due to induced absorption of the laser energy such that a corresponding induced tension in the material may lead to microcrack formation. The induced tension may be greatest at surface 1a, according to various embodiments.


As defined herein, the width of a defect line corresponds to the internal width of the open channel or diameter air hole produced in the glass substrate. For example, in some embodiments, the width of the defect line may range from about 0.1 μm to about 5 μm, such as from about 0.25 μm to about 4 μm, from about 0.5 μm to about 3.5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, including all ranges and subranges therebetween. The width of a defect line can, in some embodiments, be as large as the average spot diameter of the laser beam focal line, e.g., the average spot diameter of the laser beam focal line may also range from about 0.1 μm to about 5 μm, such as from about 0.25 μm to about 4 μm, from about 0.5 μm to about 3.5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, including all ranges and subranges therebetween. In embodiments in which the glass substrate is separated along a contour comprising a plurality of defect lines, the defect lines may be potentially viewed along the cut edge(s) of the separated portions, and these regions can have widths comparable to the widths of the defect lines, e.g., from about 0.1 μm to about 5 μm.


The pulsed laser beam can be focused into a laser beam focal line having any desired length l, which can vary, e.g., depending on the selected optical assembly configuration. In some embodiments, the laser beam focal line length can range, for example, from about 0.01 mm to about 100 mm, such as from about 0.1 mm to about 50 mm, from about 0.5 mm to about 20 mm, from about 1 mm to about 10 mm, from about 2 mm to about 8 mm, or from about 3 mm to about 5 mm, including all ranges and subranges therebetween. In various embodiments, the laser beam focal line length l can correspond to the thickness d of the substrate, can be less than the thickness d, or can be greater than the thickness d of the substrate. As such, in some embodiments, the methods disclosed herein can be used to process or cut more than one substrate, such as a stack of two or more substrates. According to non-limiting embodiments, the pulsed laser beam can perforate a stack of glass substrates up to a total thickness of about 100 mm or greater, e.g., from 20 μm to about 200 mm, with a single laser pass, even in instances where one or more air gaps exist between the substrates in various locations. For example, each substrate of a stack of 200 substrates, each substrate being 0.5 mm thick, may be perforated by a single pass of the laser. For example, each substrate having an electrochromic film approximately 1 micron (0.001 mm) thick, would make a stack of 200 such substrates 100.2 mm thick (100 mm of glass and 0.2 mm of electrochromic film). Additionally, some embodiments may further comprise additional coatings and/or protective materials between the glass substrates that are optically clear and allow the perforation of multiple layers. Such coatings include, but are not limited to, SiO2, Al2O3, and organic and inorganic polymers, such as siloxanes.


The defect line or plurality of defect lines can be created using various methods. For example, various devices can be used to focus a laser beam to create a laser beam focal line. A laser beam focal line may be generated, for example, by transmitting a Gaussian laser beam into an axicon lens to create a Gauss-Bessel laser beam profile. A Gauss-Bessel beam may diffract more slowly than a Gaussian beam (e.g., may maintain single micron spot sizes for ranges of hundreds of microns or millimeters as oppose to a few tens of microns or less). The depth or length of focus intensity for a Gauss-Bessel beam may thus be much larger than that of a Gaussian beam. Other slowly diffracting or non-diffracting beams may also be used or created using optical elements, such as Airy and Bessel beams. Exemplary optical assemblies for generating a laser beam focus line are provided in U.S. patent application Ser. Nos. 14/529,520 and 14/530,457, which are incorporated by reference herein in their entireties. Focusing can be carried out, e.g., using any variety of donut-shaped laser beams, spherical lenses, axicon lenses, diffractive elements, or any other suitable method or apparatus to form a linear region of high intensity. The type of pulsed laser (e.g., picosecond, femtosecond, etc.) and/or its wavelength (e.g., IR, UV, green, etc.) can also be varied, so long as sufficient intensity is created to create breakdown of the substrate material due to nonlinear optical effects.



FIG. 3 illustrates one exemplary optical assembly 6 that can be used to focus a pulsed laser beam 2 into a laser beam focal line 2b having length l and directed into a glass substrate 1 having an electrochromic layer 7. The optical assembly 6 can include, for example, an axicon lens 3, a collimating lens 4, and a focusing lens 5. The focal length of each lens in the optical assembly can be varied to produce a laser beam focal line having a desired diameter and/or length. For example, the focusing lens 5 can have a focal length ranging from about 10 mm to about 50 mm, such as from about 20 mm to about 40 mm, or from about 25 mm to about 30 mm, including all ranges and subranges therebetween. The collimating lens 4 may similarly have a focal length that ranges from about 50 mm to about 200 mm, such as from about 75 mm to about 150 mm, or from about 100 mm to about 125 mm, including all ranges and subranges therebetween.


In various non-limiting embodiments, an axicon lens 3 may be incorporated into the optical lens assembly 6 to create a high intensity region of high aspect ratio, e.g., taper-free laser microchannels, using ultrashort Bessel beams (of picosecond or femtosecond duration). An axicon is a conically cut lens capable of forming a spot source on a line along the optical axis (e.g., transforming a laser beam into a ring). Axicons and their configurations are known to those skilled in the art and may, for example, have cone angles ranging from about 5° to about 20°, such as from about 10° to about 15°, including all ranges and subranges therebetween.


The axicon lens 3 can condense the laser beam having an original diameter D1 (e.g., about 1-5 mm, such as about 2-3 mm) into a high intensity region of substantially cylindrical shape and high aspect ratio (e.g., long length and small diameter) with a smaller diameter corresponding, e.g., to the focal line diameter D illustrated in FIG. 2A. The high intensity created within the condensed laser beam can result in a nonlinear interaction of the electromagnetic field of the laser and the substrate such that the laser energy is transferred to the substrate to effect formation of defect lines. However, in areas of the substrate where the laser intensity is not sufficiently high (e.g., the areas surrounding the central convergence line), the substrate may be transparent to the laser such that there is no mechanism for transferring energy from the laser to the substrate material. As such, there may be no damage or change in the areas of the glass substrate which are exposed to laser intensity below the nonlinear threshold.


After creating a contour comprising a plurality of defect lines or perforations using the pulsed laser beam, the glass substrate can optionally be separated into two or more portions using a second laser beam. The second laser beam may be used as a heat source to create a thermal stress zone around the contour, which may put the defect lines in tension thereby inducing separation. The second laser beam can emit any wavelength at which the glass substrate is not transparent, such as infrared wavelengths, e.g., greater than about 1064 nm. In some embodiments, the second laser beam can emit at wavelengths greater than about 5 μm, such as greater than about 10 μm. Suitable infrared lasers may include, for example, CO2 lasers and the like, which may be modulated or unmodulated. A non-limiting example of a second laser beam includes, but is not limited to, a modulated CO2 laser operating at a wavelength greater than about 10 μm, such as about 10.2 μm to about 10.7 μm, or from about 10.4 μm to about 10.6 μm, including all ranges and subranges therebetween.


With reference to FIGS. 1A-B, the second laser beam (not shown) can be contacted with the first surface a of the glass substrate 130 and translated along the contour 110 to separate the glass substrate into two or more portions 130a, 130b. The second surface b can comprise an electrochromic layer 150, which faces away from the surface a that is in contact with the second laser beam. The second laser beam can create a region of thermal stress on and around the contour 110, thus inducing separation of the glass substrate 130 along the contour 110 to create separate portions 130a, 130b.


Exemplary power levels for the second laser beam can range, in some embodiments, from about 50 W to about 500 W, such as from about 100 W to about 400 W, from about 150 W to about 300 W, or from about 200 W to about 250 W, including all ranges and subranges therebetween. When operated in continuous (e.g., unmodulated) mode, the second laser beam may have a lower power than when operated in modulated mode. For instance, a continuous second laser beam may have a power level ranging from about 50 W to about 300 W, whereas a modulated second laser beam may have a power level ranging from about 200 W to about 500 W, although the respective laser powers can vary and are not limited to the given exemplary ranges. In additional embodiments, the average spot diameter of the second laser beam can range from about 1 mm to about 10 mm, such as from about 2 mm to about 9 mm, from about 3 mm to about 8 mm, from about 4 mm to about 7 mm, or from about 5 mm to about 6 mm, including all ranges and subranges therebetween. The heat generated by the second laser beam can result in a thermal stress region on and/or around the contour, this region having a diameter on the order of microns, e.g., less than about 20 μm, such as ranging from about 1 μm to about 20 μm, from about 2 μm to about 15 μm, from about 3 μm to about 10 μm, from about 4 μm to about 8 μm, or from about 5 μm to about 6 μm, including all ranges and subranges therebetween.


According to various embodiments, the second laser beam may be modulated and can have a pulse duration of less than about 200 microseconds, such as greater than about 1 microsecond to less than about 200 microseconds, e.g., ranging from about 5 microseconds to about 150 microseconds, from about 10 microseconds to about 100 microseconds, from about 20 microseconds to about 80 microseconds, from about 30 microseconds to about 60 microseconds, or from about 40 microseconds to about 50 microseconds, including all ranges and subranges therebetween. According to various embodiments, a rise time of the modulated second laser beam can be less than about 150 microseconds, such as ranging from about 10 microseconds to about 150 microseconds, from about 20 microseconds to about 100 microseconds, from about 30 microseconds to about 80 microseconds, from about 40 microseconds to about 70 microseconds, or from about 50 microseconds to about 60 microseconds, including all ranges and subranges therebetween.


In additional embodiments, the pulse repetition rate (or modulation speed) of the modulated second laser beam can range from about 1 kHz to about 100 kHz, such as from about 5 kHz to about 80 kHz, from about 10 kHz to about 60 kHz, from about 20 kHz to about 50 kHz, or from about 30 kHz to about 40 kHz, including all ranges and subranges therebetween. According to non-limiting embodiments, the pitch or periodicity between the second laser beam pulses can range from about 1 μm to about 100 μm, such as from about 5 μm to about 90 μm, from about 10 μm to about 80 μm, from about 20 μm to about 70 μm, from about 30 μm to about 60 μm, or from about 40 μm to about 50 μm, including all ranges and subranges therebetween.


In certain embodiments, the first surface of the glass substrate can be contacted with the second laser beam in a single pass or, in other embodiments, multiple passes can be made. For example, the second laser beam can be translated relative to the glass substrate, or vice versa, using anywhere from 1 to 10 passes, such as 2 to 9 passes, 3 to 8 passes, 4 to 7 passes, or 5 to 6 passes, including all ranges and subranges therebetween. The translation speed can range from about 100 mm/s to about 1000 mm/s, such as from about 150 mm/s to about 900 mm/s, from about 200 mm/s to about 800 mm/s, from about 250 mm/s to about 700 mm/s, from about 300 mm/s to about 600 mm/s, or from about 400 mm/s to about 500 mm/s, including all ranges and subranges therebetween.


Another aspect comprises use of any of the processes above to create holes, voids, gaps, or other discontinuities in the electrochromic layer on a substrate while either not damaging or limiting damage to the underlying substrate. In such embodiments, the electrochromic layer 150 can be used to modify laser absorption or penetration depth. In some embodiments, the electrochromic layer 150 is placed in a colored or darkened state to increase its absorption of the laser light, and in such embodiments, the laser may be tuned to a wavelength that is close to the light absorption wavelength of the electrochromic layer 150. In such embodiments, the absorption of the electrochromic layer may aid in modification of the electrochromic layer, may impact laser penetration depth, or may increase or decrease the overall laser pulse power needed to modify the glass or electrochromic layer.


In creating discontinuities in the electrochromic layer, it is generally the case that the goal is to create two or more electrically separated regions. Therefore, a discontinuity line, defined as a laser-formed line expressly formed to electrically isolate two or more regions of an electrochromic layer on a substrate, typically needs to be continuous, meaning that it completely disconnects the two regions of the electrochromic layer from each other, and may require ablation of at least one layer of the electrochromic film. The laser power or energy levels needed to create the discontinuities in the electrochromic layer are typically much less than needed to create damage in the glass substrate. Either pulsed or continuous lasers can be used. Use of pulsed lasers can be advantageous in that the electrochromic material can be ablated without heating the electrochromic or substrate, avoiding damaging the adjacent, retained electrochromic materials or the temper of the glass substrate. Further, the wavelength of the laser can advantageously be targeted to the absorption of the electrochromic film, either in its lightened or darkened state. Further the beam can be focused through the substrate or opposite the substrate, depending on needs.


