Patent Application
20250006565
The present disclosure relates to an electronic component housing package and an electronic module.
A device housing package according to the related art is described in, for example, Patent Literature 1.
In an embodiment, (1) an electronic component housing package includes a base, a frame, and a wiring conductor. The base includes a first region. The frame is positioned on the base and surrounds the first region. The frame includes a first frame side surface. The wiring conductor is positioned on a surface of the frame. The frame includes a first projecting portion projecting outward from the first frame side surface in a first direction. The wiring conductor includes a first conductor and a second conductor. The second conductor is spaced outward from the first conductor in the first direction. The first conductor and the second conductor are positioned on the first projecting portion and on a same plane.
(2) In the electronic component housing package according to (1) described above, when a direction along the first frame side surface is a second direction, a plurality of the first conductors is arranged in the second direction, and a plurality of the second conductors is arranged in the second direction.
(3) In the electronic component housing package according to (1) or (2) described above, the frame includes a second frame side surface and a second projecting portion. The second frame side surface faces the first frame side surface in the first direction. The second projecting portion projects outward from the second frame side surface in the first direction. The wiring conductor includes a third conductor and a fourth conductor. The fourth conductor is spaced from the third conductor in the first direction. The third conductor and the fourth conductor are positioned on the second projecting portion and on a same plane.
(4) In the electronic component housing package according to any one of (1) to (3) described above, the base overlaps the first projecting portion in plan view.
(5) In the electronic component housing package according to (4) described above, the base includes a first base side surface positioned along the first frame side surface. The first projecting portion includes a first-projecting-portion side surface positioned along the first frame side surface. A distance L1 from the first frame side surface to the first base side surface in the first direction is equal to or greater than one-half of a distance L2 from the first frame side surface to the first-projecting-portion side surface in the first direction.
(6) In the electronic component housing package according to (4) or (5) described above, the base overlaps the first conductor in plan view.
(7) In the electronic component housing package according to (6) described above, the base is spaced from the second conductor in plan view.
(8) In the electronic component housing package according to any one of (1) to (7) described above, the frame is made of a ceramic material.
(9) In the electronic component housing package according to any one of (1) to (8) described above, the base is made of a metal material.
(10) In the electronic component housing package according to any one of (1) to (9) described above, the frame includes a first upper surface. The first projecting portion includes a second upper surface. The first conductor and the second conductor are positioned on the second upper surface. The first upper surface is flush with the second upper surface.
(11) In the electronic component housing package according to (10) described above, the first upper surface includes a joining region. A lid body or a seal ring is joined to the joining region. The joining region is spaced from the first conductor and the second conductor.
(12) In the electronic component housing package according to (11) described above, the first projecting portion includes a first-projecting-portion side surface positioned along the first frame side surface. A distance D1 between the joining region and the first conductor in the first direction is greater than a distance D2 between the first-projecting-portion side surface and the second conductor in the first direction.
(13) The electronic component housing package according to any one of (1) to (12) described above further includes a transparent member joined to the base. The base includes a through-hole extending through the base in the first region. The transparent member overlaps the through-hole.
(14) The electronic component housing package according to any one of (1) to (13) further includes a first connector joined to the base. The first connector includes at least two or more wiring terminals. The first connector is positioned on the first projecting portion. Each of the at least two or more wiring terminals is electrically connected to a respective one of the first conductor and the second conductor.
(15) In an embodiment, an electronic module includes an electronic component, a lid body and the electronic component housing package according to any one of (1) to (14) described above. The electronic component is positioned on the first region. The lid body is positioned on the frame.
Patent Literature 1 describes a known device housing package. In recent years, the number of electronic components housed in device housing packages has increased, and this has led to an increase in the required number of electrode terminals. The device housing packages are required not only to include a greater number of electrode terminals but also to be smaller and have a reduced height.
