Electron attachment assisted formation of electrical conductors

Abstract

This invention is directed to a method of forming electrical conductors comprised of conductive metals generally carried on a substrate. In the method, a conductor formulation generally comprised of metal particles or metal precursor or mixture thereof, typically in the form of an ink or paste, is applied to the substrate and converted into a conductive metal by application of sufficient heat and for a sufficient time to effect sintering thereof while in the presence of a negatively charged ionic reducing gas.

Description

Claims

1. A method of forming an electrical conductor on a substrate which comprises the steps: applying a conductor formulation comprised of at least one ingredient selected from the group consisting of metal particles, metal precursors and mixture thereof onto a substrate;exposing the conductor formulation to an electrically activated reducing gas; and,converting the ingredient to metal and forming the electrical conductor.

2. The method of claim 1 wherein the electrically activated reducing gas is generated by the steps: positioning the conductor formulation between a first electrode and a second electrode; andestablishing a direct current (DC) voltage between said first and second electrodes to form the electrically activated reducing gas.

3. The method of claim 1 wherein said electrically activated reducing gas is a negatively charged ionic reducing gas.

4. The method of claim 3 wherein said reducing gas is selected from the group consisting of hydrogen, ammonia, carbon monoxide and mixtures thereof.

5. The method of claim 4 wherein said gas mixture is 0.1 to 100% by volume of hydrogen and a carrier gas.

6. The method of claim 5 wherein said gas mixture is 1 to 4% by volume of hydrogen and a carrier gas.

7. The method of claim 6 wherein said carrier gas is selected from the group consisting of nitrogen, helium, argon, neon, krypton, xenon, and mixtures thereof.

8. The method of claim 3 wherein said conductor formulation is comprised of said ingredient and indium/tin oxide.

9. The method of claim 1 wherein the conductor formulation is comprised of at least one ingredient selected from the group consisting of metal particles, metal precursor having the formula M(+a)yX(−b)wLz where M is a metal suited for use in producing electrical conductors, X is a negatively charged ligand, and L is a neutral ligand and where ay=bw and a is from 1-5, b is from 1-3 and z is from 0 to 5, and a mixture of said particles and metal precursors.

10. The method of claim 9 wherein the metal employed in the ingredient is selected from the group consisting of copper, silver, gold, zinc, cadmium, palladium, iridium, ruthenium, osmium, rhodium, platinum, iron, cobalt, nickel, manganese, indium, tin, antimony, lead, bismuth, vanadium, chromium, titanium, tantalum, aluminum, magnesium, calcium, strontium, barium, cadmium, gallium, bismuth, and mixtures thereof.

11. The method of claim 9 wherein the metal employed in the ingredient is selected from the group consisting of palladium, rhodium, platinum, cobalt, nickel, manganese, indium, tin, antimony, lead, bismuth, aluminum and mixtures thereof.

12. The method of claim 10 wherein the metal employed in the ingredient is selected from the group consisting of copper, silver, platinum, gold and mixtures thereof.

13. The method of claim 10 wherein the ligand X is selected from the group consisting of carboxylate, halocarboxylate, amide, haloamide, amido, imino, haloimino, beta-diketone, halo(beta-diketone), beta-ketoimine, halo-(beta-ketoimine), beta-diimine, halo(beta-diimine), beta-ketoester, halo-(beta-ketoester), beta-ketoamide, halo-(beta- ketoamide), alkoxy, haloalkoxy, aminoalkoxy, phenoxy, halophenoxy, alkyl, fluoroalkyl, aryl, haloaryl, alkenyl, haloalkenyl, haloalkyne, trifluoromethylsulfonate, beta-ketonate-olefin, beta-ketoimine olefin, beta-diimineolefin, halide, nitride, hydroxide, sulfate, sulfite, nitrate, nitrite, carbonate, bicarbonate, and mixtures thereof and the ligand L is selected from the group consisting of ammonia, substituted amine, diamine, triamine, imine, nitrile, alkene, alkyne, carbon monoxide or alkyl or phenyl substituted phosphine complexes and mixtures thereof.

14. The method of claim 13 wherein the ligand X is selected from the group consisting of carboxylate, beta-diketone, beta-ketoimine, beta-diimine, beta-ketoester and mixtures thereof, and z is 0.

15. The method of claim 13 wherein the conductor formulation is comprised of a mixture of (a) a metal precursor of the formula M(+a)yX(−b)wLz; (b) a first metal powder having a particle size of from 1 to 10 microns, (c) a second metal powder comprised of a particle size from 5 to 80 nanometers; and, (d) an organic liquid.

16. The method of claim 15 wherein said metal employed in the ingredient is selected from the group consisting of copper, silver and mixtures thereof.

17. The process of claim 16 wherein the substrate is selected from the group consisting of porous paper; porous polymers selected from the group consisting of polyethylene terephthalate, polyimide, polyethylene naphthenate, polysulfone, and polyetherimide; and mixtures thereof.

18. The process of claim 17 wherein the substrate is surface coated with a semiconductive material.

19. A process for forming a film from a conductor formulation comprised of at least one ingredient selected from the group consisting of metal particles, metal precursors and mixtures thereof and converting the ingredient to sintered metal, which comprises: exposing the conductor formulation to a negatively charged ionic reducing gas to convert said ingredient to a metal and to sinter the thus formed metal.

20. The process of claim 19 wherein the ingredient in the conductor formulation is selected from the group consisting of metal particles; a metal precursor of the formula M(+a)yX(−b)wLz where M is selected from the group consisting of copper, silver and mixtures thereof, X is a negatively charged ligand, L is a neutral ligand, and ay=bw, and a is from 1-5, b is from 1-3 and z is 0; and mixtures thereof.

21. The process of claim 20 wherein the conductor formulation is comprised of at least one metal precursor selected from the group consisting of copper formate, copper acetate, copper trifluoroacetate, copper nitrate, copper methoxide, copper neodecanoate, copper ketoimine, copper 2-ethylhexanoate, copper thiosulfate, copper pentafluoropropionate, copper octanoate, the corresponding silver derivatives of such copper compounds and mixtures thereof.

22. The process of claim 21 wherein the temperature employed during said exposure to said negatively charged reducing gas is from 25 to 350° C.

23. The process of claim 22 wherein the temperature employed during said exposure to said negatively charged reducing gas is from 25 to 200° C.

24. The process of claim 23 wherein the temperature employed during said exposure to said negatively charged reducing gas is from 100 to 150° C.

25. The process of claim 24 wherein the pressure employed during exposure to said negatively charged reducing gas is from 10 to 50 psia.

26. The process of claim 21 wherein the formulation is comprised of indium/tin oxide.

27. A process for forming an electrical conductor, which comprises the steps of: (a) applying a formulation comprised of at least one ingredient selected from the group consisting of metal particles, metal precursor and mixtures thereof onto a substrate, said metal in said metal particles or metal precursor selected from the group of copper, silver and mixtures thereof;(b) contacting the formulation with an electrically activated reducing gas comprised of an inert gas and hydrogen wherein said hydrogen is present in said reducing gas in an amount from 1 to 4% by volume; and,(c) converting said ingredient to metal and sintering the thus formed metal.

28. The process of claim 27 wherein the metal precursor is selected from the group consisting of copper formate, copper neodecanoate, silver neodecanoate and mixtures thereof.