If pulsed, exemplary laser powers can range, in some embodiments, from about 0.25 W to about 150 W, such as from about 0.25 W to about 50 W, or from about 1 W to about 100 W, including all ranges and subranges therebetween. According to various embodiments, the pulsed laser beam can have a pulse duration from 100 nanosecond to 10 femtoseconds, for example about 100 picoseconds. In some embodiments the pulsed laser beam has a pulse duration from greater than about 1 picosecond to less than about 100 picoseconds, e.g., ranging from about 5 picoseconds to about 50 picoseconds, from about 10 picoseconds to about 30 picoseconds, or from about 15 picoseconds to about 20 picoseconds, including all ranges and subranges therebetween. In additional embodiments, the pulse repetition rate of the pulsed laser beam can range from about 1 kHz to about 4 MHz, such as from about 10 kHz to about 650 kHz, from about 50 kHz to about 500 kHz, from about 100 kHz to about 400 kHz, or from about 200 kHz to about 300 kHz, including all ranges and subranges therebetween.


Because the power levels for discontinuity creation in the electrochromic are much less, a continuous laser source can be used as well. Power levels for continuous lasers are from about 0.25 W to about 150 W, such as from about 0.25 W to about 50 W, or from about 1 W to about 100 W, including all ranges and subranges therebetween, primarily depending on wavelength, focus, and time the beam is targeted to a particular region.


The discontinuity line can be approximately the same width as the laser used to make it. The width of the discontinuity line may range from about 0.1 μm to about 5 μm, such as from about 0.25 μm to about 4 μm, from about 0.5 μm to about 3.5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, including all ranges and subranges therebetween. The width of a discontinuity line can, in some embodiments, be as large as the average spot diameter of the laser beam focal line, e.g., the average spot diameter of the laser beam focal line may also range from about 0.1 μm to about 5 μm, such as from about 0.25 μm to about 4 μm, from about 0.5 μm to about 3.5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, including all ranges and subranges therebetween.


Glass Articles

Disclosed herein are glass articles comprising a first surface, an opposing second surface, and an electrochromic coating disposed on at least a portion of the second surface, wherein upon application of voltage to the glass article a first region of a coated portion of the glass substrate has a first visible light transmission that is less than a second visible light transmission of a second region of the coated portion. Referring to FIG. 4A, the second surface of a glass article is illustrated, comprising an electrochromic layer on a portion E of the surface (shaded portion) and an uncoated portion U (not shaded) separated by line Z. According to various embodiments, the methods disclosed herein can be used to laser process the glass article of FIG. 4A to produce the glass articles of FIGS. 4B-C, as well as any desired variations thereof.


In some embodiments, the electrochromic layer comprises one or more inorganic materials. In some embodiments, the electrochromic layer comprises one or more tungsten oxides.


For example, a first pulsed laser can be used to create contour A1 (dashed line), also referred to herein as a laser “scribe” or “perforation.” A first pulsed laser and a second laser can be traced along contour B1 (double line) to separate the glass into two portions to produce the glass article depicted in FIG. 4B as well as an uncoated remainder (not shown). Upon application of voltage to C1, C1 of the coated portion E may be “tinted” and/or may have a reduced transmission (e.g., for visible wavelengths 400-700 nm) as compared to a second region C2 of the coated portion E, which may remain inactivated and unchanged (or untinted). Alternatively, if a voltage is applied to C2 and not C1, it may perform similarly to C1 above. Both C1 and C2 are now capable of tinting independent of each other as the scribe line has electrically disconnected the layers from each other.


The laser scribe along contour A1 serves to create a electrical barrier to the electrochromic effect between C1 and C2. As such, the glass article can comprise uncoated (e.g., untinted) portion U and a “new” untinted (but coated) region C2 which will not exhibit an electrochromic effect upon application of voltage to C1 even though it is coated with the electrochromic layer (and vice versa). The laser scribe or perforation process can thus be used to produce any desired pattern on a glass substrate including linear and curved contours, as well as patterns within the first or second regions. The contour or laser scribe can comprise a plurality of discontinuity lines as discussed above and can separate the respective regions to produce any desired visual effect without significantly damaging the electrochromic layer or the glass substrate. The width of the discontinuity line may range from about 0.1 μm to about 25 μm, such as from about 0.25 μm to about 10 μm, from about 0.5 μm to about 5 μm, from about 1 μm to about 3 μm, or from about 1.5 μm to about 2 μm, including all ranges and subranges therebetween.


In some embodiments, C2 may not, or may not substantially be, laser damaged. For instance, the electrochromic coating and/or glass substrate in this region may not be laser damaged or may exhibit a very small region of laser damage along the contour, as described in more detail below. Therefore, in certain embodiments, the contour produces two or more active devices from a single motherboard. Since the laser cuts are precise and the power can be controlled to produce very fine lines with little damage to the electrochromic film, the electrochromic layers in C1 and C2 are not damaged and very little electrochromic material is wasted.


In some embodiments, the formation of discontinuities in the electrochromic film can be used to eliminate the tinting effect in certain regions of the article. Current methods for eliminating a tinting effect in a given region of a coated substrate involve removing the coating, e.g., using laser ablation to “burn” off the coating in a desired area. However, such processes can be imprecise and can result in a large region of damage to both the electrochromic layer and underlying glass substrate. For example, to ensure that the electrochromic layer is completely removed from the desired region, several passes may be made using a high power laser, which can result in a wide region (or strip) along which the remaining electrochromic layer is damaged and/or the underlying glass substrate is damaged. Such laser damage regions can have a width on the order of tens of millimeters, such as greater than about 20 mm, greater than about 25 mm, or even greater than about 30 mm.


Further disclosed herein are glass articles comprising a first surface, an opposing second surface, and an electrochromic coating disposed on substantially all of the second surface, wherein the electrochromic coating comprises a laser damaged peripheral region proximate at least one edge of the glass article, the laser damaged peripheral region having a width of less than about 10, 1, or 0.1 mm. Referring again to FIG. 4A, a first pulsed laser can be used to create contour A2 (dashed line), and a first pulsed laser and a second laser can be traced along contour B2 (double line) to separate the glass into two portions to produce the glass article depicted in FIG. 4C. Upon application of voltage, a first region C1 of the coated portion E may become tinted and/or may have a reduced transmission (e.g., for visible wavelengths 400-700 nm) as compared to a second region C2 of the coated portion E, which may remain unchanged (or untinted).


Unlike contour B1 which cuts through the uncoated portion U, contour B2 cuts through the coated region E. Without wishing to be bound by theory, it is believed that the laser cutting methods disclosed herein can separate the coated glass article with minimal damage to the electrochromic layer. The laser processing methods disclosed herein may result in a relatively small region (the contour width) in which the electrochromic film is laser damaged and will not exhibit an electrochromic effect upon application of voltage. For example, the laser cutting process can create a laser damage zone L along the cut edge e that is relatively thin (e.g., less than about 0.1 mm). In some embodiments, the laser damage zone L can have a width that is less than about 10 mm, 1 mm, or 0.1 mm, such as less than about 9 mm, 8 mm, 5 mm, 1 mm, 0.5 mm, 0.1 mm, 0.09 mm, 0.08 mm, 0.07 mm, 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, 0.02 mm, 0.01 mm, or less, e.g., ranging from about 0.01 mm to about 0.1 mm, including all ranges and subranges therebetween.


The glass articles disclosed herein can have a laser damage region that is relatively small compared to uncoated and/or damaged regions produced by comparative processes. For instance, the cut-and-coat process may result in significant areas that are uncoated due to interference from fixturing. Similarly, if the glass were coated then cut using traditional aqueous edge grinding methods, the damage to the electrochromic layer proximate the cut edge (e.g., blistering, etc.) would be far greater. Furthermore, if it is desired to eliminate the tinting effect on any portion of such substrates (either cut-and-coat or coat-and-cut) using prior art methods, the laser damage region produced during the ablation process would be much larger (e.g., 20 mm or greater in width).


The glass articles herein can comprise at least one surface that is substantially coated with a functional electrochromic layer, e.g., tinted edge-to-edge upon application of voltage, which was not previously possible using prior art methods. In certain embodiments, substantially all of a surface of the glass article may be coated with an electrochromic layer, which can comprise one or more laser damage regions (<0.1 mm) along one or more edges of the article. For example, a surface of a glass substrate may be coated with an electrochromic layer and then the coated substrate may be separated along a single contour to remove any uncoated portions of the glass substrate (e.g., due to fixturing). The resulting glass article may thus be substantially coated with the electrochromic layer and can comprise a peripheral laser damaged region near the contour edge. In additional embodiments, the coated glass substrate can be separated along more than one contour and the resulting glass article can comprise more than one laser damaged region. Upon application of voltage, an edge-to-edge tinting effect may be observed, except for any laser damaged region at the edges. However, such laser damaged regions may be relatively small in comparison to the uncoated and/or damaged regions produced by prior art processes. According to various embodiments, the laser damaged region may comprise less than about 5% of the coated portion of the glass surface, such as less than about 4%, 3%, 2%, 1%, 0.5%, 0.1%, or 0.01%, including all ranges and subranges therebetween, although as the size of the glass article decreases, the relative percentage of the surface occupied by the laser damaged region can increase.


The glass articles disclosed herein can comprise any glass known in the art that is suitable for automotive, architectural, and other similar applications. Exemplary glass substrates can include, but are not limited to, aluminosilicate, alkali-aluminosilicate, borosilicate, alkali-borosilicate, aluminoborosilicate, alkali-aluminoborosilicate, soda lime silicate, and other suitable glasses. In certain embodiments, the substrate may have a thickness ranging from about 0.1 mm to about 10 mm, such as from about 0.3 mm to about 5 mm, from about 0.5 mm to about 3 mm, or from about 1 mm to about 2 mm, including all ranges and subranges therebetween. Non-limiting examples of commercially available glasses suitable for use as a light filter include, for instance, EAGLE XG®, Iris™, Lotus™, Willow®, Gorilla®, HPFS®, and ULE® glasses from Corning Incorporated. Suitable glasses are disclosed, for example, in U.S. Pat. Nos. 4,483,700, 5,674,790, and 7,666,511, which are incorporated herein by reference in their entireties, which are incorporated herein by reference in their entireties.


The substrate can comprise a glass sheet having a first surface and an opposing second surface. The surfaces may, in certain embodiments, be planar or substantially planar, e.g., substantially flat and/or level. The substrate can also, in some embodiments, be curved about at least one radius of curvature, e.g., a three-dimensional substrate, such as a convex or concave substrate. The first and second surfaces may, in various embodiments, be parallel or substantially parallel. The substrate may further comprise at least one edge, for instance, at least two edges, at least three edges, or at least four edges. By way of a non-limiting example, the substrate may comprise a rectangular or square sheet having four edges, although other shapes and configurations are envisioned and are intended to fall within the scope of the disclosure. The laser cutting methods disclosed herein can also be used to create a variety of curved contours and resulting glass articles with curved, e.g., nonlinear edges.


The glass articles disclosed herein can be used to produce various products, such as insulated glass units (IGUs). For example, a glass article comprising at least a portion of a surface coated with an electrochromic layer can be sealed around the perimeter to a second glass sheet to produce an IGU. Because the glass article can be cut to size and/or shape after coating with the electrochromic layer, the manufacture of such IGUs may have improved flexibility and/or reduced cost.


It will be appreciated that the various disclosed embodiments may involve particular features, elements or steps that are described in connection with that particular embodiment. It will also be appreciated that a particular feature, element or step, although described in relation to one particular embodiment, may be interchanged or combined with alternate embodiments in various non-illustrated combinations or permutations.


It is also to be understood that, as used herein the terms “the,” “a,” or “an,” mean “at least one,” and should not be limited to “only one” unless explicitly indicated to the contrary. Thus, for example, reference to “a laser” includes examples having two or more such lasers unless the context clearly indicates otherwise. Likewise, a “plurality” is intended to denote “more than one.” As such, a “plurality of defect lines” includes two or more such defect lines, such as three or more such defect lines, etc.


Ranges can be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, examples include from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another aspect. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.