The following describes some exemplary embodiments with reference to the drawings. Note that any direction of an electronic component housing package may be upward or downward. For convenience, a Cartesian coordinate system xyz is defined, and a positive z-direction is defined as upward. In the present disclosure, the concept of plan view includes see-through plan view.
As illustrated in
The base 1 includes a first region 1r. An electronic component 9 described below may be directly or indirectly mounted on the first region 1r. The base 1 is, for example, rectangular in plan view, and may have a size of 5 mm×10 mm to 25 mm×50 mm and a thickness of 0.5 mm to 20 mm. The base 1 may have a rectangular shape with rounded or chamfered corners. This structure can reduce the stress applied to the corners of the base 1.
The material of the base 1 may be, for example, a metal material, such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. In this case, the base 1 may be a single metal plate or a multilayer body including a plurality of metal plates. When the metal material of the base 1 is the above-described metal material, a plating layer may be formed on a surface of the base 1 to reduce oxidation corrosion. The plating layer may be formed by electroplating or electroless plating and made of nickel, gold, or the like. Note that the base 1 described herein as being made of a metal material may be made substantially of the metal material, and the base 1 may, for example, contain a non-metal material inevitable in manufacturing.
The material of the base 1 may also be an insulating material, for example, a ceramic material, such as an aluminum oxide-based sintered body, a mullite-based sintered body, a silicon carbide-based sintered body, an aluminum nitride-based sintered body, a silicon nitride-based sintered body, or a glass ceramic.
The frame 2 is positioned on the base 1 and surrounds the first region 1r. The material of the frame 2 may be, example, a ceramic material, such as an aluminum oxide-based sintered body, a mullite-based sintered body, a silicon carbide-based sintered body, an aluminum nitride-based sintered body, or a silicon nitride-based sintered body, or a dielectric material, such as a glass ceramic material or a glass epoxy material.
The material of the frame 2 may also be, for example, a resin and/or a metal. The resin may be one type of resin selected from the group including epoxy resin, phenolic resin, unsaturated polyester resin, polytetrafluoroethylene resin, urea resin, melamine resin, and thermosetting polyimide resin. Note that metal plating, such as nickel plating or gold plating, may be formed on a surface of the frame 2.
When the base 1 and the frame 2 are made of the same material (for example, aluminum nitride-based sintered body), the base 1 and the frame 2 may be formed integrally.
When the frame 2 is a multilayer body, metal wires may be positioned on an inner layer and a surface of the frame 2. The metal wires may be electrically connected to the wiring conductors 3.
The frame 2 includes a first frame side surface 21. The frame 2 includes a first projecting portion 211 projecting outward from the first frame side surface 21 in a first direction (in other words, x direction in the drawings; in the following description, the first direction is referred to also as the x direction for convenience). In the present disclosure, outward is a direction away from the first region 1r. Note that the frame 2 may include a first upper surface 2u described below. In an embodiment, the first projecting portion 211 is shaped such that a portion of the first frame side surface 21 projects outward.
The first projecting portion 211 may also be shaped such that the entirety of the first frame side surface 21 projects. In this case, the first frame side surface 21 coincides with a first-projecting-portion side surface 211s described below.
As illustrated in
The wiring conductors 3 are positioned on a surface of the frame 2. The wiring conductors 3 include the first conductors 31 and the second conductors 32. Examples of the material of the wiring conductors 3 include metal materials, such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese. The wiring conductors 3 may be formed by sintering metal paste on the surface of the frame 2, or by thin film formation technology, such as vapor deposition or sputtering.
As illustrated in
The first conductors 31 and the second conductors 32 may be electrically connected to the electronic component 9 described below. This structure enables electrical connection between the electronic component 9 and the inside/outside of the electronic component housing package 100 while protecting the electronic component 9. The structure also enables airtight sealing of the electronic component 9.
