Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component

Abstract

An electronic component is comprised of an element body having at least one plane, and a terminal electrode to be electrically connected through an electroconductive particle to a circuit substrate. The terminal electrode is formed on the plane of the element body. When the plane of the element body is defined as a reference plane, a ratio of a projected area onto the reference plane of an external surface of the terminal electrode opposed to the circuit substrate in a region where a height of the terminal electrode from the reference plane is not less than a value resulting from subtraction of a diameter of the electroconductive particle from a maximum of the height, to a projected area onto the reference plane of the external surface of the terminal electrode opposed to the circuit substrate is set to be not less than 10%.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of an electronic component according to an embodiment of the present invention.

FIG. 2 is a sectional view of the electronic component according to the embodiment.

FIG. 3 is a schematic view showing a mounted structure of the electronic component according to the embodiment.

FIG. 4 is a flowchart showing a production method of the electronic component according to the embodiment.

FIG. 5 is a drawing showing a production method of the electronic component according to the embodiment.

FIG. 6 is a drawing showing a production method of the electronic component according to the embodiment.

FIG. 7 is a table showing surface roughnesses of metal plates.

FIG. 8 is a table showing test results of comparative examples.

FIG. 9 is a table showing test results of examples.

Claims

1. An electronic component comprising: an element body having at least one plane; anda terminal electrode formed on the plane of the element body and adapted to be electrically connected through an electroconductive particle to a circuit substrate;wherein when the plane of the element body is defined as a reference plane, a ratio of a projected area onto the reference plane of an external surface of the terminal electrode opposed to the circuit substrate in a region where a height of the terminal electrode from the reference plane is not less than a value resulting from subtraction of a diameter of the electroconductive particle from a maximum of the height, to a projected area onto the reference plane of the external surface of the terminal electrode opposed to the circuit substrate is not less than 10%.

2. The electronic component according to claim 1, wherein said terminal electrode comprises three or more terminal electrodes, andwherein in at least three terminal electrodes out of said three or more terminal electrodes, said ratio of the projected area is not less than 10%.

3. A method of producing an electronic component, comprising: a preparation step of preparing an element body having at least one plane; anda forming step of forming a terminal electrode to be electrically connected to a circuit substrate through an electroconductive particle, on the plane of the element body so that when the plane of the element body is defined as a reference plane, a ratio of a projected area onto the reference plane of an external surface of the terminal electrode opposed to the circuit substrate in a region where a height of the terminal electrode from the reference plane is not less than a value resulting from subtraction of a diameter of the electroconductive particle from a maximum of the height, to a projected area onto the reference plane of the external surface of the terminal electrode opposed to the circuit substrate is not less than 10%.

4. The production method of the electronic component according to claim 3, wherein said forming step includes:an applying step of applying an electroconductive paste onto the plane of the element body;a planarizing step of planarizing an external surface of the applied electroconductive paste so that when the plane of the element body is defined as a reference plane, a ratio of a projected area onto the reference plane of the external surface opposed to the circuit substrate in a region where a height of the electroconductive paste from the reference plane is not less than a value resulting from subtraction of a diameter of the electroconductive particle from a maximum of the height, to a projected area onto the reference plane of the external surface of the electroconductive paste opposed to the circuit substrate is not less than 10%; anda baking step of baking the electroconductive paste planarized.

5. The production method of the electronic component according to claim 4, wherein the preparation step comprises preparing an element body further having a plane opposed to said plane, as the element body,wherein the applying step comprises applying the electroconductive paste onto at least one plane out of said two planes, andwherein the planarizing step comprises pressing the electroconductive paste in directions normal to the reference plane while interposing the electroconductive paste between two metal plates arranged in parallel with the reference plane, thereby planarizing the external surface.

6. A mounted structure of an electronic component, comprising: a circuit substrate; andan electronic component comprising an element body having at least one plane, and a terminal electrode formed on the plane of the element body;wherein the terminal electrode is electrically connected through an electroconductive particle to the circuit substrate in a state in which the plane of the element body is opposed to the circuit substrate, andwherein when the plane of the element body is defined as a reference plane, a ratio of a projected area onto the reference plane of an external surface of the terminal electrode opposed to the circuit substrate in a region where a height of the terminal electrode from the reference plane is not less than a value resulting from subtraction of a diameter of the electroconductive particle from a maximum of the height, to a projected area onto the reference plane of the external surface of the terminal electrode opposed to the circuit substrate is not less than 10%.

7. An evaluation method of evaluating a connection resistance of an electronic component comprising an element body having at least one plane, and a terminal electrode formed on the plane of the element body and adapted to be electrically connected through an electroconductive particle to a circuit substrate, wherein when the plane of the element body is defined as a reference plane, the connection resistance is evaluated based on a ratio of a projected area onto the reference plane of an external surface of the terminal electrode opposed to the circuit substrate in a region where a height of the terminal electrode from the reference plane is not less than a value resulting from subtraction of a diameter of the electroconductive particle from a maximum of the height, to a projected area onto the reference plane of the external surface of the terminal electrode opposed to the circuit substrate.