The terms “substantial,” “substantially,” and variations thereof as used herein are intended to note that a described feature is equal or approximately equal to a value or description. For example, a “substantially planar” surface is intended to denote a surface that is planar or approximately planar.


Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order. Accordingly, where a method claim does not actually recite an order to be followed by its steps or it is not otherwise specifically stated in the claims or descriptions that the steps are to be limited to a specific order, it is no way intended that any particular order be inferred.


While various features, elements or steps of particular embodiments may be disclosed using the transitional phrase “comprising,” it is to be understood that alternative embodiments, including those that may be described using the transitional phrases “consisting” or “consisting essentially of,” are implied. Thus, for example, implied alternative embodiments to an article that comprises A+B+C include embodiments where an article consists of A+B+C and embodiments where an article consists essentially of A+B+C.


It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure without departing from the spirit and scope of the disclosure. Since modifications combinations, sub-combinations and variations of the disclosed embodiments incorporating the spirit and substance of the disclosure may occur to persons skilled in the art, the disclosure should be construed to include everything within the scope of the appended claims and their equivalents.

Claims
  • 1. An electrochromic glass article comprising: a glass substrate comprising a first surface, an opposing second surface, and one or more edges, wherein at least one or more of the one or more edges comprises a laser-cut edge; andan electrochromic coating disposed on at least a portion of the second surface, and comprising at least two electrically discontinuous regions, each having a contour,wherein the two electrically discontinuous regions are separated by a laser-modified discontinuity line having a width from 0.1 μm to 25 μm,wherein the electrochromic coating comprises a laser damaged peripheral region directly adjacent to the laser-cut edge, the laser-damaged peripheral region having a width of less than 0.1 mm, andwherein the contour of at least one of the at least two electrically discontinuous regions is non-linear.
  • 2. The electrochromic glass article of claim 1, wherein the electrochromic coating comprises tungsten oxide.
  • 3. The electrochromic glass article of claim 1, wherein the electrically discontinuous regions are not substantially laser damaged.
  • 4. The electrochromic glass article of claim 1, wherein the second surface of the glass substrate proximate to the laser-modified discontinuity line is not substantially laser damaged.
  • 5. The electrochromic glass article of claim 1, wherein the laser cut discontinuity is a continuous line formed by a laser with a pulse width from 10−10 to 10−15 seconds at FWHM.
  • 6. The electrochromic glass article of claim 1, wherein the second region comprises a pattern in the first region or the first region comprises a pattern in the second region.
  • 7. The electrochromic glass article of claim 1, wherein the glass article comprises a glass sheet having a thickness ranging from 0.1 mm to 10 mm.
  • 8. The electrochromic glass article of claim 1, wherein one of the at least two electrically discontinuous regions comprises a region of the second surface proximate to the one or more edges of the glass substrate.
  • 9. The glass article of claim 8, wherein the electrically discontinuous region proximate to the one or more edges of the glass substrate has a width of less than 0.1 mm.
  • 10. The glass article of claim 8, wherein the electrically discontinuous region proximate to the one or more edges of the glass substrate comprises 5% or less of the coated portion of the glass article.
  • 11. An insulated glass unit comprising the electrochromic glass article of claim 1.
  • 12. An electrochromic glass article comprising: a glass substrate comprising a first surface, an opposing second surface, and one or more edges, wherein at least one or more of the one or more edges comprises a laser-cut edge; andan electrochromic coating disposed on at least a portion of the second surface, and comprising at least two electrically discontinuous regions, each having a contour,wherein the two electrically discontinuous regions are separated by a laser-modified discontinuity line having a width from 0.1 μm to 25 μm,wherein the electrochromic coating comprises a laser damaged peripheral region directly adjacent to the laser-cut edge, the laser-damaged peripheral region having a width of less than 0.1 mm, andwherein the second region comprises a pattern in the first region or the first region comprises a pattern in the second region.
  • 13. The electrochromic glass article of claim 12, wherein the electrochromic coating comprises tungsten oxide.
  • 14. The electrochromic glass article of claim 12, wherein the electrically discontinuous regions are not substantially laser damaged.
  • 15. The electrochromic glass article of claim 12, wherein the second surface of the glass substrate proximate to the laser-modified discontinuity line is not substantially laser damaged.
  • 16. The electrochromic glass article of claim 12, wherein the laser cut discontinuity is a continuous line formed by a laser with a pulse width from 10−10 to 10−15 seconds at FWHM.
  • 17. The electrochromic glass article of claim 12, wherein the second region comprises a pattern in the first region or the first region comprises a pattern in the second region.
  • 18. The electrochromic glass article of claim 12, wherein the glass article comprises a glass sheet having a thickness ranging from 0.1 mm to 10 mm.
  • 19. The electrochromic glass article of claim 12, wherein one of the at least two electrically discontinuous regions comprises a region of the second surface proximate to the one or more edges of the glass substrate.
  • 20. The glass article of claim 19, wherein the electrically discontinuous region proximate to the one or more edges of the glass substrate has a width of less than 0.1 mm.
  • 21. The glass article of claim 19, wherein the electrically discontinuous region proximate to the one or more edges of the glass substrate comprises 5% or less of the coated portion of the glass article.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. application Ser. No. 14/530,457, filed Oct. 31, 2014, which claims priority to U.S. Provisional Application No. 61/917,092, filed on Dec. 17, 2013, and U.S. Provisional Application No. 62/022,896, filed on Jul. 10, 2014, all of which are incorporated herein by reference in their entireties.