The second conductors 32 are spaced outward from the first conductors 31 in the x direction. In other words, the second conductors 32 are closer to the first-projecting-portion side surface 211s than the first conductors 31. In an embodiment, as illustrated in
The first conductors 31 and the second conductors 32 are positioned on the first projecting portion 211 and on the same plane. More specifically, the first conductors 31 and the second conductors 32 are positioned on a second upper surface 211u described below. When the first conductors 31 and the second conductors 32 are arranged as described above, the electronic component housing package 100 can be smaller and have a reduced height, and a greater number of wiring conductors 3 can be positioned on the surface of the frame 2. Therefore, a greater number of electronic components 9 can be mounted in the electronic component housing package 100. Also, connection to an external wiring board or electronic circuit can be provided with greater flexibility in wiring design.
No wiring conductors 3 may be positioned beyond the second conductors 32 in the x direction on the first projecting portion 211. In other words, no wiring conductors 3 may be positioned between the first-projecting-portion side surface 211s and the second conductors 32.
The first conductors 31 and/or the second conductors 32 may serve as power supply terminals, signal terminals, or ground terminals.
When the direction along the first frame side surface 21 is a second direction (in other words, y direction in the drawings; in the following description, the second direction is referred to also as the y direction for convenience), multiple first conductors 31 may be arranged along the y direction, and multiple second conductors 32 may be arranged along the y direction. This structure enables an increase in the number of wiring conductors 3 positioned on the surface of the frame 2 without increasing the number of conductors arranged in the x direction.
In the above-described case, the multiple first conductors 31 may all have the same shape or include one or more first conductors 31 shaped differently from the remaining one or more first conductors 31. The multiple second conductors 32 may all have the same shape or include one or more second conductors 32 shaped differently from the remaining one or more second conductors 32. Any one of the first conductors 31 and the second conductors 32 may serve as a signal terminal.
As illustrated in
One or more connection members described below may be connected to the wiring conductors 3. More specifically, a plurality of connection members of one type or a plurality of types of connection members may be connected to the wiring conductors 3. The same connection member may be connected to all of the first conductors 31. Alternatively, a flexible board (FPC (flexible printed circuits)) may be connected to one or more of the first conductors 31 while a connector is connected to the remaining one or more first conductors 31. For example, a connector may be connected to the first conductors 31 while a flexible board is connected to the second conductors 32. Alternatively, for example, the first conductors 31 and the second conductors 32 may be connected to different types of connectors.
For example, the first conductors 31 may all serve as signal terminals while the second conductors 32 all serve as ground terminals and/or power supply terminals. This structure allows the first conductors 31, which transmit signals, to be closer to the first region 1r than the second conductors 32 in plan view, thereby reducing the signal transmission distance to the electronic component 9. Therefore, high-frequency signals can be transmitted between the electronic component 9 and the first conductors 31 with reduced signal loss.
The frame 2 may include a second frame side surface 22 and a second projecting portion 222. The second frame side surface 22 may face the first frame side surface 21 in the x direction. The second projecting portion 222 projects outward from the second frame side surface 22 in the x direction.
The wiring conductors 3 may include one or more third conductors 33 and one or more fourth conductors 34. The fourth conductors 34 may be spaced from the third conductors 33 in the x direction. The third conductors 33 and the fourth conductors 34 may be positioned on the second projecting portion 222 and on the same plane. According to this structure, the wiring conductors 3 may be formed at a side opposite to a side of the first projecting portion 211 in the x direction, so that the number of wiring conductors 3 positioned on the surface of the frame 2 can be increased. Therefore, a greater number of electronic components 9 can be mounted in the electronic component housing package 100. Also, connection to an external wiring board or electronic circuit can be provided with greater flexibility in wiring design.
More specifically, the third conductors 33 and the fourth conductors 34 are positioned on a third upper surface 222u described below. Note that multiple third conductors 33 may be arranged along the y direction, and multiple fourth conductors 34 may be arranged along the y direction.
As illustrated in
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As illustrated in
Note that the base 1 may include a second base side surface 12s positioned along the second frame side surface 22. The second projecting portion 222 may include a second-projecting-portion side surface 222s positioned along the second frame side surface 22.
