Oxides or nitrides or carbides

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/291Oxides or nitrides or carbides

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Nanosheet transistor
- Patent number 12,369,379
- Issue date Jul 22, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 12,362,191
- Issue date Jul 15, 2025
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer features
- Patent number 12,354,959
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge encapsulation for high voltage devices
- Patent number 12,315,770
- Issue date May 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- Timothy Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite passivatio...
- Patent number 12,315,796
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 12,300,548
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,289,901
- Issue date Apr 29, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing resin composition, electronic component, method for man...
- Patent number 12,275,839
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective laser annealing method
- Patent number 12,278,275
- Issue date Apr 15, 2025
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,116
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,249,548
- Issue date Mar 11, 2025
- SK Hynix Inc.
- Sang Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Type III-V semiconductor device with structured passivation
- Patent number 12,230,700
- Issue date Feb 18, 2025
- Infineon Technologies Austria AG
- Simone Lavanga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly protective wafer edge sidewall protection layer
- Patent number 12,211,766
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zone-controlled rare-earth oxide ALD and CVD coatings
- Patent number 12,209,307
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Xiaowei Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High electron mobility transistor and method of manufacturing the same
- Patent number 12,199,174
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Junhyuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN/two-dimensional AlN heterojunction rectifier on silicon substra...
- Patent number 12,154,990
- Issue date Nov 26, 2024
- South China University of Technology
- Wenliang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic module
- Patent number 12,136,576
- Issue date Nov 5, 2024
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with re-fill layer
- Patent number 12,100,634
- Issue date Sep 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride device and method of fabricating a Group III nitr...
- Patent number 12,087,830
- Issue date Sep 10, 2024
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip protected against back-face attacks
- Patent number 12,087,708
- Issue date Sep 10, 2024
- STMicroelectronics (Crolles 2) SAS
- Sebastien Petitdidier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 12,074,086
- Issue date Aug 27, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate, film forming method, and film forming apparatus
- Patent number 12,074,078
- Issue date Aug 27, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Hashigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including an α-ray source and an electronic circuit influenc...
- Patent number 12,062,675
- Issue date Aug 13, 2024
- FUJIFILM Corporation
- Tetsushi Miyata
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, chip structure and method of fabricating the same
- Patent number 12,057,437
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma resistant process chamber lid
- Patent number 12,049,696
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Xiaowei Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Planar passivation layers
- Patent number 12,046,527
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Shu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A TYPE III-NI...
- Publication number 20250240993
- Publication date Jul 24, 2025
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...
- Publication number 20250226353
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Chin Yong Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TRIM EDGE PROTECTION
- Publication number 20250218888
- Publication date Jul 3, 2025
- Intel Corporation
- Bradley PARKS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-ON-CHIP GAP FILL METHOD AND STRUCTURE
- Publication number 20250210600
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING A SUBSTRATE WITH CONNECTING PORTIONS
- Publication number 20250201641
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Gyuhyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183110
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DIE WITH CHAMFERED PASSIVATION LAYER
- Publication number 20250183108
- Publication date Jun 5, 2025
- NXP USA, Inc.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC COMPOSITE
- Publication number 20250178979
- Publication date Jun 5, 2025
- Heraeus Electronics GmbH & Co. KG
- Richard WACKER
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
TYPE III-V SEMICONDUCTOR DEVICE WITH STRUCTURED PASSIVATION
- Publication number 20250176206
- Publication date May 29, 2025
- Infineon Technologies Austria AG
- Simone Lavanga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174585
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS HAVING PROTECTED IDENTIFICATION MARKS...
- Publication number 20250174573
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250169123
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Seong Seok Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157908
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-IC FOR RF APPLICATIONS
- Publication number 20250157988
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND RECESSED MULTI-STEP F...
- Publication number 20250142924
- Publication date May 1, 2025
- NXP USA, Inc.
- Bernhard Grote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WIT...
- Publication number 20250142918
- Publication date May 1, 2025
- Wolfspeed, Inc.
- Saptha Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ISOLATED DIES
- Publication number 20250140624
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hau NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-TEMPERATURE WIDE BANDGAP POWER MODULE AND PREPARATION METHOD T...
- Publication number 20250140623
- Publication date May 1, 2025
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Zhiqiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132215
- Publication date Apr 24, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Jiebin ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEMT TRANSISTOR
- Publication number 20250118613
- Publication date Apr 10, 2025
- STMicroelectronics International N.V.
- Paolo COLPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER
- Publication number 20250112102
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
- Publication number 20250112103
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Kohei EBIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250098201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Junhyuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT COLLAPSE REDUCTION USING ALUMINUM NITRIDE BACK BARRIER AND...
- Publication number 20250089290
- Publication date Mar 13, 2025
- Soctera, Inc.
- Austin Hickman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250087555
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK
- Publication number 20250079345
- Publication date Mar 6, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Ian McCallum-Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF A PROTECTIVE ATOMIC LAYER DEPOSITION (ALD) OR PLASMA...
- Publication number 20250062169
- Publication date Feb 20, 2025
- Infineon Technologies Austria AG
- Frederik Otto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250054926
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Oxides or nitrides or carbides