US Referenced Citations (609)
Number Name Date Kind
1529243 Drake et al. Mar 1925 A
1626396 Drake Apr 1927 A
1790397 Woods et al. Jan 1931 A
2682134 Stookey Jun 1954 A
2749794 O'Leary Jun 1956 A
2754956 Sommer Jul 1956 A
3647410 Heaton et al. Mar 1972 A
3673900 Jendrisak et al. Jul 1972 A
3695497 Dear Oct 1972 A
3695498 Dear Oct 1972 A
3729302 Heaton Apr 1973 A
3775084 Heaton Nov 1973 A
3947093 Goshima et al. Mar 1976 A
4076159 Farragher Feb 1978 A
4226607 Domken Oct 1980 A
4441008 Chan Apr 1984 A
4546231 Gresser et al. Oct 1985 A
4618056 Cutshall Oct 1986 A
4623776 Buchroeder et al. Nov 1986 A
4642439 Miller et al. Feb 1987 A
4646308 Kafka et al. Feb 1987 A
4764930 Bille et al. Aug 1988 A
4891054 Bricker et al. Jan 1990 A
4907586 Bille et al. Mar 1990 A
4918751 Pessot et al. Apr 1990 A
4929065 Hagerty et al. May 1990 A
4951457 Deal Aug 1990 A
4997250 Ortiz, Jr. Mar 1991 A
5035918 Vyas Jul 1991 A
5040182 Spinelli et al. Aug 1991 A
5104210 Tokas Apr 1992 A
5104523 Masaharu et al. Apr 1992 A
5108857 Kitayama et al. Apr 1992 A
5112722 Tsujino et al. May 1992 A
5114834 Nachshon May 1992 A
5221034 Bando Jun 1993 A
5256853 McIntyre Oct 1993 A
5265107 Delfyett, Jr. Nov 1993 A
5326956 Lunney Jul 1994 A
5400350 Galvanauskas Mar 1995 A
5410567 Brundage et al. Apr 1995 A
5418803 Zhiglinsky et al. May 1995 A
5434875 Rieger et al. Jul 1995 A
5436925 Lin et al. Jul 1995 A
5475197 Wrobel et al. Dec 1995 A
5521352 Lawson May 1996 A
5541774 Blankenbecler Jul 1996 A
5553093 Ramaswamy et al. Sep 1996 A
5574597 Kataoka et al. Nov 1996 A
5578229 Barnekov et al. Nov 1996 A
5586138 Yokoyama Dec 1996 A
5656186 Mourou et al. Aug 1997 A
5676866 In Den Baumen et al. Oct 1997 A
5684642 Zumoto et al. Nov 1997 A
5692703 Murphy et al. Dec 1997 A
5696782 Harter et al. Dec 1997 A
5715346 Liu Feb 1998 A
5736061 Fukada et al. Apr 1998 A
5736709 Neiheisel Apr 1998 A
5776220 Allaire et al. Jul 1998 A
5781684 Liu Jul 1998 A
5796112 Ichie Aug 1998 A
5854490 Ooaeh et al. Dec 1998 A
5854751 Di et al. Dec 1998 A
5878866 Lisec Mar 1999 A
5968441 Seki Oct 1999 A
6003418 Bezama Dec 1999 A
6016223 Suzuki et al. Jan 2000 A
6016324 Rieger et al. Jan 2000 A
6027062 Bacon et al. Feb 2000 A
6033583 Musket et al. Mar 2000 A
6038055 Hansch et al. Mar 2000 A
6055829 Witzmann et al. May 2000 A
6078599 Everage et al. Jun 2000 A
6137632 Bernacki Oct 2000 A
6156030 Neev Dec 2000 A
6160835 Kwon Dec 2000 A
6185051 Chen et al. Feb 2001 B1
6186384 Sawada Feb 2001 B1
6191880 Schuster Feb 2001 B1
6210401 Lai Apr 2001 B1
6256328 Delfyett et al. Jul 2001 B1
6259058 Hoekstra Jul 2001 B1
6259151 Morrison Jul 2001 B1
6259512 Mizouchi Jul 2001 B1
6272156 Reed et al. Aug 2001 B1
6301932 Allen et al. Oct 2001 B1
6308055 Welland et al. Oct 2001 B1
6322958 Hayashi Nov 2001 B1
6339208 Rockstroh et al. Jan 2002 B1
6373565 Kafka et al. Apr 2002 B1
6381391 Islam et al. Apr 2002 B1
6396856 Sucha et al. May 2002 B1
6407360 Choo et al. Jun 2002 B1
6438996 Cuvelier Aug 2002 B1
6445491 Sucha et al. Sep 2002 B2
6449301 Wu et al. Sep 2002 B1
6461223 Bando Oct 2002 B1
6484052 Visuri et al. Nov 2002 B1
6489589 Alexander Dec 2002 B1
6501576 Seacombe Dec 2002 B1
6501578 Bernstein et al. Dec 2002 B1
6520057 Steadman Feb 2003 B1
6552301 Herman et al. Apr 2003 B2
6573026 Aitken et al. Jun 2003 B1
6592703 Habeck et al. Jul 2003 B1
6611647 Berkey et al. Aug 2003 B2
6635849 Okawa et al. Oct 2003 B1
6635850 Amako et al. Oct 2003 B2
6720519 Liu et al. Apr 2004 B2
6729151 Thompson May 2004 B1
6729161 Miura et al. May 2004 B1
6737345 Lin et al. May 2004 B1
6744009 Xuan et al. Jun 2004 B1
6787732 Xuan et al. Sep 2004 B1
6791935 Hatano et al. Sep 2004 B2
6800237 Yamamoto et al. Oct 2004 B1
6800831 Hoetzel Oct 2004 B1
6856379 Schuster Feb 2005 B2
6885502 Schuster Apr 2005 B2
6904218 Sun et al. Jun 2005 B2
6958094 Ohmi et al. Oct 2005 B2
6992026 Fukuyo et al. Jan 2006 B2
7009138 Amako et al. Mar 2006 B2
7061583 Mulkens et al. Jun 2006 B2
7102118 Acker et al. Sep 2006 B2
7187833 Mishra Mar 2007 B2
7196841 Melzer et al. Mar 2007 B2
7259354 Pailthorp et al. Aug 2007 B2
7353829 Wachter et al. Apr 2008 B1
7402773 Nomaru Jul 2008 B2
7408616 Gruner et al. Aug 2008 B2
7408622 Fiolka et al. Aug 2008 B2
7511886 Schultz et al. Mar 2009 B2
7535634 Savchenkov et al. May 2009 B1
7555187 Bickham et al. Jun 2009 B2
7565820 Foster et al. Jul 2009 B2
7633033 Thomas et al. Dec 2009 B2
7642483 You et al. Jan 2010 B2
7649153 Haight et al. Jan 2010 B2
7726532 Gonoe Jun 2010 B2
7794904 Brueck Sep 2010 B2
7800734 Komatsuda Sep 2010 B2
7832675 Bumgarner et al. Nov 2010 B2
7901967 Komura et al. Mar 2011 B2
7920337 Perchak Apr 2011 B2
7978408 Sawabe et al. Jul 2011 B2
8035803 Fiolka Oct 2011 B2
8035882 Fanton Oct 2011 B2
8035901 Abramov et al. Oct 2011 B2
8041127 Whitelaw Oct 2011 B2
8068279 Schuster et al. Nov 2011 B2
8104385 Hayashi et al. Jan 2012 B2
8118971 Hori et al. Feb 2012 B2
8123515 Schleelein Feb 2012 B2
8132427 Brown et al. Mar 2012 B2
8144308 Muramatsu Mar 2012 B2
8158514 Krueger et al. Apr 2012 B2
8164818 Collins Apr 2012 B2
8168514 Garner May 2012 B2
8194170 Golub et al. Jun 2012 B2
8211259 Sato et al. Jul 2012 B2
8218929 Bickham et al. Jul 2012 B2
8237918 Totzeck et al. Aug 2012 B2
8245539 Lu et al. Aug 2012 B2
8245540 Abramov et al. Aug 2012 B2
8248600 Matousek et al. Aug 2012 B2
8259393 Fiolka et al. Sep 2012 B2
8269138 Gamer et al. Sep 2012 B2
8279524 Fiolka et al. Oct 2012 B2
8283595 Fukuyo et al. Oct 2012 B2
8283695 Salcedo et al. Oct 2012 B2
8292141 Cox et al. Oct 2012 B2
8296066 Zhao et al. Oct 2012 B2
8327666 Harvey et al. Dec 2012 B2
8339578 Omura Dec 2012 B2
8341976 Dejneka et al. Jan 2013 B2
8347551 Van Der Drift Jan 2013 B2
8347651 Abramov et al. Jan 2013 B2
8358868 Iketani Jan 2013 B2
8358888 Ramachandran Jan 2013 B2
8379188 Mueller et al. Feb 2013 B2
8444905 Li et al. May 2013 B2
8444906 Lee et al. May 2013 B2
8448471 Kumatani et al. May 2013 B2
8475507 Dewey et al. Jul 2013 B2
8482717 Fiolka et al. Jul 2013 B2
8491983 Ono et al. Jul 2013 B2
8518280 Hsu et al. Aug 2013 B2
8549881 Brown et al. Oct 2013 B2
8584354 Cornejo et al. Nov 2013 B2
8584490 Garner et al. Nov 2013 B2
8592716 Abramov et al. Nov 2013 B2
8604380 Howerton et al. Dec 2013 B2
8607590 Glaesemann et al. Dec 2013 B2
8616024 Cornejo et al. Dec 2013 B2
8635857 Crosbie Jan 2014 B2
8635887 Black et al. Jan 2014 B2
8680489 Martinez et al. Mar 2014 B2
8685838 Fukuyo et al. Apr 2014 B2
8687932 Peckham et al. Apr 2014 B2
8697228 Carre et al. Apr 2014 B2
8720228 Li May 2014 B2
8724937 Barwicz et al. May 2014 B2
8826696 Brown et al. Sep 2014 B2
8842358 Bareman Sep 2014 B2
8847112 Panarello et al. Sep 2014 B2
8852698 Fukumitsu Oct 2014 B2
8887529 Lu et al. Nov 2014 B2
8916798 Pluss Dec 2014 B2
8943855 Gomez et al. Feb 2015 B2
8951889 Ryu et al. Feb 2015 B2
8971053 Kariya et al. Mar 2015 B2
9028613 Kim et al. May 2015 B2
9052605 Van et al. Jun 2015 B2
9086509 Knutson Jul 2015 B2
9138913 Arai et al. Sep 2015 B2
9170500 Van et al. Oct 2015 B2
9227868 Matsumoto et al. Jan 2016 B2
9290407 Barefoot et al. Mar 2016 B2
9296066 Hosseini et al. Mar 2016 B2
9324791 Tamemoto Apr 2016 B2
9327381 Lee et al. May 2016 B2
9341912 Shrivastava May 2016 B2
9346706 Bazemore et al. May 2016 B2
9446590 Chen et al. Sep 2016 B2
9477037 Bickham et al. Oct 2016 B1
9481598 Bergh et al. Nov 2016 B2
9499343 Cornelissen et al. Nov 2016 B2
9517929 Hosseini Dec 2016 B2
9517963 Marjanovic et al. Dec 2016 B2
9701581 Kangastupa et al. Jul 2017 B2
9703167 Parker Jul 2017 B2
9815730 Marjanovic et al. Nov 2017 B2
9850160 Marjanovic et al. Dec 2017 B2
9873628 Haloui et al. Jan 2018 B1
9878304 Kotake et al. Jan 2018 B2
10190363 Behmke Jan 2019 B2
10730783 Akarapu et al. Aug 2020 B2
20010019404 Schuster et al. Sep 2001 A1
20010027842 Curcio et al. Oct 2001 A1
20020006765 Michel et al. Jan 2002 A1
20020046997 Nam et al. Apr 2002 A1
20020082466 Han Jun 2002 A1
20020097486 Yamaguchi et al. Jul 2002 A1
20020097488 Hay et al. Jul 2002 A1
20020110639 Bruns Aug 2002 A1
20020126380 Schuster Sep 2002 A1
20020139786 Amako et al. Oct 2002 A1
20030006221 Hong et al. Jan 2003 A1
20030007772 Borrelli et al. Jan 2003 A1
20030007773 Kondo et al. Jan 2003 A1
20030038225 Mulder et al. Feb 2003 A1
20030070706 Fujioka Apr 2003 A1
20030227663 Agrawal Dec 2003 A1
20040021615 Benson et al. Feb 2004 A1
20040051982 Perchak Mar 2004 A1
20040075717 O'Brien et al. Apr 2004 A1
20040108467 Eurlings et al. Jun 2004 A1
20040144231 Hanada Jul 2004 A1
20040218882 Bickham et al. Nov 2004 A1
20040221615 Postupack et al. Nov 2004 A1
20040228593 Sun et al. Nov 2004 A1
20050024743 Camy-Peyret Feb 2005 A1
20050064707 Sinha Mar 2005 A1
20050098458 Gruetzmacher et al. May 2005 A1
20050098548 Kobayashi et al. May 2005 A1
20050115938 Sawaki et al. Jun 2005 A1
20050116938 Ito et al. Jun 2005 A1
20050205778 Kitai et al. Sep 2005 A1
20050209898 Asai et al. Sep 2005 A1
20050231651 Myers et al. Oct 2005 A1
20050274702 Deshi Dec 2005 A1
20050277270 Yoshikawa et al. Dec 2005 A1
20060011593 Fukuyo Jan 2006 A1
20060021385 Cimo et al. Feb 2006 A1
20060028706 Totzeck et al. Feb 2006 A1
20060028728 Li Feb 2006 A1
20060050261 Brotsack Mar 2006 A1
20060109874 Shiozaki et al. May 2006 A1
20060118529 Aoki et al. Jun 2006 A1
20060127679 Gulati et al. Jun 2006 A1
20060146384 Schultz et al. Jul 2006 A1
20060151450 You et al. Jul 2006 A1
20060170617 Latypov et al. Aug 2006 A1
20060213883 Eberhardt et al. Sep 2006 A1
20060227440 Gluckstad Oct 2006 A1
20060266744 Nomaru Nov 2006 A1
20060289410 Morita et al. Dec 2006 A1
20060291835 Nozaki et al. Dec 2006 A1
20070021548 Hattori et al. Jan 2007 A1
20070030471 Troost et al. Feb 2007 A1
20070044606 Kang et al. Mar 2007 A1
20070045253 Jordens et al. Mar 2007 A1
20070051706 Bovatsek et al. Mar 2007 A1
20070053632 Popp Mar 2007 A1
20070068648 Hu et al. Mar 2007 A1
20070090180 Griffis et al. Apr 2007 A1
20070091977 Sohn et al. Apr 2007 A1
20070111119 Hu et al. May 2007 A1
