the other leads being parallel to the base

Industry

CPC
H01L23/047

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/047the other leads being parallel to the base

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device
- Patent number 12,142,491
- Issue date Nov 12, 2024
- Ampleon Netherlands B.V.
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,131,969
- Issue date Oct 29, 2024
- Mitsubishi Electric Corporation
- Hiroya Sannai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged RF power device with PCB routing outside protective member
- Patent number 12,100,630
- Issue date Sep 24, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an insulating sheet and a conductive fi...
- Patent number 12,080,612
- Issue date Sep 3, 2024
- Fuji Electric Co., Ltd.
- Katsumi Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,533
- Issue date Jul 23, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, and method for manufacturing power semiconductor module
- Patent number 11,978,682
- Issue date May 7, 2024
- NGK Electronics Devices, Inc.
- Yoshio Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Output-integrated transistor device packages
- Patent number 11,967,936
- Issue date Apr 23, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with lid to manage radiation feedback
- Patent number 11,948,893
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor device package with copper tungsten conductiv...
- Patent number 11,915,986
- Issue date Feb 27, 2024
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,901,247
- Issue date Feb 13, 2024
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a lead electrode including a throug...
- Patent number 11,804,414
- Issue date Oct 31, 2023
- Mitsubishi Electric Corporation
- Kazuhisa Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power laminate RF package
- Patent number 11,791,251
- Issue date Oct 17, 2023
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 11,742,302
- Issue date Aug 29, 2023
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,721,613
- Issue date Aug 8, 2023
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion device
- Patent number 11,699,666
- Issue date Jul 11, 2023
- Mitsubishi Electric Corporation
- Akira Kosugi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, method for forming a package, carrier tape, chip card and...
- Patent number 11,594,481
- Issue date Feb 28, 2023
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transistor amplifiers having leadframes with integr...
- Patent number 11,588,448
- Issue date Feb 21, 2023
- Wolfspeed, Inc.
- Madhu Chidurala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,553
- Issue date Jan 17, 2023
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone radio frequency transistor amplifiers
- Patent number 11,533,024
- Issue date Dec 20, 2022
- Wolfspeed, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unitary housing for electronic device
- Patent number 11,505,131
- Issue date Nov 22, 2022
- Apple Inc.
- Christopher D. Prest
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Light-emitting device
- Patent number 11,489,099
- Issue date Nov 1, 2022
- Nichia Corporation
- Yuta Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 11,437,302
- Issue date Sep 6, 2022
- Fuji Electric Co., Ltd.
- Naoyuki Kanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor apparatus, and method for manu...
- Patent number 11,437,296
- Issue date Sep 6, 2022
- Kyocera Corporation
- Hiroshi Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,335,613
- Issue date May 17, 2022
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,315,842
- Issue date Apr 26, 2022
- Mitsubishi Electric Corporation
- Hiromitsu Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air cavity package using high temperature silicone adhesive
- Patent number 11,227,806
- Issue date Jan 18, 2022
- Materion Corporation
- Richard J. Koba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC MODULE
- Publication number 20250006565
- Publication date Jan 2, 2025
- Kyocera Corporation
- Tomoya TABUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20240421107
- Publication date Dec 19, 2024
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395690
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321675
- Publication date Sep 26, 2024
- Fuji Electric Co., Ltd.
- Satoshi KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20240250041
- Publication date Jul 25, 2024
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS
- Publication number 20230352425
- Publication date Nov 2, 2023
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20230299038
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230274989
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20230197629
- Publication date Jun 22, 2023
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230119240
- Publication date Apr 20, 2023
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230096381
- Publication date Mar 30, 2023
- Fuji Electric Co., Ltd.
- Hiroaki ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230076573
- Publication date Mar 9, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230037158
- Publication date Feb 2, 2023
- Sumitomo Electric Industries, Ltd.
- Christina LEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230008663
- Publication date Jan 12, 2023
- FUJI ELECTRIC CO., LTD.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE
- Publication number 20230005800
- Publication date Jan 5, 2023
- Sumitomo Electric Industries, Ltd.
- Harutoshi TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...
- Publication number 20220399318
- Publication date Dec 15, 2022
- Cree, Inc.
- Eng Wah WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OUTPUT-INTEGRATED TRANSISTOR DEVICE PACKAGES
- Publication number 20220360233
- Publication date Nov 10, 2022
- Cree, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220310463
- Publication date Sep 29, 2022
- Mitsubishi Electric Corporation
- Kazuhisa OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220278004
- Publication date Sep 1, 2022
- Mitsubishi Electric Corporation
- Hiroya SANNAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING COMPONENT, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR APPA...
- Publication number 20220238400
- Publication date Jul 28, 2022
- Kyocera Corporation
- Masami JUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220223511
- Publication date Jul 14, 2022
- Mitsubishi Electric Corporation
- Yoshitaka KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED RF POWER DEVICE WITH PCB ROUTING
- Publication number 20220157671
- Publication date May 19, 2022
- Cree, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device
- Publication number 20220139727
- Publication date May 5, 2022
- Ampleon Netherlands B.V.
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS
- Publication number 20220130773
- Publication date Apr 28, 2022
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR MODULE
- Publication number 20220077011
- Publication date Mar 10, 2022
- NGK Electronics Devices, Inc.
- Yoshio TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, METHOD FOR FORMING A PACKAGE, CARRIER TAPE, CHIP CARD AND...
- Publication number 20220068789
- Publication date Mar 3, 2022
- INFINEON TECHNOLOGIES AG
- JENS POHL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20220068769
- Publication date Mar 3, 2022
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS
- Publication number 20210408976
- Publication date Dec 30, 2021
- Cree, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGR...
- Publication number 20210408978
- Publication date Dec 30, 2021
- Cree, Inc.
- Madhu Chidurala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210398880
- Publication date Dec 23, 2021
- Fuji Electric Co., Ltd.
- Naoyuki KANAI
- H01 - BASIC ELECTRIC ELEMENTS

