Claims
- 1. An electronic substrate produced by the method comprising applying a coating composition comprising 10 to 90 wt % hydrogen silsesquioxane resin and 90 to 10 wt % polysilazane onto an electronic substrate;
- and heating the coated substrate at a temperature sufficient to convert the coating composition into a ceramic coating.
- 2. The electronic substrate as claimed in claim 1 wherein the coated substrate is heated at a temperature in the range of 50.degree. C. and 800.degree. C.
- 3. The electronic substrate as claimed in claim 1 wherein the coated substrate is heated in an environment containing a gas selected from the group consisting of air, O.sub.2, oxygen plasma, an inert gas, ammonia, amines, moisture, H.sub.2 and N.sub.2 O.
- 4. The electronic substrate as claimed in claim 1 wherein the coating composition add comprises a platinum, rhodium or copper catalyst in an amount of 5 to 500 ppm platinum, rhodium or copper based in the weight of hydrogen silsesquioxane resin and polysilazane.
- 5. The electronic substrate as claimed in claim 1 wherein the coating composition additionally comprises a filler.
- 6. The electronic substrate as claimed in claim 5 wherein the coating composition additionally contains a material which modifies the surface of the filler for better adhesion.
- 7. The electronic substrate as claimed in claim 5 wherein the filler is in a form selected from the group consisting of powders, particles, flakes, filaments and microballoons.
Parent Case Info
This application is a division of application Ser. No. 08/491,734 filed Jun. 19, 1995 which application is now: U.S. Pat. No. 5,635,240.
US Referenced Citations (21)
Foreign Referenced Citations (1)
Number |
Date |
Country |
WO9302472 |
Feb 1993 |
WOX |
Divisions (1)
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Number |
Date |
Country |
Parent |
491734 |
Jun 1995 |
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