20070111390 Komura et al. May 2007 A1
20070111480 Maruyama et al. May 2007 A1
20070119831 Kandt May 2007 A1
20070132977 Komatsuda Jun 2007 A1
20070138151 Tanaka et al. Jun 2007 A1
20070177116 Amako Aug 2007 A1
20070202619 Tamura et al. Aug 2007 A1
20070209029 Ivonin et al. Sep 2007 A1
20070228616 Bang Oct 2007 A1
20070298529 Maeda et al. Dec 2007 A1
20080000884 Sugiura et al. Jan 2008 A1
20080050584 Noguchi et al. Feb 2008 A1
20080079940 Sezerman et al. Apr 2008 A1
20080087629 Shimomura et al. Apr 2008 A1
20080099444 Misawa et al. May 2008 A1
20080158529 Hansen Jul 2008 A1
20080165925 Singer et al. Jul 2008 A1
20080190981 Okajima et al. Aug 2008 A1
20080239268 Mulder et al. Oct 2008 A1
20080309902 Rosenbluth Dec 2008 A1
20080310465 Achtenhagen Dec 2008 A1
20080314879 Bruland et al. Dec 2008 A1
20080318028 Winstanley et al. Dec 2008 A1
20090013724 Koyo et al. Jan 2009 A1
20090032510 Ando et al. Feb 2009 A1
20090033902 Mulder et al. Feb 2009 A1
20090050661 Na et al. Feb 2009 A1
20090060437 Fini et al. Mar 2009 A1
20090091731 Ossmann et al. Apr 2009 A1
20090104721 Hirakata et al. Apr 2009 A1
20090157341 Cheung Jun 2009 A1
20090170286 Tsukamoto et al. Jul 2009 A1
20090176034 Ruuttu et al. Jul 2009 A1
20090183764 Meyer Jul 2009 A1
20090184849 Nasiri et al. Jul 2009 A1
20090188543 Bann Jul 2009 A1
20090199694 Uh et al. Aug 2009 A1
20090212033 Beck et al. Aug 2009 A1
20090242528 Howerton et al. Oct 2009 A1
20090250446 Sakamoto Oct 2009 A1
20090293910 Ball et al. Dec 2009 A1
20090294419 Abramov et al. Dec 2009 A1
20090294422 Lubatschowski et al. Dec 2009 A1
20090323160 Egerton Dec 2009 A1
20090323162 Fanton Dec 2009 A1
20090324899 Feinstein et al. Dec 2009 A1
20090324903 Rumsby Dec 2009 A1
20100020304 Soer et al. Jan 2010 A1
20100024865 Shah et al. Feb 2010 A1
20100025387 Arai et al. Feb 2010 A1
20100027951 Bookbinder et al. Feb 2010 A1
20100029460 Shojiya et al. Feb 2010 A1
20100032087 Takahashi et al. Feb 2010 A1
20100038349 Ke et al. Feb 2010 A1
20100046761 Henn et al. Feb 2010 A1
20100086741 Bovatsek et al. Apr 2010 A1
20100089631 Sakaguchi et al. Apr 2010 A1
20100089682 Martini et al. Apr 2010 A1
20100089882 Tamura Apr 2010 A1
20100102042 Garner et al. Apr 2010 A1
20100129603 Blick May 2010 A1
20100145620 Georgi et al. Jun 2010 A1
20100147813 Lei et al. Jun 2010 A1
20100197116 Shah Aug 2010 A1
20100206008 Harvey et al. Aug 2010 A1
20100252538 Zeygerman Oct 2010 A1
20100252540 Lei et al. Oct 2010 A1
20100252959 Lei et al. Oct 2010 A1
20100276505 Smith Nov 2010 A1
20100279067 Sabia et al. Nov 2010 A1
20100287991 Brown et al. Nov 2010 A1
20100291353 Dejneka et al. Nov 2010 A1
20100320179 Morita et al. Dec 2010 A1
20100326138 Kumatani et al. Dec 2010 A1
20100332087 Claffee et al. Dec 2010 A1
20110017716 Rumsby Jan 2011 A1
20110023298 Chujo et al. Feb 2011 A1
20110037149 Fukuyo et al. Feb 2011 A1
20110049764 Lee et al. Mar 2011 A1
20110049765 Li et al. Mar 2011 A1
20110088324 Wessel Apr 2011 A1
20110094267 Aniolek et al. Apr 2011 A1
20110100401 Fiorentini May 2011 A1
20110111179 Blick et al. May 2011 A1
20110127244 Li Jun 2011 A1
20110127697 Milne Jun 2011 A1
20110132581 Moss Jun 2011 A1
20110132881 Liu Jun 2011 A1
20110136303 Lee Jun 2011 A1
20110139760 Shah et al. Jun 2011 A1
20110143470 Lee Jun 2011 A1
20110177325 Tomamoto et al. Jul 2011 A1
20110183116 Hung et al. Jul 2011 A1
20110191024 Deluca Aug 2011 A1
20110210105 Romashko et al. Sep 2011 A1
20110238308 Miller et al. Sep 2011 A1
20110240476 Wang et al. Oct 2011 A1
20110240611 Sandström et al. Oct 2011 A1
20110240617 Cheon et al. Oct 2011 A1
20110261429 Sbar Oct 2011 A1
20110277507 Lu et al. Nov 2011 A1
20110300691 Sakamoto et al. Dec 2011 A1
20110318555 Bookbinder et al. Dec 2011 A1
20120017642 Teranishi et al. Jan 2012 A1
20120026573 Collins Feb 2012 A1
20120047951 Dannoux et al. Mar 2012 A1
20120047956 Li Mar 2012 A1
20120047957 Dannoux et al. Mar 2012 A1
20120048604 Cornejo et al. Mar 2012 A1
20120061440 Roell Mar 2012 A1
20120064306 Kang et al. Mar 2012 A1
20120067858 Kangastupa et al. Mar 2012 A1
20120103018 Lu et al. May 2012 A1
20120106117 Sundaram et al. May 2012 A1
20120111310 Ryu et al. May 2012 A1
20120125588 Nam et al. May 2012 A1
20120131961 Dannoux et al. May 2012 A1
20120131962 Mitsugi et al. May 2012 A1
20120135195 Glaesemann et al. May 2012 A1
20120135607 Shimoi et al. May 2012 A1
20120135608 Shimoi et al. May 2012 A1
20120145331 Gomez et al. Jun 2012 A1
20120147449 Bhatnagar Jun 2012 A1
20120196071 Cornejo et al. Aug 2012 A1
20120196454 Shah et al. Aug 2012 A1
20120205356 Pluss Aug 2012 A1
20120211923 Garner et al. Aug 2012 A1
20120214004 Hashimoto et al. Aug 2012 A1
20120216570 Abramov et al. Aug 2012 A1
20120229787 Van et al. Sep 2012 A1
20120234049 Bolton Sep 2012 A1
20120234807 Sercel et al. Sep 2012 A1
20120237731 Boegli et al. Sep 2012 A1
20120255935 Kakui et al. Oct 2012 A1
20120262689 Van et al. Oct 2012 A1
20120293784 Xalter et al. Nov 2012 A1
20120297568 Spezzani Nov 2012 A1
20120299219 Shimoi et al. Nov 2012 A1
20120302139 Darcangelo et al. Nov 2012 A1
20120320458 Knutson Dec 2012 A1
20120324950 Dale et al. Dec 2012 A1
20130019637 Sol et al. Jan 2013 A1
20130031879 Yoshikane et al. Feb 2013 A1
20130034688 Koike et al. Feb 2013 A1
20130044371 Rupp et al. Feb 2013 A1
20130047671 Kohli Feb 2013 A1
20130056450 Lissotschenko et al. Mar 2013 A1
20130061636 Imai et al. Mar 2013 A1
20130068736 Mielke et al. Mar 2013 A1
20130071079 Peckham et al. Mar 2013 A1
20130071080 Peckham et al. Mar 2013 A1
20130071081 Peckham et al. Mar 2013 A1
20130075480 Yokogi et al. Mar 2013 A1
20130078891 Lee et al. Mar 2013 A1
20130091897 Fugii et al. Apr 2013 A1
20130122264 Fujii et al. May 2013 A1
20130126573 Hosseini et al. May 2013 A1
20130126751 Mizoguchi et al. May 2013 A1
20130129947 Harvey et al. May 2013 A1
20130133367 Abramov et al. May 2013 A1
20130136408 Bookbinder et al. May 2013 A1
20130139708 Hotta Jun 2013 A1
20130143416 Norval Jun 2013 A1
20130149434 Oh et al. Jun 2013 A1
20130149494 Koike et al. Jun 2013 A1
20130167590 Teranishi et al. Jul 2013 A1
20130171425 Wang et al. Jul 2013 A1
20130174607 Wootton et al. Jul 2013 A1
20130174610 Teranishi et al. Jul 2013 A1
20130177033 Muro et al. Jul 2013 A1
20130180285 Kariya Jul 2013 A1
20130180665 Gomez et al. Jul 2013 A2
20130189806 Hoshino Jul 2013 A1
20130192305 Black et al. Aug 2013 A1
20130209731 Nattermann et al. Aug 2013 A1
20130210245 Jackl Aug 2013 A1
20130216573 Trusheim et al. Aug 2013 A1
20130220982 Thomas et al. Aug 2013 A1
20130221053 Zhang Aug 2013 A1
20130222877 Greer Aug 2013 A1
20130224439 Zhang et al. Aug 2013 A1
20130228918 Chen et al. Sep 2013 A1
20130247615 Boek et al. Sep 2013 A1
20130248504 Kusuda Sep 2013 A1
20130266757 Giron et al. Oct 2013 A1
20130270240 Kondo Oct 2013 A1
20130280495 Matsumoto Oct 2013 A1
20130288010 Akarapu et al. Oct 2013 A1
20130291598 Saito et al. Nov 2013 A1
20130312460 Kunishi et al. Nov 2013 A1
20130323469 Abramov et al. Dec 2013 A1
20130334185 Nomaru Dec 2013 A1
20130340480 Nattermann et al. Dec 2013 A1
20130344684 Bowden Dec 2013 A1
20140023087 Czompo Jan 2014 A1
20140027951 Srinivas et al. Jan 2014 A1
20140034730 Lee Feb 2014 A1
20140036338 Bareman Feb 2014 A1
20140042202 Lee Feb 2014 A1
20140047957 Wu Feb 2014 A1
20140076869 Lee et al. Mar 2014 A1
20140083986 Zhang et al. Mar 2014 A1
20140102146 Saito et al. Apr 2014 A1
20140110040 Cok Apr 2014 A1
20140113797 Yamada et al. Apr 2014 A1
20140133119 Kariya et al. May 2014 A1
20140141192 Fernando May 2014 A1
20140141217 Gulati et al. May 2014 A1
20140147623 Shorey et al. May 2014 A1
20140147624 Streltsov et al. May 2014 A1
20140165652 Saito Jun 2014 A1
20140174131 Saito et al. Jun 2014 A1
20140182125 Rozbicki Jul 2014 A1
20140199519 Schillinger et al. Jul 2014 A1
20140216108 Weigel et al. Aug 2014 A1
20140238962 Nawrodt et al. Aug 2014 A1
20140239034 Cleary et al. Aug 2014 A1
20140239552 Srinivas et al. Aug 2014 A1
20140290310 Green Oct 2014 A1
20140291122 Bando Oct 2014 A1
20140320947 Egerton et al. Oct 2014 A1
20140333929 Sung et al. Nov 2014 A1
20140339207 Sugiyama et al. Nov 2014 A1
20140340730 Bergh Nov 2014 A1
20140352400 Barrilado et al. Dec 2014 A1
20140361463 DeSimone et al. Dec 2014 A1
20150014891 Amatucci et al. Jan 2015 A1
20150034612 Hosseini et al. Feb 2015 A1
20150038313 Hosseini Feb 2015 A1
20150044445 Garner et al. Feb 2015 A1
20150059986 Komatsu et al. Mar 2015 A1
20150060402 Burkett et al. Mar 2015 A1
20150075221 Kawaguchi et al. Mar 2015 A1
20150075222 Mader Mar 2015 A1
20150110442 Zimmel et al. Apr 2015 A1
20150118522 Hosseini Apr 2015 A1
20150121960 Hosseini May 2015 A1
20150122656 Hosseini May 2015 A1
20150136743 Hosseini May 2015 A1
20150140241 Hosseini May 2015 A1
20150140735 Hosseini May 2015 A1
20150151380 Hosseini Jun 2015 A1
20150158120 Courvoisier et al. Jun 2015 A1
20150165396 Mattson et al. Jun 2015 A1
20150165548 Marjanovic et al. Jun 2015 A1
20150165560 Hackert et al. Jun 2015 A1
20150165561 Le et al. Jun 2015 A1
20150165562 Marjanovic et al. Jun 2015 A1
20150165563 Manley et al. Jun 2015 A1
20150166391 Marjanovic et al. Jun 2015 A1
20150166393 Marjanovic et al. Jun 2015 A1
20150166394 Marjanovic et al. Jun 2015 A1
20150166395 Marjanovic et al. Jun 2015 A1
20150166396 Marjanovic et al. Jun 2015 A1
20150166397 Marjanovic et al. Jun 2015 A1
20150183679 Saito Jul 2015 A1
20150209922 Yoshikawa Jul 2015 A1
20150232369 Marjanovic et al. Aug 2015 A1
20150299018 Bhuyan et al. Oct 2015 A1
20150311058 Antsiferov et al. Oct 2015 A1
20150350991 Sayadi et al. Dec 2015 A1
20150352671 Darzi Dec 2015 A1
20150360991 Grundmueller et al. Dec 2015 A1
20150362817 Patterson Dec 2015 A1
20150362818 Greer Dec 2015 A1
20150367442 Bovatsek et al. Dec 2015 A1
20160008927 Grundmueller et al. Jan 2016 A1
20160009066 Nieber et al. Jan 2016 A1
20160009585 Bookbinder et al. Jan 2016 A1
20160016257 Hosseini Jan 2016 A1
20160023922 Addiego et al. Jan 2016 A1
