Oxides or nitrides or carbides

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H01L23/291

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/291Oxides or nitrides or carbides

Industries

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Patents Grantslast 30 patents

Information Patent Grant
GaN/two-dimensional AlN heterojunction rectifier on silicon substra...
- Patent number 12,154,990
- Issue date Nov 26, 2024
- South China University of Technology
- Wenliang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic module
- Patent number 12,136,576
- Issue date Nov 5, 2024
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with re-fill layer
- Patent number 12,100,634
- Issue date Sep 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride device and method of fabricating a Group III nitr...
- Patent number 12,087,830
- Issue date Sep 10, 2024
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip protected against back-face attacks
- Patent number 12,087,708
- Issue date Sep 10, 2024
- STMicroelectronics (Crolles 2) SAS
- Sebastien Petitdidier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 12,074,086
- Issue date Aug 27, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate, film forming method, and film forming apparatus
- Patent number 12,074,078
- Issue date Aug 27, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Hashigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including an α-ray source and an electronic circuit influenc...
- Patent number 12,062,675
- Issue date Aug 13, 2024
- FUJIFILM Corporation
- Tetsushi Miyata
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, chip structure and method of fabricating the same
- Patent number 12,057,437
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma resistant process chamber lid
- Patent number 12,049,696
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Xiaowei Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Planar passivation layers
- Patent number 12,046,527
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Shu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor device and method for manufacturing the same
- Patent number 12,040,244
- Issue date Jul 16, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Kai Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride-based semiconductor packaged structure and method for m...
- Patent number 12,040,259
- Issue date Jul 16, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shangqing Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive and protective coating for electronic device
- Patent number 12,033,426
- Issue date Jul 9, 2024
- Next Biometrics Group ASA
- Matias N. Troccoli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure comprising thermally conductive layer around the...
- Patent number 12,033,963
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control of semiconductor die
- Patent number 12,021,002
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Ting Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having composite dielectric film struct...
- Patent number 12,014,966
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for pad openings and trenches
- Patent number 12,002,774
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for protecting semiconductor structures
- Patent number 11,996,340
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with flexible reinforcement structure
- Patent number 11,990,350
- Issue date May 21, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable fuse with single fuse pad and control methods thereof
- Patent number 11,978,701
- Issue date May 7, 2024
- Skyworks Solutions, Inc.
- Bo Zhou
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical etch heterolithic integrated circuit devices
- Patent number 11,978,808
- Issue date May 7, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy Edward Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, high electron mobility transistor and fabr...
- Patent number 11,967,642
- Issue date Apr 23, 2024
- Vanguard International Semiconductor Corporation
- Chih-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 11,961,781
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,955,397
- Issue date Apr 9, 2024
- Vanguard International Semiconductor Corporation
- Shin-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,955,522
- Issue date Apr 9, 2024
- Vanguard International Semiconductor Corporation
- Cheng-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Steam oxidation initiation for high aspect ratio conformal radical...
- Patent number 11,948,791
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Christopher S. Olsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,948,802
- Issue date Apr 2, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION
- Publication number 20240421030
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240421235
- Publication date Dec 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Yi YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE DEVICE
- Publication number 20240413212
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET TRANSISTOR
- Publication number 20240413224
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20240413233
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...
- Publication number 20240413034
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240404908
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395649
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Chulmin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...
- Publication number 20240395773
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES FOR USE IN HIGH-PRESSURE ENVIRONMENTS
- Publication number 20240395934
- Publication date Nov 28, 2024
- The Boeing Company
- Leora Peltz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395648
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER FEATURES
- Publication number 20240387380
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240371717
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Donggon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES
- Publication number 20240363458
- Publication date Oct 31, 2024
- Joon Bu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE, FILM FORMING METHOD, AND FILM FORMING APPARATUS
- Publication number 20240363468
- Publication date Oct 31, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi HASHIGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ISOLATION WITH CONFORMAL COATING
- Publication number 20240363465
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE
- Publication number 20240355696
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Beryllium Metallization
- Publication number 20240355738
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR PASSIVATION LAYERS
- Publication number 20240355695
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Po-Shu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347408
- Publication date Oct 17, 2024
- Sumitomo Electric Industries, Ltd.
- Masaki KIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240347515
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SILIC...
- Publication number 20240332414
- Publication date Oct 3, 2024
- Sumitomo Electric Industries, Ltd.
- Yu SAITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES I...
- Publication number 20240321663
- Publication date Sep 26, 2024
- Afshin DADVAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321786
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STRUCTURE AND SEMICONDUCTOR ELEMENT
- Publication number 20240312854
- Publication date Sep 19, 2024
- FLOSFIA INC.
- Hiroyuki ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304510
- Publication date Sep 12, 2024
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE
- Publication number 20240304465
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...
- Publication number 20240304697
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPPING LAYER
- Publication number 20240304696
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Oxides or nitrides or carbides

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

GaN/two-dimensional AlN heterojunction rectifier on silicon substra...

Microelectronic module

Hermetic package for high CTE mismatch

Semiconductor device with re-fill layer

Group III nitride device and method of fabricating a Group III nitr...

Chip protected against back-face attacks

RF devices with nanotube particles for enhanced performance and met...

Laminate, film forming method, and film forming apparatus

Device including an α-ray source and an electronic circuit influenc...

Semiconductor device and method for manufacturing semiconductor device

Package structure, chip structure and method of fabricating the same

Plasma resistant process chamber lid

Planar passivation layers

Nitride semiconductor device and method for manufacturing the same

III-nitride-based semiconductor packaged structure and method for m...

Thermally conductive and protective coating for electronic device

Package structure comprising thermally conductive layer around the...

Warpage control of semiconductor die

Semiconductor memory device having composite dielectric film struct...

Passivation scheme for pad openings and trenches

Passivation layer for protecting semiconductor structures

Semiconductor devices with flexible reinforcement structure

Programmable fuse with single fuse pad and control methods thereof

Vertical etch heterolithic integrated circuit devices

Semiconductor structure, high electron mobility transistor and fabr...

RF devices with nanotube particles for enhanced performance and met...

Semiconductor structure

Semiconductor structure and method of forming the same

Steam oxidation initiation for high aspect ratio conformal radical...

Methods and devices related to radio frequency devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

GROUP III NITRIDE DEVICE

NANOSHEET TRANSISTOR

ON DIE FLEXURE CONTROL DEVICE AND METHOD

GALLIUM NITRIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...

SEMICONDUCTOR DEVICES FOR USE IN HIGH-PRESSURE ENVIRONMENTS

SEMICONDUCTOR DEVICE

REDISTRIBUTION LAYER FEATURES

SEMICONDUCTOR DEVICE

CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES

LAMINATE, FILM FORMING METHOD, AND FILM FORMING APPARATUS

DIE ISOLATION WITH CONFORMAL COATING

METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE

Power Semiconductor Devices Including Beryllium Metallization

PLANAR PASSIVATION LAYERS

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SILIC...

HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES I...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

LAMINATED STRUCTURE AND SEMICONDUCTOR ELEMENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE

SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH CAPPING LAYER