As illustrated in
As illustrated in
The frame 2 may be made of a ceramic material. This facilitates formation of the wiring conductors 3 and metal wires on a surface of the frame 2 and inside the frame 2. Also, the electronic component 9 can be sealed airtightly.
The base 1 may be made of a metal material. This structure enables efficient dissipation of heat generated in the electronic component 9 mounted in the first region 1r to the outside of the electronic component housing package 100.
As illustrated in
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The through-hole 1o may have a rectangular shape, a circular shape, or a substantially rectangular shape with rounded corners in plan view. Note that the base 1 may include more than one through-holes 1o.
More specifically, the transparent member 5 may be positioned in the through-hole 1o. According to this structure, the electronic component housing package 100 can have a smaller dimension in the z direction compared to when the transparent member 5 is joined to the lower surface of the base 1. Therefore, the electronic component housing package 100 and the electronic module 10 can be smaller.
The base 1 may be such that a portion of the through-hole 1o includes a step portion 25 that projects toward the inner region of the through-hole 1o. This structure enables the transparent member 5 to be joined to the step portion 25. Therefore, joining of the transparent member 5 in the through-hole 1o is easier than when no step portion 25 is provided.
A connection member may be connected to the wiring conductors 3. The connection member may be, for example, a lead terminal, a flexible board, a printed board on which an electronic circuit is formed (PCB (printed circuit board)), or a connector. An end of the connection member may be connected to a flexible board or a printed circuit board on which an electronic circuit is formed.
More specifically, as illustrated in
More specifically, the first connector 71 may include a first socket 711 and a first plug 712. In this case, the first socket 711 may be positioned on the first projecting portion 211. This structure facilitates attachment and removable of the first connector 71. The structure also allows the electronic module 10 or the first connector 71 to be easily replaced when the electronic module 10 or the first connector 71 is defective. Note that the first plug 712 may include one or more first wiring cables 7121.
As illustrated in
The electronic component housing package 100 according to embodiment will be described with reference to
In the other embodiment illustrated in
As in the other embodiment illustrated in
As illustrated in
The electronic component 9 is positioned on the first region 1r. Examples of the electronic component 9 include an optical semiconductor device, such as an LD (laser diode) or a PD (photodiode), a semiconductor integrated circuit element, a sensor element, such as an optical sensor, and a power amplifier IC. The electronic component 9 may be formed using, for example, a semiconductor material, such as gallium arsenide or gallium nitride.
The electronic component 9 may be directly positioned on the first region 1r, or be indirectly positioned on the first region 1r with, for example, a sub-mount provided between the electronic component 9 and the first region 1r. The number of electronic components 9 is not limited to one, and may be two or more. For example, the electronic components 9 may include a light receiving element and a light emitting element.
The electronic module 10 may include an optical component, such as a collimator lens, a dironic filter, or a mirror. The optical component may be positioned on the first region 1r or on the shelf portion 24.
The lid body 8 is positioned on the frame 2. The lid body 8 protects the electronic component 9 together with the frame 2. The material of the lid body 8 may be, for example, a metal material, an alloy obtained by combining multiple metal materials, or a ceramic. Note that the transparent member 5 may be attached to the lid body 8.
The electronic module 10 may further include the seal ring 6 positioned between the lid body 8 and the frame 2. The seal ring 6 is positioned on the frame 2, and surrounds the electronic component 9 in plan view. Note that when the seal ring 6 is not provided on the frame 2, the lid body 8 may be joined to the frame 2 (that is, to the first upper surface 2u) with, for example, solder, a brazing material, glass, or an adhesive, such as a resin adhesive material.
Note that various combinations in each embodiment and each variation are not limited to the examples in the above-described embodiments. The embodiments and the variations may be combined with each other.
| Number | Date | Country | |
|---|---|---|---|
| 63511011 | Jun 2023 | US |