20160031737 Hoppe et al. Feb 2016 A1
20160031745 Ortner et al. Feb 2016 A1
20160039044 Kawaguchi Feb 2016 A1
20160059359 Krueger et al. Mar 2016 A1
20160060156 Krueger et al. Mar 2016 A1
20160097960 Dixit Apr 2016 A1
20160111380 Sundaram et al. Apr 2016 A1
20160138328 Behmke May 2016 A1
20160152516 Bazemore et al. Jun 2016 A1
20160154284 Sano Jun 2016 A1
20160159679 West Jun 2016 A1
20160168396 Letocart et al. Jun 2016 A1
20160279895 Marjanovic et al. Sep 2016 A1
20160280580 Bohme Sep 2016 A1
20160282521 Uchiyama et al. Sep 2016 A1
20160290791 Buono et al. Oct 2016 A1
20160311717 Nieber et al. Oct 2016 A1
20160368100 Marjanovic et al. Dec 2016 A1
20170002601 Bergh et al. Jan 2017 A1
20170008791 Kim et al. Jan 2017 A1
20170052381 Huang et al. Feb 2017 A1
20170169847 Tamaki Jun 2017 A1
20170183168 Jia Jun 2017 A1
20170197868 Gupta et al. Jul 2017 A1
20170225996 Bookbinder et al. Aug 2017 A1
20170229318 Tsunetomo et al. Aug 2017 A1
20170252859 Kumkar et al. Sep 2017 A1
20170355634 Dumenil Dec 2017 A1
20170368638 Tayebati et al. Dec 2017 A1
20180029919 Schnitzler et al. Feb 2018 A1
20180029920 Marjanovic et al. Feb 2018 A1
20180062342 Comstock et al. Mar 2018 A1
20180118602 Hackert et al. May 2018 A1
20180133837 Greenberg et al. May 2018 A1
20180134606 Wagner et al. May 2018 A1
20180186677 Ito et al. Jul 2018 A1
20180186678 Boeker et al. Jul 2018 A1
20180297887 Spier et al. Oct 2018 A1
Foreign Referenced Citations (381)
Number Date Country
1259924 Jul 2000 CN
2388062 Jul 2000 CN
1473087 Feb 2004 CN
1517313 Aug 2004 CN
1573364 Feb 2005 CN
1619778 May 2005 CN
1735568 Feb 2006 CN
1283409 Nov 2006 CN
1890074 Jan 2007 CN
1920632 Feb 2007 CN
1930097 Mar 2007 CN
101031383 Sep 2007 CN
101043936 Sep 2007 CN
101048255 Oct 2007 CN
101386466 Mar 2009 CN
101502914 Aug 2009 CN
101595554 Dec 2009 CN
101610870 Dec 2009 CN
201357287 Dec 2009 CN
101622722 Jan 2010 CN
101637849 Feb 2010 CN
201471092 May 2010 CN
101862907 Oct 2010 CN
101965242 Feb 2011 CN
101980982 Feb 2011 CN
102046545 May 2011 CN
102060437 May 2011 CN
102105256 Jun 2011 CN
102248302 Nov 2011 CN
102272355 Dec 2011 CN
102326232 Jan 2012 CN
102343631 Feb 2012 CN
102356049 Feb 2012 CN
102356050 Feb 2012 CN
102574246 Jul 2012 CN
102596830 Jul 2012 CN
102642092 Aug 2012 CN
102649199 Aug 2012 CN
102672355 Sep 2012 CN
102674709 Sep 2012 CN
102741012 Oct 2012 CN
102898014 Jan 2013 CN
102916081 Feb 2013 CN
102923939 Feb 2013 CN
102962583 Mar 2013 CN
103013374 Apr 2013 CN
103079747 May 2013 CN
103086591 May 2013 CN
103143841 Jun 2013 CN
103159401 Jun 2013 CN
203021443 Jun 2013 CN
103237771 Aug 2013 CN
103273195 Sep 2013 CN
103316990 Sep 2013 CN
103329035 Sep 2013 CN
103339559 Oct 2013 CN
103359947 Oct 2013 CN
103359948 Oct 2013 CN
103531414 Jan 2014 CN
103746027 Apr 2014 CN
203509350 Apr 2014 CN
103817434 May 2014 CN
103831539 Jun 2014 CN
104108870 Oct 2014 CN
104344202 Feb 2015 CN
204211638 Mar 2015 CN
105081564 Nov 2015 CN
105164581 Dec 2015 CN
105209218 Dec 2015 CN
105246850 Jan 2016 CN
103224117 Feb 2016 CN
105392593 Mar 2016 CN
105517969 Apr 2016 CN
205328860 Jun 2016 CN
106007349 Oct 2016 CN
1020448 Dec 1957 DE
2231330 Jan 1974 DE
10322376 Dec 2004 DE
102006042280 Jun 2007 DE
102006035555 Jan 2008 DE
102011000768 Aug 2012 DE
102012010635 Nov 2013 DE
102012110971 May 2014 DE
102013103370 Oct 2014 DE
102013223637 May 2015 DE
102014213775 Jan 2016 DE
102014116958 May 2016 DE
102016102768 Aug 2017 DE
004167 Feb 2004 EA
270897 Feb 1992 EP
0609978 Aug 1994 EP
656241 Dec 1998 EP
938946 Sep 1999 EP
949541 Oct 1999 EP
1306196 May 2003 EP
1159104 Aug 2004 EP
1609559 Dec 2005 EP
1043110 Aug 2006 EP
1990125 Nov 2008 EP
2105239 Sep 2009 EP
2133170 Dec 2009 EP
2202545 Jun 2010 EP
2258512 Dec 2010 EP
2398746 Dec 2011 EP
2574983 Apr 2013 EP
2754524 Jul 2014 EP
2781296 Sep 2014 EP
2783784 Oct 2014 EP
2859984 Apr 2015 EP
2922793 Sep 2015 EP
3311947 Apr 2018 EP
2989294 Oct 2013 FR
0768515 Feb 1957 GB
1242172 Aug 1971 GB
2481190 Jan 2015 GB
53-018756 Feb 1978 JP
61-027212 Feb 1986 JP
61-074794 Apr 1986 JP
62-046930 Feb 1987 JP
63-018756 Jan 1988 JP
63-192561 Aug 1988 JP
64-077001 Mar 1989 JP
1179770 Jul 1989 JP
05-274085 Oct 1993 JP
05-300544 Nov 1993 JP
06-082720 Mar 1994 JP
6318756 Nov 1994 JP
08-184581 Jul 1996 JP
09-109243 Apr 1997 JP
9106243 Apr 1997 JP
11-079770 Mar 1999 JP
11-197498 Jul 1999 JP
11269683 Oct 1999 JP
11-330597 Nov 1999 JP
11-347861 Dec 1999 JP
11347758 Dec 1999 JP
2000-225485 Aug 2000 JP
2000-327349 Nov 2000 JP
2001-130921 May 2001 JP
2001138083 May 2001 JP
2001-179473 Jul 2001 JP
2002-045985 Feb 2002 JP
2002-205181 Jul 2002 JP
2002210730 Jul 2002 JP
2002228818 Aug 2002 JP
2002-321081 Nov 2002 JP
2003025085 Jan 2003 JP
2003-062756 Mar 2003 JP
2003-088985 Mar 2003 JP
2003114400 Apr 2003 JP
2003154517 May 2003 JP
2003181668 Jul 2003 JP
2003238178 Aug 2003 JP
3445250 Sep 2003 JP
2003-340579 Dec 2003 JP
2004-182530 Jul 2004 JP
2004209675 Jul 2004 JP
2004-348137 Dec 2004 JP
2005-000952 Jan 2005 JP
2005104819 Apr 2005 JP
2005-135964 May 2005 JP
2005-144487 Jun 2005 JP
2005-179154 Jul 2005 JP
2005-219960 Aug 2005 JP
2005205440 Aug 2005 JP
2005-263623 Sep 2005 JP
2005288503 Oct 2005 JP
2006-108478 Apr 2006 JP
3775250 May 2006 JP
3775410 May 2006 JP
2006130691 May 2006 JP
2006-150385 Jun 2006 JP
2006-182009 Jul 2006 JP
2006-240948 Sep 2006 JP
3823108 Sep 2006 JP
2006248885 Sep 2006 JP
2006-327711 Dec 2006 JP
2007021548 Feb 2007 JP
2007196277 Aug 2007 JP
2007253203 Oct 2007 JP
2008-018547 Jan 2008 JP
2008-132616 Jun 2008 JP
2008-168327 Jul 2008 JP
2008-522950 Jul 2008 JP
2008-266046 Nov 2008 JP
2008-288577 Nov 2008 JP
2009056482 Mar 2009 JP
2009-082958 Apr 2009 JP
2009-084089 Apr 2009 JP
2009-126779 Jun 2009 JP
2009-142886 Jul 2009 JP
2009-172633 Aug 2009 JP
2009-178725 Aug 2009 JP
2009-255114 Nov 2009 JP
2009-269057 Nov 2009 JP
2010-017990 Jan 2010 JP
2010-042424 Feb 2010 JP
4418282 Feb 2010 JP
2010-046761 Mar 2010 JP
4592855 Dec 2010 JP
2011-011212 Jan 2011 JP
2011-037707 Feb 2011 JP
2011049398 Mar 2011 JP
2011-512259 Apr 2011 JP
4672689 Apr 2011 JP
2011-517622 Jun 2011 JP
2011517299 Jun 2011 JP
2011-138083 Jul 2011 JP
2011-520748 Jul 2011 JP
2011-147943 Aug 2011 JP
2011-171334 Sep 2011 JP
2011-240291 Dec 2011 JP
4880820 Feb 2012 JP
2012024782 Feb 2012 JP
2012031018 Feb 2012 JP
2012-506837 Mar 2012 JP
2012-517957 Aug 2012 JP
2012159749 Aug 2012 JP
2012-521889 Sep 2012 JP
2012-187618 Oct 2012 JP
2012-232894 Nov 2012 JP
2012-528772 Nov 2012 JP
2013007842 Jan 2013 JP
2013-031879 Feb 2013 JP
2013043808 Mar 2013 JP
2013-063863 Apr 2013 JP
2013075802 Apr 2013 JP
2013091578 May 2013 JP
2013-121908 Jun 2013 JP
2013-132664 Jul 2013 JP
2013-136075 Jul 2013 JP
2013-144613 Jul 2013 JP
2013-528492 Jul 2013 JP
2013-150990 Aug 2013 JP
2013-168445 Aug 2013 JP
5274085 Aug 2013 JP
2013-536081 Sep 2013 JP
5300544 Sep 2013 JP
2013187247 Sep 2013 JP
5318748 Oct 2013 JP
2013203630 Oct 2013 JP
2013203631 Oct 2013 JP
2013223886 Oct 2013 JP
2013-245153 Dec 2013 JP
2014-001102 Jan 2014 JP
2014-037006 Feb 2014 JP
2014-104484 Jun 2014 JP
2014-117707 Jun 2014 JP
2014-156289 Aug 2014 JP
2015-030040 Feb 2015 JP
2015-076115 Apr 2015 JP
2015-091606 May 2015 JP
2015-129076 Jul 2015 JP
2015-519722 Jul 2015 JP
2015-536896 Dec 2015 JP
2015-543336 Feb 2016 JP
2016-021077 Feb 2016 JP
2016-503383 Feb 2016 JP
6061193 Jan 2017 JP
2012015366 Feb 2002 KR
10-2002-0031573 May 2002 KR
2009057161 Jun 2009 KR
10-2009-0107417 Oct 2009 KR
2010-0120297 Nov 2010 KR
1020621 Mar 2011 KR
10-2011-0120862 Nov 2011 KR
2011-0121637 Nov 2011 KR
10-2012-0000073 Jan 2012 KR
10-1120471 Mar 2012 KR
2012074508 Jul 2012 KR
2012-0102675 Sep 2012 KR
2013-0031377 Mar 2013 KR
2013031380 Mar 2013 KR
10-1259349 Apr 2013 KR
1269474 May 2013 KR
10-2013-0075651 Jul 2013 KR
2013-0079395 Jul 2013 KR
10-2013-0111269 Oct 2013 KR
2013124646 Nov 2013 KR
10-2013-0135873 Dec 2013 KR
1344368 Dec 2013 KR
2014022980 Feb 2014 KR
2014022981 Feb 2014 KR
2014064220 May 2014 KR
20140064220 May 2014 KR
10-2014-0112652 Sep 2014 KR
10-2015-0009153 Jan 2015 KR
2015-0016176 Feb 2015 KR
2017998 Jun 2018 NL
480550 Mar 2002 TW
201041027 Nov 2010 TW
201107253 Mar 2011 TW
201139025 Nov 2011 TW
I362370 Apr 2012 TW
201226345 Jul 2012 TW
201311592 Mar 2013 TW
201331136 Aug 2013 TW
201339111 Oct 2013 TW
201433550 Sep 2014 TW
201436968 Oct 2014 TW
I468354 Jan 2015 TW
I520804 Feb 2016 TW
201612615 Apr 2016 TW
9821154 May 1998 WO
1999029243 Jun 1999 WO
1999063900 Dec 1999 WO
0239063 May 2002 WO
2003007370 Jan 2003 WO
2004110693 Dec 2004 WO
2005063645 Jul 2005 WO
2006017583 Feb 2006 WO
2006073098 Jul 2006 WO
2007094160 Aug 2007 WO
2007119740 Oct 2007 WO
2008012186 Jan 2008 WO
2008049389 May 2008 WO
2008080182 Jul 2008 WO
2008102848 Aug 2008 WO
2008108332 Sep 2008 WO
2008126742 Oct 2008 WO
2008128612 Oct 2008 WO
2009012913 Jan 2009 WO
2009114372 Sep 2009 WO
2009114375 Sep 2009 WO
2009119694 Oct 2009 WO
2010035736 Apr 2010 WO
2010096359 Aug 2010 WO
2010111609 Sep 2010 WO
2010129459 Nov 2010 WO
2011025908 Mar 2011 WO
2011056781 May 2011 WO
2012006736 Jan 2012 WO
2012075072 Jun 2012 WO
2012108052 Aug 2012 WO
2012166753 Dec 2012 WO
2013016157 Jan 2013 WO
2013022148 Feb 2013 WO
2013043173 Mar 2013 WO
2013084877 Jun 2013 WO
2013084879 Jun 2013 WO
2013138802 Sep 2013 WO
2013150990 Oct 2013 WO
2013153195 Oct 2013 WO
2014010490 Jan 2014 WO
2014012125 Jan 2014 WO
2014028022 Feb 2014 WO
2014058663 Apr 2014 WO
2014075995 May 2014 WO
2014064492 May 2014 WO
2014079478 May 2014 WO
2014079570 May 2014 WO
2014085663 Jun 2014 WO
2014111385 Jul 2014 WO
2014111794 Jul 2014 WO
2014121261 Aug 2014 WO
2014132493 Sep 2014 WO
2014161534 Oct 2014 WO
2014161535 Oct 2014 WO
2015077113 May 2015 WO
2015094898 Jun 2015 WO
2015095014 Jun 2015 WO
2015095151 Jun 2015 WO
2015095088 Jun 2015 WO
2015095090 Jun 2015 WO
2015095146 Jun 2015 WO
2015114032 Aug 2015 WO
2015128833 Sep 2015 WO
2015132008 Sep 2015 WO
2015127583 Sep 2015 WO
2016007843 Jan 2016 WO
2016010991 Jan 2016 WO