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nanosheet transistor

Methods and devices related to radio frequency devices

Redistribution layer features

Edge encapsulation for high voltage devices

Method for preparing semiconductor device with composite passivatio...

Moat coverage with dielectric film for device passivation and singu...

Semiconductor device and method for manufacturing the same

Reinforcing resin composition, electronic component, method for man...

Selective laser annealing method

Hermetic package for high CTE mismatch

Semiconductor structure and manufacturing method thereof

Semiconductor device and method for fabricating the same

Type III-V semiconductor device with structured passivation

Glass carrier having protection structure and manufacturing method...

Highly protective wafer edge sidewall protection layer

Zone-controlled rare-earth oxide ALD and CVD coatings

High electron mobility transistor and method of manufacturing the same

GaN/two-dimensional AlN heterojunction rectifier on silicon substra...

Microelectronic module

Hermetic package for high CTE mismatch

Semiconductor device with re-fill layer

Group III nitride device and method of fabricating a Group III nitr...

Chip protected against back-face attacks

RF devices with nanotube particles for enhanced performance and met...

Laminate, film forming method, and film forming apparatus

Device including an α-ray source and an electronic circuit influenc...

Semiconductor device and method for manufacturing semiconductor device

Package structure, chip structure and method of fabricating the same

Plasma resistant process chamber lid

Planar passivation layers

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A TYPE III-NI...

SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...

WAFER TRIM EDGE PROTECTION

SYSTEM-ON-CHIP GAP FILL METHOD AND STRUCTURE

SEMICONDUCTOR PACKAGES HAVING A SUBSTRATE WITH CONNECTING PORTIONS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT DIE WITH CHAMFERED PASSIVATION LAYER

METAL-CERAMIC COMPOSITE

TYPE III-V SEMICONDUCTOR DEVICE WITH STRUCTURED PASSIVATION

SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGED SEMICONDUCTOR CHIPS HAVING PROTECTED IDENTIFICATION MARKS...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

3D-IC FOR RF APPLICATIONS

SEMICONDUCTOR DEVICE WITH MULTI-STEP GATE AND RECESSED MULTI-STEP F...

GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS CONFIGURED WIT...

PACKAGES WITH ISOLATED DIES

HIGH-TEMPERATURE WIDE BANDGAP POWER MODULE AND PREPARATION METHOD T...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HEMT TRANSISTOR

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER

SEMICONDUCTOR DEVICE AND POWER CONVERTER

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME

CURRENT COLLAPSE REDUCTION USING ALUMINUM NITRIDE BACK BARRIER AND...

DIE STRUCTURES AND METHODS OF FORMING THE SAME

SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK

APPLICATION OF A PROTECTIVE ATOMIC LAYER DEPOSITION (ALD) OR PLASMA...

SEMICONDUCTOR PACKAGE AND METHOD