containing a filler

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H01L23/295

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/295containing a filler

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cured product and production method of same, and resin sheet and re...
- Patent number 12,227,631
- Issue date Feb 18, 2025
- Ajinomoto Co., Inc.
- Hiroyuki Sakauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid compression molding or encapsulant compositions
- Patent number 12,187,843
- Issue date Jan 7, 2025
- Henkel AG & Co. KGaA
- Jay Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compounds and packages for encapsulating electronic components
- Patent number 12,152,133
- Issue date Nov 26, 2024
- Infineon Technologies AG
- Andreas Waterloo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid resin composition for sealing and electronic component appar...
- Patent number 12,131,970
- Issue date Oct 29, 2024
- Resonac Corporation
- Hidetoshi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package
- Patent number 12,132,009
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Su Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing resin composition
- Patent number 12,116,479
- Issue date Oct 15, 2024
- Sumitomo Bakelite Co., Ltd.
- Jun Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,113,029
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Tatsuto Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 12,080,565
- Issue date Sep 3, 2024
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor device packaging and associated systems an...
- Patent number 12,080,616
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Suresh K. Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,057,359
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Assembly of stacked elements and method of producing the same
- Patent number 12,046,524
- Issue date Jul 23, 2024
- TDK Corporation
- Yongfu Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing package structure
- Patent number 12,021,037
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite component and method for manufacturing the same
- Patent number 12,002,760
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,002,686
- Issue date Jun 4, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,996,345
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip protective film and method for manufacturing same, and chip
- Patent number 11,978,686
- Issue date May 7, 2024
- Wuhan Choice Technology Co, Ltd
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 11,961,795
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow package and method for manufacturing same
- Patent number 11,955,394
- Issue date Apr 9, 2024
- Nippon Kayaku Kabushiki Kaisha
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die and package structure
- Patent number 11,948,904
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS
- Publication number 20250069969
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070082
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Sojeong HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-CORROSION PARTICLES IN SEMICONDUCTOR DEVICE
- Publication number 20250069970
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Isabelle Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250062138
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062302
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a system in package having several layers a...
- Publication number 20250038121
- Publication date Jan 30, 2025
- THALES
- Damien CHALAVOUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, CURED PRODUCT, ENCAPSULANT AND ADHESIVE
- Publication number 20250034319
- Publication date Jan 30, 2025
- Asahi Kasei Kabushiki Kaisha
- Ryosuke OKAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of Manufacturing a Package Having an Electronic Component an...
- Publication number 20250029884
- Publication date Jan 23, 2025
- INFINEON TECHNOLOGIES AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...
- Publication number 20250026920
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Minsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
- Publication number 20250015002
- Publication date Jan 9, 2025
- AOI ELECTRONICS CO., LTD.
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND
- Publication number 20250006575
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240429180
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL COMPOSITION
- Publication number 20240425718
- Publication date Dec 26, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yuri ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...
- Publication number 20240404898
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404932
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240404908
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
- Publication number 20240387305
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Meng How Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES
- Publication number 20240379602
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL METAL CARBIDE, NITRIDE, AND CARBONITRIDE FILMS AND...
- Publication number 20240365522
- Publication date Oct 31, 2024
- Drexel University
- Yury GOGOTSI
- C01 - INORGANIC CHEMISTRY
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355691
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGE STRUCTURE AND MEMORY SYSTEM
- Publication number 20240347406
- Publication date Oct 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shanshan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240347496
- Publication date Oct 17, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...
- Publication number 20240339368
- Publication date Oct 10, 2024
- FUJIFILM CORPORATION
- Atsushi NAKAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE WITH ENCAPSULANT AND FURTHER ENCAPSULANT THEREON
- Publication number 20240332102
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF STACKED ELEMENTS AND METHOD OF PRODUCING THE SAME
- Publication number 20240332103
- Publication date Oct 3, 2024
- TDK Corporation
- Yongfu CAI
- H01 - BASIC ELECTRIC ELEMENTS

containing a filler

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cured product and production method of same, and resin sheet and re...

Electronic device

Semiconductor device and method of manufacturing the same

Liquid compression molding or encapsulant compositions

Thermal conductive film

Package structure and method of manufacturing the same

Mold compounds and packages for encapsulating electronic components

Semiconductor device and method of forming ultra high density embed...

Liquid resin composition for sealing and electronic component appar...

Semiconductor package

Sealing resin composition

Package having an electronic component and an encapsulant encapsula...

Semiconductor device and manufacturing method thereof

Method of manufacturing an integrated fan-out package having fan-ou...

Chip packaging method and package structure

Reinforced semiconductor device packaging and associated systems an...

Semiconductor device and corresponding method of manufacture

Semiconductor package and method of fabricating the same

Assembly of stacked elements and method of producing the same

Package structure with bridge die laterally wrapped by insulating e...

Method for manufacturing package structure

Composite component and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Package structure and manufacturing method thereof

Chip protective film and method for manufacturing same, and chip

Semiconductor package and package-on-package including the same

Semiconductor device package having multi-layer molding compound an...

Hollow package and method for manufacturing same

Semiconductor package including high thermal conductivity layer

Die and package structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS

SEMICONDUCTOR PACKAGE

ANTI-CORROSION PARTICLES IN SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

Manufacturing method of a system in package having several layers a...

EPOXY RESIN COMPOSITION, CURED PRODUCT, ENCAPSULANT AND ADHESIVE

Method of Manufacturing a Package Having an Electronic Component an...

LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...

SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...

SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

UNDERFILL COMPOSITION

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...

METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES

TWO-DIMENSIONAL METAL CARBIDE, NITRIDE, AND CARBONITRIDE FILMS AND...

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MEMORY SYSTEM

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...

PACKAGE WITH ENCAPSULANT AND FURTHER ENCAPSULANT THEREON

ASSEMBLY OF STACKED ELEMENTS AND METHOD OF PRODUCING THE SAME