2016005455 Jan 2016 WO
2016010954 Jan 2016 WO
2016079275 May 2016 WO
2016089799 Jun 2016 WO
2016100954 Jun 2016 WO
2016154284 Sep 2016 WO
2017009149 Jan 2017 WO
2017079570 May 2017 WO
2017091529 Jun 2017 WO
2017093393 Jun 2017 WO
Non-Patent Literature Citations (125)
Entry
Kerr, “Filamentary tracks formed in transparent optical glass by laser beam self-focusing. II. Theoretical Analysis” Physical Review A 4(3), Sep. 1971, pp. 1195-1218.
Abakians, H. et al.; Evaporative Cutting of a Semitransparent Body With a Moving CW Laser; Journal of Heat Transfer; Nov. 1988; pp. 924-930; vol. 110; ASME.
Ahmed, F. et al.; Display glass cutting by femtosecond laser induced single shot periodic void array; Applied Physics A Material Science & Processing; Jun. 3, 2008; pp. 189-192; vol. 93; Springer-Verlag.
Bagchi, S. et al.; Fast ion beams from intense, femtosecond laser irradiated nanostructured surfaces; Applied Physics B Lasers and Optics; Jun. 27, 2007; pp. 167-173; vol. 88; Springer-Verlag.
Bhuyan, M.K. et al.; Femtosecond non-diffracting Bessel beams and controlled nanoscale ablation; ResearchGate Conference Paper; Sep. 2011; pp. 1-4.
Bhuyan, M.K. et al.; Laser micro- and nanostructuring using femtosecond Bessel beams; The European Physical Journal Special Topics; Dec. 7, 2011; pp. 101-110; vol. 1999; EDP Sciences, Springer-Verlag.
Bhuyan, M.K. et al.; Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp-controlled ultrafast laser Bessel beams; Applied Physics Letters; Jan. 14, 2014; pp. 021107-1-021107-4; vol. 104; AIP Publishing LLC.
Bhuyan, M.K. et al.; Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass; Nonlinear Optics and Applications IV; 2010; pp. 77281V-1-77281V-8; vol. 7728; SPIE.
Case Design Guidelines for Apple Devices; Sep. 13, 2013; pp. 1-58; Apple Inc.
Chiao, R. Y. et al.; Self-Trapping of Optical Beams; Physical Review Letters; Oct. 12, 1964; pp. 479-482; vol. 13, No. 15.
Corning Eagle Amlcd Glass Substrates Material Information; Apr. 2005; pp. MIE 201-1-MIE 201-3; Corning Incorporated.
Corning 1737 AMLCD Glass Substrates Material Information; Aug. 2002; pp. MIE 101-1-MIE 101-3; Corning Incorporated.
Couairon, A. et al.; Femtosecond filamentation in transparent media; ScienceDirect Physical Reports; Feb. 6, 2007; pp. 47-189; vol. 441; Elsevier B.V.
Courvoisier, F. et al.; Applications of femtosecond Bessel beams to laser ablation; Applied Physics A Materials Science & Processing; Sep. 6, 2012; pp. 29-34; vol. 112; Springer-Verlag.
Courvoisier, F. et al.; Surface nanoprocessing with nondiffracting femtosecond Bessel beams; Optics Letters; Oct. 15, 2009; pp. 3163-3165; vol. 34, No. 20; Optical Society of America.
Dong, M. et al.; On-axis irradiance distribution of axicons illuminated by spherical wave; ScienceDirect Optics & Laser Technology; Sep. 2007; pp. 1258-1261; vol. 39; Elsevier Ltd.
Duocastella, M. et al.; Bessel and annular beams for materials processing; Laser & Photonics Reviews; 2012; pp. 607-621; vol. 6, No. 5.
Durnin, J.; Exact solutions for nondiffracting beams. 1. The scalar theory; J. Opt. Soc. Am. A; Apr. 1987; pp. 351-654; vol. 4, No. 4; Optical Society of America.
Eaton, S. et al.; Heat accumulation effects in femtosecond laser-written waveguides with variable repetition rate; Optics Express; Jun. 13, 2005; pp. 4708-4716; vol. 13, No. 12; Optical Society of America.
Gattass, R. et al.; Micromachining of bulk glass with bursts of femtosecond laser pulses at variable repetition rates; Optics Express; Jun. 12, 2006; pp. 5279-5284; vol. 14, No. 12; Optical Society of America.
Gori, F. et al.; Analytical derivation of the optimum triplicator; Optics Communications; Dec. 1, 1998; pp. 13-16; vol. 157; Elsevier B.V.
Honda, M. et al.; A Novel Polymer Film that Controls Light Transmission; Progress in Pacific Polymer Science 3; 1994; pp. 159-169; Springer-Verlag Berlin Heidelberg.
Hu, Z. et al.; 5-Axis Laser Cutting Interference Detection and Correction Based on STL Model; Chinese Journal of Lasers; Dec. 2009; pp. 3313-3317; vol. 36, No. 12.
Huang, Z. et al.; Laser etching of glass substrates by 1064 nm laser irradiation; Applied Physics A Materials Science & Processing; Jun. 6, 2008; pp. 159-163; vol. 93; Springer-Veriag.
Juodkazis, S. et al.; Laser-Induced Microexplosion Confined in the Bulk of a Sapphire Crystal: Evidence of Multimegabar Pressures; Physical Review Letters; Apr. 28, 2006; pp. 166101-1-166101-4; vol. 96; The American Physical Society.
Karlsson, S. et al.; The Technology of Chemical Glass Strengthening—A Review; Glass Technology—European Journal of Glass Science and Technology Part A; Apr. 2010; pp. 41-54; vol. 51, No. 2.
Levy, U. et al.; Design, fabrication, and characterization of circular Dammann gratings based on grayscale lithography; Optics Letters; Mar. 15, 2010; pp. 880-882; vol. 35, No. 6; Optical Society of America.
Liu, X. et al.; Laser Ablation and Micromachining with Ultrashort Laser Pulses; IEEE Journal of Quantum Electronics; Oct. 1997; p. 1706-1716; vol. 33, No. 10; IEEE.
Maeda, K. et al.; Optical performance of angle dependent light control glass; Optical Materials Technology for Energy Efficiency and Solar Energy Conversion X; 1991; pp. 138-148; vol. 1536; SPIE.
Mbise, G. et al.; Angular selective window coatings; theory and experiments; J. Phys. D: Appl. Phys.; 1997; pp. 2103-2122; vol. 30; IOP Publishing Ltd.
McGloin, D. et al.; Bessel beams: diffraction in a new light; Contemporary Physics; Jan.-Feb. 2005; pp. 15-28; vol. 46; Taylor & Francis Ltd.
Merola, F. et al.; Characterization of Bessel beams generated by polymeric microaxicons; Measurement Science and Technology; May 15, 2012; pp. 1-10; vol. 23; IOP Publishing Ltd.
Mirkhalaf, M. et al.; Overcoming the biillleness of glass through bio-inspiration and micro-architecture; Nature Communications; Jan. 28, 2014; pp. 1-9; Macmillan Publishers Limited.
Romero, L. et al.; Theory of optimal beam splitting by phase gratings. II. Square and hexagonal gratings; J. Opt. Soc. Am. A; Aug. 2007; pp. 2296-2312; vol. 24, No. 8; Optical Society of America.
Salleo, A. et al.; Machining of transparent materials using an IR and UV nanosecond pulsed laser; Applied Physics A Materials Science & Processing; Sep. 20, 2000; pp. 601-608; vol. 71; Springer-Veriag.
Serafetinides, A. et al.; Polymer Ablation by Ultra-Short Pulsed Lasers; Proceedings of SPIE; 2000; pp. 409-415.
Shah, L. et al.; Micromachining with a High Repetition Rate Femtosecond Fiber Laser; JLMN—Journal of Laser Micro/Nanoengineering; Nov. 2008; pp. 157-162; vol. 3, No. 3.
Shealy, D. et al.; Geometric optics-based design of laser beam shapers; Opt. Eng.; Nov. 2003; pp. 3123-3138; vol. 42, No. 11; Society of Photo-Optical Instrumentation Engineers.
Stoian, R. et al.; Spatial and temporal laser pulse design for material processing on ultrafast scales; Applied Physics A Materials Science & Processing; Jan. 1, 2014; pp. 119-127; vol. 114; Springer-Verlag Berlin Heidelberg.
Thiele, E.; Relation between Catalytic Activity and Size of Particle; Industrial and Engineering Chemistry; Jul. 1939; pp. 916-920; vol. 31, No. 7.
Toytman, I. et al.; Optical breakdown in transparent media with adjustable axial length and location; Optic Express; Nov. 22, 2010; pp. 24688-24698; vol. 18, No. 24; Optical Society of America.
Velpula, P. et al.; Ultrafast imaging of free carriers: controlled excitation with chirped ultrafast laser Bessel beams; Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XIX; Proc. Of SPIE; 2014; pp. 896711-1-896711-8; vol. 8967; SPIE.
Wang, Z. et al.; Investigation on CO2 laser irradiation inducing glass strip peeling for microchannel formation; Biomicrofluidics; Mar. 12, 2012; pp. 012820-1-012820-12; vol. 6; American Institute of Physics.
Ra & RMS: Calculating Surface Roughness; Harrison Eelectropolishing; 2012.
Wu, W. et al.; Optimal Orientation of the Cutting Head for Enhancing Smoothness Movement in Three-Dimensional Laser Cutting; Chinese Journal of Lasers; Jan. 2013; pp. 0103005-1-0103005-7, vol. 10, No. 1.
GT ASF Grown Sapphire Cover and Touch Screen Material; www.gtat.com; 2012; pp. 1-2; GTAT Corporation.
Xu, H. et al.; Optimization of 3D laser cutting head orientation based on minimum energy consumption; Int J Adv Manuf Technol; Jun. 28, 2014; pp. 1283-1291; vol. 74; Springer-Verlag London.
Yan, Y. et al.; Fiber structure to convert a Gaussian beam to higher-order optical orbital angular momentum modes; Optics Letters; Aug. 15, 2012; pp. 3294-3296; vol. 37, No. 16; Optical Society of America.
“EagleEtch” Product Brochure, EuropeTec USA Inc., pp. 1-8, Aug. 1, 2014.
“PHAROS High-power femtosecond laser system” product brochure; Light Conversion, Vilnius, LT; Apr. 18, 2011, pp. 1-2.
“TruMicro 5000” Product Manual, Trumpf Laser GmbH + Co. KG, pp. 1-4, Aug. 2011.
“Abramov et al., ““Laser separation of chemically strengthened glass””; Physics Procedia 5 (2010) 285-290, Elsevier.;doi: 10.1016/j.phpro.2010.08.054”.
Arimoto et al., “Imaging properties of axicon in a scanning optical system”; Applied Optics, Nov. 1, 1992, vol. 31, No. 31, pp. 6653-6657.
Bhuyan et al., “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams”; Applied Physics Letters 97, 081102 (2010); doi: 10.1063/1.3479419.
Bhuyan et al., “High aspect ratio taper-free microchannel fabrication using femtosecond Bessel beams”; Optics Express (2010) vol. 18, No. 2, pp. 566-574.
Cubeddu et al., “A compact time-resolved reflectance system for dual-wavelength multichannel assessment of tissue absorption and scattering”; Part of the SPIE Conference on Optical Tomography and Spectroscopy of Tissue III, San Jose, CA (Jan. 1999), SPIE vol. 3597, 0277-786X/99, pp. 450-455.
Cubeddu et al., “Compact tissue oximeter based on dual-wavelength multichannel time-resolved reflectance”; Applied Optics, vol. 38, No. 16, Jun. 1, 1999, pp. 3670-3680.
Ding et al., “High-resolution optical coherence tomography over a large depth range with an axicon lens”; Optic Letters, vol. 27, No. 4, pp. 243-245, Feb. 15, 2002, Optical Society of America.
Girkin et al., “Macroscopic multiphoton biomedical imaging using semiconductor saturable Bragg reflector modelocked Lasers”; Part of the SPIE Conference on Commercial and Biomedical Applications of Ultrafast Lasers, San Jose, CA (Jan. 1999), SPIE vol. 3616, 0277-786X/99, pp. 92-98.
Glezer et al., “Ultrafast-laser driven micro-explosions in transparent materials”; Applied Physics Letters, vol. 71 (1997), pp. 882-884.
Golub, I., “Fresnel axicon”; Optic Letters, vol. 31, No. 12, Jun. 15, 2006, Optical Society of America, pp. 1890-1892.
Herman et al., “Laser micromachining of ‘transparent’ fused silica with 1-ps pulses and pulse trains”; Part of the SPIE Conference on Commercial and Biomedical Applications of Ultrafast Lasers, San Jose, CA (Jan. 1999), SPIE vol. 3616, 0277-786X/99, pp. 148-155.
Kosareva et al., “Formation of extended plasma channels in a condensed medium upon axicon focusing of a femtosecond laser pulse”; Quantum Electronics 35 (11) 1013-1014 (2005), Kvantovaya Elektronika and Turpion Ltd. doi: 10.1070/QE2005v035n11ABEH013031.
Kruger et al., “Femtosecond-pulse visible laser processing of transparent materials”; Applied Surface Science 96-98 (1996) 430-438.
Kruger et al., “Laser micromachining of barium aluminium borosilicate glass with pluse durations between 20 fs and 3 ps”; Applied Surface Science 127-129 (1998) 892-898.
Kruger et al., “Structuring of dielectric and metallic materials with ultrashort laser pulses between 20 fs and 3 ps”; SPIE vol. 2991, 0277-786X/97, pp. 40-47.
Lapczyna et al., “Ultra high repetition rate (133 MHz) laser ablation of aluminum with 1.2-ps pulses”; Applied Physics A 69 [Suppl.], S883-S886, Springer-Verlag (1999); doi: 10.1007/s003399900300.
Perry et al., “Ultrashort-pulse laser machining of dielectric materials”; Journal of Applied Physics, vol. 85, No. 9, May 1, 1999, American Institute of Physics, pp. 6803-6810.
Perry et al., “Ultrashort-pulse laser machining”; UCRL-ID-132159, Sep. 1998, pp. 1-38.
Perry et al., “Ultrashort-pulse laser machining”; UCRL-JC-132159 Rev 1., Jan. 22, 1999, pp. 1-24.
Polynkin et al., “Extended filamentation with temporally chirped femtosecond Bessel-Gauss beams in air”; Optics Express, vol. 17, No. 2, Jan. 19, 2009, OSA, pp. 575-584.
Serafetinides et al., “Ultra-short pulsed laser ablation of polymers”; Applied Surface Science 180 (2001) 42-56.
Sundaram et al., “Inducing and probing non-thermal transitions in semiconductors using femtosecond laser pulses”; Nature Miracles, vol. 1, Dec. 2002, Nature Publishing Group (2002), pp. 217-224.
Vanagas et al., “Glass cutting by femtosecond pulsed irradiation”; J. Micro/Nanolith. MEMS MOEMS. 3(2), 358-363 (Apr. 1, 2004); doi: 10.1117/1.1668274.
Varel et al., “Micromachining of quartz with ultrashort laser pulses”; Applied Physics A 65, 367-373, Springer-Verlag (1997).
Yoshino et al., “Micromachining with a high repetition rate femtosecond fiber laser”; JLMN—Journal of Laser Micro/Nanoengineering vol. 3, No. 3 (2008), pp. 157-162.
Zeng et al. “Characteristic analysis of a refractive axicon system for optical trepanning”; Optical Engineering 45(9), 094302 (Sep. 2006), pp. 094302-1-094302-10.
Zhang et al., “Design of diffractive-phase axicon illuminated by a Gaussian-profile beam”; Acta Physica Sinica (overseas edition), vol. 5, No. 5 (May 1996) Chin. Phys. Soc., 1004-423X/96/05050354-11, pp. 354-364.
Jonas Weiss, et al., “Optical Interconnects for Disaggregated Resources in Future Datacenters”, ECOC 2014, Cannes-France, 3 pgs.
Tymon Barwicz, et al., “Assembly of Mechanically Compliant Interfaces between Optical Fibers and Nanophotonic Chips”, Tymon Barwicz (IBM), et al., Electronic Components & Technology Conference, 2014,. 978-1799-2407-3, 2014 IEEE, pp. 179-185.
“Aviation Manufacturing Technology”; Beijing Aviation Manufacturing Engineering Research Institute Aviation Industry Press; (2013) p. 147.
“Eagle etch Data Sheet”.
Amended claims 1 , 2 Amended Claims (Nov. 21, 2018) GMvp4 p. 1.
Analyse of claims 1-11 GMvP7 p. 1.
Betriebsanleitung TruMicro Series 5000, “Ausgabe May 2008 Betriebsanleitung TruMicro Series 5000_Anlage E2a-1.pdf”.
Betriebsanleitung; TruMicro 5000; Aug. 2011; pp. 1-4.
Case Design Guidelines for Apple Devices Release R5 (https://web.archive.org/web/20131006050442/https://developer.apple.com/resources/cases/Case-Design-Guidelines.pdf; archived on Oct. 6, 2013).
Case study: Simulation einer Beschneidung des Femfelds eines Bessel-GauB-Strahls GMvP6 p. 1.
Claim 1—published on Nov. 20, 2019 EP947: Anspruch 1—erteiltam 20. Nov. 2019 GMvp5 p. 1.
Corning Inc., Corning Eagle2000TM AMLCD Glass Substrates Material Information, issued Apr. 2005. (Year: 2005).
D5 Claims GMvP2 p. 1.
D6 Amended claim 1 EP947: Anspruch 1—geandert am 21. Nov. 2018 GMvp3 p. 1.
Design of Diffractivephase Axicon Illuminated by a Gaussian-Profile Beam, Zhangg Uo-Qing, D Ongb I-Zhen,Y Angg Uo-Zhen, and Gu Ben-Yuan, vol. 6, No. 5 Acta Physica Sinica May 1996, pp. 354.
EagleEtch; TheAnti-glare Glass for Technical Display Applications; Glass and Polymer Technologies; pp. 1-8; EuropTec USA Inc.
Eaton et al. “Heat accumulation effects in femtosecond laser written waveguides with variable repetition rates”, Opt. Exp. 5280, vol. 14, No. 23 Jun. 2006.
Faccio et al. “Kerr-induced spontaneous Bessel beam formation in the regime of strong two-photon absorption” Optics Express 16(11) 2008, pp. 8213-8218.
Flamm et al., “Higher-order Bessel-like Beams for Optimized Ultrafast Processing of Transparent Materials” GMvP 19.
Flamm et al., “Higher-order Bessel-like Beams for Optimized Ultrafast Processing of Transparent Materials” GMvP 20.
Gollier et al., U.S. Appl. No. 62/024,122, “Systems and Methods for Processing Transparent Materials Using Adjustable Laser Beam Focal Lines”, filed Jul. 14, 2014., U.S. Appl. No. 62/024,122.
High aspect ratio machining . . . Anlage E8-1.pdf.
http://www.gtat.com/Collateral/Documents/Engltsh-US/Sapphire/12-21-12_GT_TnuchScreen_ V3_web.pdf.
Korean Patent Application No. 10-2015-7022064 Notice of Allowance of Patent dated Dec. 21, 2020; 3 Pages; (1 page of English Translation and 2 pages of Original Document) Korean Patent Office.
Korean Patent Application No. 10-2016-7019343 Official Notice for Filing Response dated Dec. 17, 2020; 11 Pages; (4 Pages of English Translation and 7 Pages of Original Document) Korean Patent Office.
Louis A. Romero* and Fred M. Dickey, “Theory of optimal beam splitting by phase gratings. I. One-dimensional gratings” J. Opt. Soc. Am., A 24, 2280, (2007).
Merkmalsgliederung Patentanspruch 1 des Streitpatents, “Merkmalsgliederung Patentanspruch 1_Anlage E15-1.pd1”.
Merkmalsgliederung Patentanspruch 12 des Streitpatents,“Merkmalsgliederung Patentanspruch 12_Anlage E16-1.pdf”.
Norm: DI N EN ISO 11146-2, 2005 DIN EN ISO 11146-2 May 2, 2005 GMvP 21 pages.
Norm: DIN EN ISO 11146-1, 2005 GMvP DIN EN ISO 11146:1999-09 Apr. 1, 2005 GMvP 23 pages.
Norm: ISO/TR 11146-3 , Technical Report First edition GMvP Norm-TR 1 Pages.
Perry, M. et al.; Ultrashort-Pulse Laser Machining; International Congress on Applications of Lasers and Electro-Optics; Orlando, Florida; Nov. 16-19, 1998; pp. 1-24.
Polesana (Polesana, P., Dubietis, A., Porras, A. Kucinskas, E. Faccio, D. Couairon, A. and DiTrapani, P.,, “Near-field dynamics of ultrashort pulsed Bessel beams in media with Kerr nonlinearity”, Physical Review E 73, 056612 (2006)).
Product Data Sheet for Corning Eagle XG Slim Glass, Issued Aug. 2013; 2 Pages.
Product data sheet for Corning Eagle XR glass substrate, issued Jan. 2006 (Year: 2006).
Produktbeschreibung Pharos Laser vom Apr. 18, 2011, “Pharos_2011 Anlage E 1 a-1. pdf”.
Sukumaran, “Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers with Through-Package-Vias at Same Pitch as TSVs in Silicon.” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, No. 5: 786-795, (2014.).
Sukumaran, “Through-Package-Via Formation and Metallization of Glass Interposers.”, Electronic Components and Technology Conference: 557-563, (2010).
Unichains, Engineering Manual: Innovative Belt & Chain solutions for every industry and application, available publically at least as of Jun. 1, 2016 as evidenced at the following hyperlink: https://web.archive.org/web/20160601OOOOOO/http://www.unichains.com/.
Vanagas et al., “Glass Cutting by Femtosecond Pulsed Irradiation”, J. Microlith., Microfa., Microsyst., 3(2) 358-363, 2004.
What is the difference between Ra and RMS?; Harrison Electropolishing LP; (http://www.harrisonep.com/electropolishingra.html), Accessed Aug. 8, 2016.
ICNIRP, Infrared Radiation, https://www.icnirp.org/en/frequencies/infrared/index.html#:˜:text=Wavelength, accessed Apr. 7, 2021 (Year: 2014).
Liu,Xiuwen, “Graphical Audio-Visual Technology Tips”, Apr. 30, 2006, pp. 58-59. (Original Document Only).
Tian e al., “Development status and Prospects of TFT-LCD Substrate Glass Chemical Composition”, vol. 29, No. 6, 2010, pp. 1348-1362 (English Abstract Submitted).
Tsai et al. , “Internal modification for cutting transparent glass using femtosecond Bessel beams”, Optical Engineering, Soc. of Photo-optical Instrumentation Engineering, Bellingham, vol. 53, May 2014, p. 51503.
Chinese Patent Application No. 201780061955.X, Office Action dated Jun. 15, 2021, 11 pages (English Translation Only), Chinese Patent Office.
Taiwanese Patent Application No. 106134567, Office Action dated Aug. 30, 2021, 3 pages (English Translation Only); Taiwanese Patent Office.
Related Publications (1)
Number Date Country
20170023841 A1 Jan 2017 US
Provisional Applications (2)
Number Date Country
62022896 Jul 2014 US
61917092 Dec 2013 US
Continuation in Parts (1)
Number Date Country
Parent 14530457 Oct 2014 US
Child 15288071 US