the other leads being parallel to the base

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

RF amplifier devices including top side contacts and methods of man...

Packaged electronic device

Semiconductor module

Electronic device packages with internal moisture barriers

Packaged RF power device with PCB routing outside protective member

Semiconductor device having an insulating sheet and a conductive fi...

Semiconductor device

Package, and method for manufacturing power semiconductor module

Output-integrated transistor device packages

Electronic component with lid to manage radiation feedback

Package for a semiconductor device

Integrated passive device (IPD) components and a package and proces...

Ceramic semiconductor device package with copper tungsten conductiv...

Insulating component, semiconductor package, and semiconductor appa...

Semiconductor device comprising a lead electrode including a throug...

High power laminate RF package

Electronic device packages with internal moisture barriers

Power module

Semiconductor device and power conversion device

Package, method for forming a package, carrier tape, chip card and...

Radio frequency transistor amplifiers having leadframes with integr...

Semiconductor device

Multi-zone radio frequency transistor amplifiers

Unitary housing for electronic device

Light-emitting device

Semiconductor module and method for manufacturing the same

Semiconductor package, semiconductor apparatus, and method for manu...

Insulating component, semiconductor package, and semiconductor appa...

Semiconductor package

Air cavity package using high temperature silicone adhesive

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC MODULE

MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

CERAMIC SEMICONDUCTOR DEVICE PACKAGE

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND PACKAGE

INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...

OUTPUT-INTEGRATED TRANSISTOR DEVICE PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

INSULATING COMPONENT, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR APPA...

SEMICONDUCTOR DEVICE

PACKAGED RF POWER DEVICE WITH PCB ROUTING

Packaged Electronic Device

ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS

PACKAGE, AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR MODULE

PACKAGE, METHOD FOR FORMING A PACKAGE, CARRIER TAPE, CHIP CARD AND...

POWER MODULE

MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS

RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGR...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME