Patent Application
20240212942
This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2022-204643, filed on Dec. 21, 2022. The entire contents of which are incorporated herein by reference.
The present disclosure relates to an electronic component.
Known electronic components include an element body, a plurality of internal conductors in the element body, and a plurality of external electrodes on the element body (see, for example, Japanese Unexamined Patent Publication No. 2018-006501). Each of the plurality of internal conductors is connected to a corresponding external electrode of the plurality of external electrodes. Each of the plurality of external electrodes includes a conductive resin layer.
The conductive resin layer generally includes a plurality of metal particles and a resin. In a configuration in which the external electrode includes the conductive resin layer, migration may occur in the external electrode. Migration is considered to occur due to the following events, for example.
An electric field acts on the metal particle included in the conductive resin layer, and the metal particle is ionized. Generated metal ion is attracted by an electric field between the external electrodes and migrates from the conductive resin layer. The electric field acting on the metal particle includes, for example, an electric field between the external electrodes or an electric field between the external electrode and an internal conductor in the element body. The metal ion migrating from the conductive resin layer react with, for example, an electron supplied from the internal conductor or the external electrode, and is deposited as metal on a surface of the element body.
One aspect of the present disclosure provides an electronic component reducing occurrence of migration and deterioration of connectivity between an internal conductor and an external electrode.
An electronic component according to one aspect of the present disclosure includes an element body, a plurality of internal conductors in the element body, a plurality of external electrodes on the element body, and an electrical insulator on the element body. The element body includes a main surface arranged to include a mounting surface, and a pair of end surfaces opposing each other and adjacent to the main surface. The plurality of internal conductors are exposed to a corresponding end surface of the pair of end surfaces. The plurality of external electrodes are connected to a corresponding internal conductor of the plurality of internal conductors. The plurality of internal conductors are exposed from the electrical insulator at the corresponding end surface. Each of the plurality of external electrodes includes a conductive resin layer. The electrical insulator includes an electrical insulating portion located at least on a region included in the main surface, the region being between the plurality of external electrodes.
In the one aspect described above, the electrical insulating portion is located at least on the region included in the main surface, the region being between the plurality of external electrodes. Therefore, even when a metal particle included in the conductive resin layer is ionized, the electrical insulating portion prevents the generated metal ion from reacting with an electron supplied from the internal conductor or the external electrode. The electron tends not to be supplied to the metal ion. The metal tends not to deposit on the main surface. Consequently, the one aspect described above reduces occurrence of migration.
The electrical insulator on the element body may impede connection between the internal conductor and the external electrode. In the one aspect described above, the plurality of internal conductors are exposed from the electrical insulator at the corresponding end surface. Therefore, the electrical insulator on the element body tends not to impede the connection between the internal conductor and the external electrode. Consequently, the one aspect described above reduces deterioration of connectivity between the internal conductor and the external electrode.
In the one aspect described above, the element body may include a side surface adjacent to the main surface and the pair of end surfaces. The electrical insulating portion may be located on a ridge region included a ridge portion between the main surface and the side surface, the ridge region being between the plurality of external electrodes.
In a configuration in which the electrical insulating portion is located on the ridge region, the metal tends not to deposit not only on the main surface but also on the ridge portion. Therefore, this configuration further reduces the occurrence of the migration.
In the one aspect described above, each of the plurality of internal conductors may be disposed to extend in a direction intersecting the main surface and may include an end exposed to the corresponding end surface. The end each included in the plurality of internal conductors may include a region exposed from the electrical insulator.
In a configuration in which each of the plurality of internal conductors are disposed as described above and the end each included in the plurality of internal conductors include the region exposed from the electrical insulator, all of the plurality of internal conductors are reliably connected to a corresponding external electrode of the plurality of external electrodes. Therefore, this configuration reliably reduces the deterioration of the connectivity between the internal conductor and the external electrode.
In the one aspect described above, the element body may include a side surface adjacent to the main surface and the pair of end surfaces. The electrical insulating portion may be located on a side region included in the side surface, the side region being between the plurality of external electrodes.
In a configuration in which the electrical insulating portion is located on the side region, the metal tends not to deposit not only on the main surface but also on the side surface. Therefore, this configuration further reduces the occurrence of the migration.
In the one aspect described above, the element body may include a side surface adjacent to the main surface and the pair of end surfaces. The conductive resin layer may include a layer portion on the side surface. The plurality of internal conductors may include an outermost internal conductor that is adjacent to the side surface and has a polarity different from that of the layer portion. The layer portion and the outermost internal conductor may indirectly oppose each other with the electrical insulating portion interposed therebetween.
In a configuration in which the conductive resin layer includes the layer portion on the side surface and the plurality of internal conductors include the outermost internal conductor, a metal particle included in the layer portion on the side surface may be ionized. However, in a configuration in which the layer portion and the outermost internal conductor indirectly oppose each other with the electrical insulating portion interposed therebetween, the electrical insulating portion reliably prevents the metal ion generated from the metal particle included in the layer portion on the side surface from reacting with the electron supplied from the internal conductor or the external electrode. Therefore, the configuration in which the layer portion on the side surface and the outermost internal conductor indirectly oppose each other as described above reliably reduces the occurrence of the migration.
In the one aspect described above, the element body may include a side surface adjacent to the main surface and the pair of end surfaces. The conductive resin layer may include a layer portion on the side surface. The plurality of internal conductors may include a dummy conductor that is adjacent to the side surface and has the same polarity as that of the layer portion. The layer portion and the dummy conductor may oppose each other.
In a configuration in which the conductive resin layer includes the layer portion on the side surface and the plurality of internal conductors include an internal conductor adjacent to the side surface and having a polarity different from that of the layer portion on the side surface, a metal particle included in the layer portion on the side surface may be ionized. However, in a configuration in which the layer portion on the side surface and the dummy conductor oppose each other, the layer portion on the side surface tends not to oppose the internal conductor having the polarity different from that of the layer portion on the side surface. Therefore, the metal particle included in the layer portion on the side surface tends not to be ionized. Consequently, the configuration in which the layer portion on the side surface and the dummy conductor oppose each other reliably reduces the occurrence of the migration.
In the one aspect described above, the element body may include a side surface adjacent to the main surface and the pair of end surfaces. The conductive resin layer may continuously cover a part of the main surface, a part of the corresponding end surface, and a part of the side surface.
A configuration in which the conductive resin layer continuously covers a part of the main surface, a part of the corresponding end surface, and a part of the side surface tends to lead to a decrease in the amount of conductive resin paste used to form the conductive resin layer, as compared with a configuration in which the conductive resin layer continuously covers a part of the main surface, the entire corresponding end surface, and a part of the side surface. The decrease in the amount of the conductive resin paste tends to lead to a decrease in a length of a layer included in the conductive resin layer and located on the main surface in a direction in which the pair of end surfaces oppose each other and an increase in a distance between the plurality of external electrodes on the main surface. The increase in the distance between the plurality of external electrodes reduces an electric field between the plurality of external electrodes. Therefore, the generated metal ion tends not to migrate from the conductive resin layer. Consequently, the configuration in which the conductive resin layer continuously covers a part of the main surface, a part of the corresponding end surface, and a part of the side surface can further reduces the occurrence of the migration.
In the one aspect described above, a height of the electrical insulator in a direction orthogonal to the main surface may be larger than a height of the conductive resin layer in the direction orthogonal to the main surface.
A configuration in which the electrical insulator has the above-described height reliably reduces the occurrence of the migration.
In the one aspect described above, the electrical insulator may include only the electrical insulating portion. The electrical insulating portion may be located only on the main surface.
A configuration in which the electrical insulator includes only the electrical insulating portion and the electrical insulating portion is located only on the main surface reliably reduces the deterioration of the connectivity between the internal conductor and the external electrode.
In the one aspect described above, the electrical insulator may be located between the element body and the conductive resin layer.
A configuration in which the electrical insulator is located between the element body and the conductive resin layer reliably prevents the electron from being supplied to the metal ion. Therefore, this configuration reliably reduces the occurrence of the migration.
In the one aspect described above, the electrical insulator may include an electrical insulating thin film.
In the one aspect described above, the electrical insulator may include a silicon oxide film.
The silicon oxide film has high electrical insulating properties. Therefore, a configuration in which the electrical insulator includes the silicon oxide film reliably reduces the occurrence of the migration.
In the one aspect described above, the conductive resin layer may include a plurality of silver particles.
In the following description, with reference to the drawings, the same reference numbers are assigned to the same components or to similar components having the same function, and overlapping description is omitted.
A configuration of a multilayer capacitor C1 according to the first example will be described with reference to
In the first example, an electronic component includes, for example, the multilayer capacitor C1.
As illustrated in
The element body 3 includes a pair of main surfaces 3a and 3b opposing each other, a pair of side surfaces 3c opposing each other, and a pair of end surfaces 3e opposing each other. The pair of main surfaces 3a and 3b, the pair of side surfaces 3c, and the pair of end surfaces 3e each have a substantially rectangular shape. The pair of main surfaces 3a and 3b oppose each other in a second direction D2. The pair of side surfaces 3c oppose each other in a third direction D3. The pair of end surfaces 3e oppose each other in a first direction D1. A direction in which the pair of end surfaces 3e oppose each other includes the first direction D1. The multilayer capacitor C1 is solder-mounted on an electronic device. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer capacitor C1, the main surface 3a opposes the electronic device. The main surface 3a is arranged to constitute a mounting surface. The main surface 3a is the mounting surface.
The second direction D2 includes a direction orthogonal to the main surfaces 3a and 3b, and is orthogonal to the third direction D3. The second direction D2 includes a direction intersecting the main surfaces 3a and 3b. The first direction D1 includes a direction parallel to the main surfaces 3a and 3b and the side surfaces 3c, and is orthogonal to the second direction D2 and the third direction D3. The third direction D3 is a direction orthogonal to the side surfaces 3c, and the first direction D1 includes a direction orthogonal to the end surfaces 3e. For example, a length of the element body 3 in the first direction D1 is larger than a length of the element body 3 in the second direction D2 and larger than a length of the element body 3 in the third direction D3. The first direction D1 includes a longitudinal direction of the element body 3. The length of the element body 3 in the second direction D2 and the length of the element body 3 in the third direction D3 may be equal to each other. The length of the element body 3 in the second direction D2 and the length of the element body 3 in the third direction D3 may be different.
The length of the element body 3 in the second direction D2 is a height of the element body 3. The length of the element body 3 in the third direction D3 is a width of the element body 3. The length of the element body 3 in the first direction D1 is a length of the element body 3. For example, the height of the element body 3 is 0.1 to 2.5 mm, the width of the element body 3 is 0.1 to 5.0 mm, and the length of the element body 3 is 0.2 to 5.7 mm. For example, the height of the element body 3 is 2.5 mm, the width of the element body 3 is 2.5 mm, and the length of the element body 3 is 3.2 mm.
The pair of side surfaces 3c extend in the second direction D2 to couple the pair of main surfaces 3a and 3b to each other. The pair of side surfaces 3c also extend in the first direction D1. The pair of end surfaces 3e extend in the second direction D2 to couple the pair of main surfaces 3a and 3b to each other. The pair of end surfaces 3e also extend in the third direction D3.
The element body 3 includes four ridge portions 3g, four ridge portions 3i, and four ridge portions 3j. The ridge portions 3g are located between the end surfaces 3e and the main surfaces 3a and 3b. The ridge portions 3i are located between the end surfaces 3e and the side surfaces 3c. The ridge portions 3j are located between the main surfaces 3a and 3b and the side surfaces 3c. For example, the ridge portions 3g, 3i, and 3j are rounded to be curved. For example, the element body 3 is subjected to what is called a round chamfering process. The end surfaces 3e and the main surfaces 3a and 3b are indirectly adjacent to each other with the ridge portion 3g interposed therebetween. The end surfaces 3e and the side surfaces 3c are indirectly adjacent to each other with the ridge portion 3i interposed therebetween. The main surfaces 3a and 3b and the side surfaces 3c are indirectly adjacent to each other with the ridge portion 3j interposed therebetween.
The element body 3 is configured through laminating a plurality of dielectric layers in the third direction D3. The element body 3 includes a plurality of laminated dielectric layers. In the element body 3, a lamination direction of the plurality of dielectric layers coincides with the third direction D3. Each dielectric layer includes, for example, a sintered body of a ceramic green sheet containing a dielectric material. Examples of the dielectric material include dielectric ceramics. Examples of the dielectric ceramics include BaTiO3-based, Ba(Ti, Zr)O3-based, or (Ba, Ca)TiO3-based dielectric ceramics. In the actual element body 3, each of the dielectric layers is integrated to such an extent that a boundary between the dielectric layers cannot be visually recognized.
The electrical insulating film EI is disposed on the element body 3 as illustrated in
The electrical insulating film EI has, for example, an electrical resistivity higher than an electrical resistivity of the element body 3. The electrical resistivity of the element body 3 includes a volume resistivity of the element body 3 or a surface resistivity of the element body 3. The electrical insulating film EI may have an electrical resistivity higher than the volume resistivity of the element body 3 and higher than the surface resistivity of the element body 3.
The electrical insulating film EI includes, for example, an electrical insulating thin film. In this case, the electrical insulating film EI may include a sputtered film. The electrical insulating film EI includes, for example, a silicon oxide film. The silicon oxide film includes, for example, a silicon dioxide film. The electrical insulating film EI may include, for example, an aluminum oxide film.
An average thickness of the film portion EIa is, for example, 0.02 μm or more. The average thickness may be 0.05 μm or more.
The average thickness can be obtained, for example, as follows.
A cross-sectional photograph of the electrical insulating film EI including the film portion EIa is acquired. The cross-sectional photograph is a photograph of a cross section when the multilayer capacitor C1 is cut along a plane perpendicular to the main surface 3a. The cross-sectional photograph is, for example, a photograph of a cross section of the multilayer capacitor C1 when cut in a plane parallel to the pair of side surfaces 3c and equidistant from the pair of side surfaces 3c. The acquired cross-sectional photograph is image-processed by software. By this image processing, a boundary of the electrical insulating film EI (film portion EIa) is determined. An area of the film portion EIa on the acquired cross-sectional photograph is calculated.
The area of the film portion EIa is divided by a length of the film portion EIa on the acquired cross-sectional photograph, and the obtained quotient is set as the average thickness.
As illustrated in
The internal electrodes 7 and the internal electrodes 9 are disposed in different positions (layers) in the third direction D3. The internal electrodes 7 and the internal electrodes 9 are alternately disposed in the element body 3 to oppose each other in the third direction D3 with an interval therebetween. The internal electrodes 7 and the internal electrodes 9 have different polarities from each other. One end of each of the internal electrodes 7 and 9 is exposed to a corresponding end surface 3e of the pair of end surfaces 3e. Each of the internal electrodes 7 and 9 includes the one end exposed to the corresponding end surface 3e.
As described above, each of the end surfaces 3e is exposed from the electrical insulating film EI (film portion EIa). The one end included in each of the plurality of internal electrodes 7 and 9 includes a region exposed from the electrical insulating film EI. For example, the one end included in each of the plurality of internal electrodes 7 and 9 includes only the region exposed from the electrical insulating film EI. The entire one end included in each of the plurality of internal electrodes 7 and 9 is exposed from the electrical insulating film EI.
The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are alternately disposed in the third direction D3. The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are disposed in the element body 3 to be distributed in the third direction D3. Each of the plurality of internal electrodes 7 and the plurality of internal electrodes 9 is located in a plane substantially parallel to the side surfaces 3c. Each of the plurality of internal electrodes 7 and the plurality of internal electrodes 9 is disposed to extend in a direction intersecting the main surface 3a. For example, each of the plurality of internal electrodes 7 and the plurality of internal electrodes 9 is disposed to extend in a direction substantially orthogonal to the main surface 3a. The internal electrode 7 and the internal electrode 9 oppose each other in the third direction D3. The direction in which the internal electrode 7 and the internal electrode 9 oppose each other, that is, the third direction D3 is orthogonal to a direction parallel to the side surfaces 3c (second direction D2 and first direction D1).
For example, the plurality of internal electrodes 7 include one internal electrode 7A located on the outermost side in the third direction D3. The internal electrode 7A is adjacent to one side surface 3c of the pair of side surface 3c in the third direction D3. The internal electrode 7A is closest to the one side surface 3c among the plurality of internal electrodes 7. The internal electrode 7A includes an outermost internal electrode.
For example, the plurality of internal electrodes 9 include one internal electrode 9A located on the outermost side in the third direction D3. The internal electrode 9A includes an outermost internal electrode. The one internal electrode 9A is adjacent to another side surface 3c of the pair of side surface 3c in the third direction D3. The internal electrode 9A is closest to the other side surface 3c among the plurality of internal electrodes 9.
As illustrated in
The external electrodes 5 are disposed at both ends of the element body 3 in the first direction D1. Each external electrode 5 is disposed on the corresponding end surface 3e of the element body 3. For example, each external electrode 5 is disposed on the pair of main surfaces 3a and 3b, the pair of side surfaces 3c, and the end surface 3e. The external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, and 5e as illustrated in
Each external electrode 5 is formed on the four surfaces of the main surface 3b, the pair of side surfaces 3c, and the end surface 3e and the ridge portions 3g, 3i, and 3j as well as the electrical insulating film EI. Each external electrode 5 is indirectly formed on the main surface 3a. The electrode portions 5a, 5b, 5c, and 5e adjacent to each other are coupled and are electrically connected to each other. The electrode portion 5e covers all the one ends of corresponding internal electrodes of the plurality of internal electrodes 7 and 9. The electrode portion 5e is directly connected to the corresponding internal electrodes of the plurality of internal electrodes 7 and 9. The external electrode 5 is electrically connected to the corresponding internal electrodes of the plurality of internal electrodes 7 and 9. As illustrated in
The first electrode layer E1 of the electrode portion 5a is disposed on the electrical insulating film EI and on the ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is formed on the electrical insulating film EI to cover a part of the electrical insulating film EI and is formed on the element body 3 to cover the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is in contact with the above-described part of the electrical insulating film EI and the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is formed on the element body 3 to cover a part of the ridge portion 3j. The first electrode layer E1 of the electrode portion 5a is in contact with the above-described part of the ridge portion 3j. In the electrode portion 5a, the first electrode layer E1 is in direct contact with the electrical insulating film EI (film portion EIa) and is in direct contact with the element body 3. The electrical insulating film EI is indirectly covered with the first electrode layer E1 at the above-described part, and is exposed from the first electrode layer E1 at the remaining part excluding the above-described part. The above-described part of the electrical insulating film EI includes a partial region, of the electrical insulating film EI, closer to the end surface 3e. The first electrode layer E1 of the electrode portion 5a is located on the electrical insulating film EI. The main surface 3a includes a portion indirectly covered with the first electrode layer E1 and a portion exposed from the first electrode layer E1. The first electrode layer E1 may not be formed on the electrical insulating film EI. The first electrode layer E1 may not be disposed on the electrical insulating film EI.
The second electrode layer E2 of the electrode portion 5a is disposed on the first electrode layer E1 and on the electrical insulating film EI. In the electrode portion 5a, the second electrode layer E2 is formed on the first electrode layer E1 to cover the first electrode layer E1, and is formed on the electrical insulating film EI to cover a part of the electrical insulating film EI. The second electrode layer E2 of the electrode portion 5a is contact with the above-described part of the electrical insulating film EI and the entire first electrode layer E1. In the electrode portion 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the electrical insulating film EI (film portion EIa). In the electrode portion 5a, the second electrode layer E2 indirectly covers the main surface 3a so that the first electrode layer E1 and electrical insulating film EI are located between the second electrode layer E2 and the main surface 3a. The second electrode layer E2 of the electrode portion 5a is located on the main surface 3a. A portion included in the second electrode layer E2 and located on the main surface 3a includes a layer portion located on the main surface 3a. The second electrode layer E2 includes the layer portion located on the main surface 3a.
The third electrode layer E3 of the electrode portion 5a is disposed on the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is in contact with the entire second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5a is located on the main surface 3a.
The first electrode layer E1 of the electrode portion 5b is disposed on the main surface 3b and on the ridge portion 3g. The first electrode layer E1 of the electrode portion 5b covers a part of the main surface 3b and the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5b is in contact with the above-described part of the main surface 3b and the entire ridge portion 3g. In the electrode portion 5a, the first electrode layer E1 is in direct contact with the element body 3. The main surface 3b is covered with the first electrode layer E1 at the above-described part, and is exposed from the first electrode layer E1 at the remaining part excluding the above-described part. The above-described part of the main surface 3b includes a partial region, of the main surface 3b, closer to the end surface 3e. The first electrode layer E1 of the electrode portion 5b is located on the main surface 3b. The first electrode layer E1 may not be formed on the main surface 3b. The first electrode layer E1 may not be disposed on the main surface 3b.
The third electrode layer E3 of the electrode portion 5b is disposed on the first electrode layer E1. In the electrode portion 5b, the third electrode layer E3 covers the first electrode layer E1. In the electrode portion 5b, the third electrode layer E3 is in contact with the first electrode layer E1. In the electrode portion 5b, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5b is located on the main surface 3b. The main surface 3b includes no portion covered with the second electrode layer E2.
The first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c and on the ridge portion 3i. The first electrode layer E1 of the electrode portion 5c covers a part of the side surface 3c and the entire ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the above-described part of the side surface 3c and on the entire ridge portion 3i. In the electrode portion 5c, the first electrode layer E1 is in direct contact with the element body 3. The side surface 3c is covered with the first electrode layer E1 at the above-described part, and is exposed from the first electrode layer E1 at the remaining part excluding the above-described part. The above-described part of the side surface 3c includes a partial region, of the side surface 3c, closer to the end surface 3e. The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c. The first electrode layer E1 may not be formed on the side surface 3c. The first electrode layer E1 may not be disposed on the side surface 3c.
The second electrode layer E2 of the electrode portion 5c is disposed on the first electrode layer E1 and on the side surface 3c. In the electrode portion 5c, the second electrode layer E2 covers a part of the first electrode layer E1 and a part of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the above-described part of the first electrode layer E1 and the above-described part of the side surface 3c. The second electrode layer E2 of the electrode portion 5c directly covers the above-described part of the first electrode layer E1 of the electrode portion 5c. The above-described part of the side surface 3c includes, for example, a corner region, of the side surface 3c, closer to the main surface 3a and the end surface 3e. In the electrode portion 5c, the second electrode layer E2 indirectly covers the above-described part of the side surface 3c so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The first electrode layer E1 of the electrode portion 5 is covered with the second electrode layer E2 at the above-described part, and is exposed from the second electrode layer E2 at the remaining part excluding the above-described part. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. A portion included in the second layer E2 and located on the side surface 3c includes a layer portion located on the side surface 3c. The second electrode layer E2 includes the layer portion located on the side surface 3c.
The third electrode layer E3 of the electrode portion 5c is disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the entire second electrode layer E2 and the entire portion included in the first electrode layer E1 and exposed from the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in direct contact with the entire second electrode layer E2 and the entire portion included in the first electrode layer E1 and exposed from the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode portion 5c is located on the side surface 3c.
The electrode portion 5c includes a plurality of regions 5c1 and 5c2. For example, the electrode portion 5c includes only two regions 5c1 and 5c2. The region 5c2 is positioned closer to the main surface 3a than the region 5c1. The region 5c1 includes the first electrode layer E1 and the third electrode layer E3. The region 5c1 does not include the second electrode layer E2. The region 5c2 includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. The region 5c1 includes a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5c2 includes a region where the first electrode layer E1 is covered with the second electrode layer E2.
The first electrode layer E1 of the electrode portion 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode portion 5e covers the entire end surface 3e. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end surface 3e. In the electrode portion 5e, the first electrode layer E1 is in direct contact with the end surface 3e.
The second electrode layer E2 of the electrode portion 5e is disposed on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 covers a part of the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is in direct contact with the above-described part of the first electrode layer E1. The second electrode layer E2 of the electrode portion 5e directly covers the above-described part of the first electrode layer E1 of the electrode portion 5e. In the electrode portion 5e, the second electrode layer E2 indirectly covers a part of the end surface 3e so that the first electrode layer E1 is located between the second electrode layer E2 and the end surface 3e. The above-described part of the end surface 3e includes, for example, a partial region, of the end surface 3e, closer to the main surface 3a. The first electrode layer E1 of the electrode portion 5e is covered with the second electrode layer E2 at the above-described part, and is exposed from the second electrode layer E2 at the remaining part excluding the above-described part. The second electrode layer E2 of the electrode portion 5e is located on the end surface 3e. A portion included in the second layer E2 and located on the end surface 3e includes a layer portion located on the end surface 3e. The second electrode layer E2 includes the layer portion located on the end surface 3e.
The third electrode layer E3 of the electrode portion 5e is disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 covers the entire second electrode layer E2 and the entire portion included in the first electrode layer E1 and exposed from the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is in direct contact with the entire second electrode layer E2 and the entire portion included in the first electrode layer E1 and exposed from the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode portion 5e is located on the end surface 3e.
The electrode portion 5e may not include the second electrode layer E2. A configuration in which the electrode portion 5e does not include the second electrode layer E2, the third electrode layer E3 of the electrode portion 5e directly covers the entire first electrode layer E1 and is direct contact with the first electrode layer E1.
The electrode portion 5e includes a plurality of regions 5e1 and 5e2. For example, the electrode portion 5e includes only two regions 5e1 and 5e2. The region 5e2 is positioned closer to the main surface 3a than the region 5e1. The region 5e1 includes the first electrode layer E1 and the third electrode layer E3. The region 5e1 does not include the second electrode layer E2. The region 5e2 includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. In the electrode portion 5e, the third electrode layer E3 covers the entire end surface 3e when viewed from the first direction D1. For example, the third electrode layer E3 indirectly covers the entire end surface 3e. The region 5e1 includes a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5e2 includes a region where the first electrode layer E1 is covered with the second electrode layer E2.
The electrical insulating film EI includes a portion covered with the external electrode 5 and a portion exposed from the external electrode 5. The film portion EIa includes a portion covered with the electrode portion 5a and a portion exposed from the electrode portion 5a. The portion included in the electrical insulating film EI (film portion EIa) and exposed from the external electrode 5 (electrode portion 5a) is located on a region that is included in the main surface 3a and is between the plurality of external electrodes 5 (plurality of electrode portions 5a). The electrical insulating film EI includes a film portion located at least on a region that is included in the main surface 3a and is between the plurality of external electrodes 5. The electrical insulating film EI includes a film portion located at least on a region that is included in the main surface 3a and is exposed from the plurality of external electrodes 5.
The first electrode layer E1 is formed from sintering electrically conductive paste applied onto the surface of the element body 3. The first electrode layer E1 covers the above-described part of each of the main surfaces 3a and 3b, the above-described part of each of the side surfaces 3c, the end surface 3e, and the ridge portions 3g, 3i, and 3j. The first electrode layer E1 is formed from sintering a metal component included in the electrically conductive paste. The metal component contained in the electrically conductive paste includes, for example, metal particles. The first electrode layer E1 includes a sintered metal layer. For example, the first electrode layer E1 includes a sintered metal layer made of Cu. The first electrode layer E1 may include a sintered metal layer made of Ni. The first electrode layer E1 includes a base metal. The electrically conductive paste includes, for example, particles made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 included in each of the electrode portions 5a, 5b, 5c, and 5e is integrally formed.
The second electrode layer E2 is formed from curing electrically conductive resin paste applied onto the first electrode layer E1. The second electrode layer E2 is formed over the first electrode layer E1 and on the element body 3. The first electrode layer E1 includes an underlying metal layer for forming the second electrode layer E2. The second electrode layer E2 includes an electrically conductive resin layer that covers the first electrode layer E1. The conductive resin paste includes, for example, a resin, an electrically conductive material, and an organic solvent. The resin includes, for example, a thermosetting resin. The conductive material includes, for example, metal particles. The metal particles include, for example, silver particles or copper particles. For example, the second electrode layer E2 includes a plurality of silver particles. The thermosetting resin is, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a part of the ridge portion 3j. The second electrode layer E2 included in each of the electrode portions 5a, 5c, and 5e is integrally formed.
The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 (the portion exposed from the second electrode layer E2) through a plating method. The third electrode layer E3 may have a multilayer structure. In this case, the third electrode layer E3 includes, for example, an Ni plating layer and a solder plating layer. The Ni plating layer is formed on the second electrode layer E2 and on the first electrode layer E1. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder leach resistance than the metal included in the second electrode layer E2. The third electrode layer E3 may include an Sn plating layer, a Cu plating layer, or an Au plating layer instead of the Ni plating layer. The solder plating layer includes, for example, an Sn plating layer, an Sn-Ag alloy plating layer, an Sn-Bi alloy plating layer, or an Sn-Cu alloy plating layer. The third electrode layer E3 included in each of the electrode portions 5a, 5b, 5c, and 5e is integrally formed.
In the multilayer capacitor C1, the second electrode layer E2 continuously covers only a part of the main surface 3a, only a part of the end surface 3e, and only a part of each of the pair of side surfaces 3c. The second electrode layer E2 includes a portion continuously covering only a part of the main surface 3a, only a part of the end surface 3e, and only a part of each of the pair of side surfaces 3c. The above-described part of the end surface 3e includes a part of the end surface 3e closer to the main surface 3a. The above-described part of the side surface 3c includes a part of the side surface 3c closer to the main surface 3a. The second electrode layer E2 covers the entire one ridge portion 3g, only a part of the ridge portion 3i, and only a part of the ridge portion 3j. A portion of the first electrode layer E1 covering the ridge portion 3i is partially exposed from the second electrode layer E2. For example, the first electrode layer E1 included in the regions 5c1 and 5e1 is exposed from the second electrode layer E2. A configuration in which the electrode portion 5e does not includes the second electrode layer E2, the second electrode layer E2 continuously covers only a part of the main surface 3a and only a part of each of the pair of side surfaces 3c. That is, the second electrode layer E2 includes a portion continuously covering only a part of the main surface 3a and only a part of each of the pair of side surfaces 3c.
The multilayer capacitor C1 includes a plurality of conductors 11 and 13 as illustrated in
The conductor 11 is located in the same layer as the internal electrode 7A and is separated from the internal electrode 7A. The conductor 11 includes one end exposed to a corresponding end surface 3e of the pair of end surfaces 3e. The one end of the conductor 11 is exposed to the end surface 3e to which the one end of the internal electrode 9 is exposed. The one end of the conductor 11 is entirely covered by a corresponding electrode portion 5e of the plurality of electrode portions 5e. The conductor 11 is directly connected to the corresponding electrode portion 5e. The conductor 11 is electrically connected to a corresponding external electrode 5 of the pair of external electrodes 5. For example, the conductor 11 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 9 is electrically connected. The conductor 11 is electrically connected to the external electrode 5 to which the internal electrode 7 is not electrically connected.
The conductor 13 is located in the same layer as the internal electrode 9A and is separated from the internal electrode 9A. The conductor 13 includes one end exposed to a corresponding end surface 3e of the pair of end surfaces 3e. The one end of the conductor 13 is exposed to the end surface 3e to which the one end of the internal electrode 7 is exposed. The one end of the conductor 13 is entirely covered by a corresponding electrode portion 5e of the plurality of electrode portions 5e. The conductor 13 is directly connected to the corresponding electrode portion 5e. The conductor 13 is electrically connected to a corresponding external electrode 5 of the pair of external electrodes 5. For example, the conductor 13 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7 is electrically connected. The conductor 13 is electrically connected to the external electrode 5 to which the internal electrode 9 is not electrically connected.
The conductor 11 opposes the internal electrode 9 and does not oppose the internal electrode 7, in the third direction D3. The conductor 13 opposes the internal electrode 7 and does not oppose the internal electrode 9, in the third direction D3. The conductors 11 and 13 include, for example, dummy conductors that tend not to contribute to generation of capacitance.
The plurality of internal electrodes 7 except the internal electrode 7A oppose the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9, for example, in the second direction D2. When the plurality of internal electrodes 7 except the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9 are viewed from, for example, in the second direction D2, the plurality of internal electrodes 7 except the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9 overlap each other. Therefore, an electric field tends to be generated between the plurality of internal electrodes 7 except the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9.
The film portion EIa is located between the plurality of internal electrodes 7 except the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9. The plurality of internal electrodes 7 except the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9 oppose each other in a state in which the film portion EIa is present between the plurality of internal electrodes 7 except the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9. The plurality of internal electrodes 7 except the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9 indirectly oppose each other.
The plurality of internal electrodes 9 except the internal electrode 9A oppose the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7, for example, in the second direction D2. When the plurality of internal electrodes 9 except the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7 are viewed from, for example, in the second direction D2, the plurality of internal electrodes 9 except the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7 overlap each other. Therefore, an electric field tends to be generated between the plurality of internal electrodes 9 except the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7.
The film portion EIa is located between the plurality of internal electrodes 9 except the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7. The plurality of internal electrodes 9 except the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7 oppose each other in a state in which the film portion EIa is present between the plurality of internal electrodes 9 except the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7. The plurality of internal electrodes 9 except the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7 indirectly oppose each other.
The internal electrode 7A does not oppose the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9, for example, in the second direction D2. When the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9 are viewed from, for example, in the second direction D2, the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9 do not overlap each other. Therefore, an electric field tends not to be generated between the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9.
The internal electrode 9A does not oppose second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7, for example, in the second direction D2. When the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7 are viewed from, for example, in the second direction D2, the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7 do not overlap each other. Therefore, an electric field tends not to be generated between the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7.
The internal electrode 7A does not oppose the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9, for example, in the third direction D3. When the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 are viewed from, for example, in the third direction D3, the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 do not overlap each other. Therefore, an electric field tends not to be generated between the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9.
The internal electrode 9A does not oppose second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7, for example, in the third direction D3. When the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 are viewed from, for example, in the third direction D3, the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 do not overlap each other. Therefore, an electric field tends not to be generated between the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7.
The conductor 11 opposes the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9, for example, in the third direction D3. When the conductor 11 and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 are viewed from, for example, in the third direction D3, the conductor 11 and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 overlap each other. The conductor 11 is electrically connected to the internal electrode 9. Therefore, an electric field tends not to be generated between the conductor 11 and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9.
The conductor 13 opposes the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7, for example, in the third direction D3. When the conductor 13 and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 are viewed from, for example, in the third direction D3, the conductor 13 and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 overlap each other. The conductor 13 is electrically connected to the internal electrode 7. Therefore, an electric field tends not to be generated between the conductor 13 and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7.
In the multilayer capacitor C1, the film portion EIa included in the electrical insulating film EI is located at least on the region included in the main surface 3a, the region being between the plurality of external electrodes 5. Therefore, even when a metal particle included in the second electrode layer E2 is ionized, the film portion EIa prevents the generated metal ion from reacting with an electron supplied from the internal electrodes 7 and 9 or the external electrodes 5. The electron tends not to be supplied to the metal ion. The metal tends not to deposit on the main surface 3a. Consequently, the multilayer capacitor C1 reduces occurrence of migration.
In a configuration in which the electrical insulating film EI is located on the element body 3, the electrical insulating film EI may impede connection between the internal electrodes 7 and 9 and the external electrodes 5. In the multilayer capacitor C1, the plurality of internal electrodes 7 and 9 are exposed from the electrical insulating film EI at the corresponding end surface 3e. Therefore, the electrical insulating film EI on the element body 3 tends not to impede the connection between the internal electrodes 7 and 9 and the external electrodes 5. Consequently, the multilayer capacitor C1 reduces deterioration of connectivity between the internal electrodes 7 and 9 and the external electrodes 5.
In the multilayer capacitor C1, the film portion EIa is located between the main surface 3a and the second electrode layer E2 included in the electrode portion 5a.
The film portion EIa is located between the plurality of internal electrodes 7 except the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 9. Therefore, even when the external electrode 5 to which the internal electrode 9 is electrically connected has, for example, a positive polarity, electrons are reliably prevented from being supplied from the internal electrode 7 to metal ions. Consequently, the multilayer capacitor C1 further reduces the occurrence of the migration.
The film portion EIa is located between the plurality of internal electrodes 9 except the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5a that is electrically connected to the internal electrode 7. Therefore, even when the external electrode 5 to which the internal electrode 7 is electrically connected has, for example, a positive polarity, electrons are reliably prevented from being supplied from the internal electrode 9 to metal ions. Consequently, the multilayer capacitor C1 further reduces the occurrence of the migration.
In the multilayer capacitor C1, the electrical insulating film EI includes only the film portion EIa on the main surface 3a. Therefore, the multilayer capacitor C1 reliably reduces the deterioration of the connectivity between the internal electrodes 7 and 9 and the external electrodes 5.
In the multilayer capacitor C1, each of the plurality of internal electrodes 7 and 9 is disposed to extend in the direction intersecting the main surface 3a and includes the one end exposed to the corresponding end surface 3e. The one end each included in the plurality of internal electrodes 7 and 9 includes the region exposed from the electrical insulating film EI.
In the multilayer capacitor C1, all of the plurality of internal electrodes 7 and 9 are reliably connected to the corresponding external electrode 5 of the plurality of external electrodes 5. Therefore, multilayer capacitor C1 reliably reduces the deterioration of the connectivity between the internal electrodes 7 and 9 and the external electrodes 5.
In the multilayer capacitor C1, the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 opposes the conductor 11. Therefore, the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 tends not to oppose the internal electrode 7. The metal particle included in the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 tends not to be ionized.
In the multilayer capacitor C1, the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 opposes the conductor 13. Therefore, the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 tends not to oppose the internal electrode 9. The metal particle included in the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 tends not to be ionized.
Consequently, the multilayer capacitor C1 reliably reduces the occurrence of the migration.
In the multilayer capacitor C1, the second electrode layer E2 continuously covers a part of the main surface 3a, a part of the corresponding end surface 3e, and a part of the side surface 3c.
The multilayer capacitor C1 tends to lead to a decrease in the amount of the conductive resin paste used to form the second electrode layer E2, as compared with a configuration in which the second electrode layer E2 continuously covers a part of the main surface 3a, the entire corresponding end surface 3e, and a part of the side surface 3c. The decrease in the amount of the conductive resin paste tends to lead to a decrease in a length of a layer included in the second electrode layer E2 and located on the main surface 3a in the first direction D1 and an increase in a distance between the plurality of external electrodes 5 on the main surface 3a. The increase in the distance between the plurality of external electrodes 5 reduces an electric field between the plurality of external electrodes 5. Therefore, the generated metal ion tends not to migrate from the second electrode layer E2. Consequently, the multilayer capacitor C1 can further reduces the occurrence of the migration.
In the multilayer capacitor C1, the second electrode layer E2 included in the electrode portion 5e covers only a part of the corresponding end surface 3e. Therefore, the multilayer capacitor C1 reduces ESR (equivalent series resistance).
In the multilayer capacitor C1, the electrical insulating film EI includes the silicon oxide film.
The silicon oxide film has a high electrical insulation property. Silver tends not to diffuse into the silicon oxide film. Therefore, even in a configuration in which the second electrode layer E2 includes the plurality of silver particles, the electrical insulating property of the electrical insulating film EI can be maintained.
Consequently, the multilayer capacitor C1 reliably reduces the occurrence of the migration.
The second electrode layer E2 includes the plurality of silver particles. The silver particles tend to cause migration than, for example, copper particles.
The multilayer capacitor C1 reliably reduces the occurrence of the migration even when the second electrode layer E2 includes the plurality of silver particles.
Next, a configuration of an electronic component device including the multilayer capacitor according to the first example will be described with reference to
As illustrated in
In solder-mounting the multilayer capacitor C1, the molten solder wets the external electrode 5 (third electrode layer E3). Solidification of the wet solder causes a solder fillet SF to be formed on the external electrode 5. The external electrodes 5 and the pad electrodes PE corresponding to each other are connected to each other through the solder fillet SF.
Next, a configuration of a multilayer capacitor C1 according to a first modified example of the first example will be described with reference to
The multilayer capacitor C1 according to the first modified example is generally similar to or the same as the multilayer capacitor C1 according to the first example described above. However, the first modified example is different from the above-described first example in a configuration of the electrical insulating film EI. Hereinafter, differences between the above-described first example and the first modified example will be mainly described. In
The first electrode layer E1 of the electrode portion 5a covers a part of the main surface 3a and the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is in contact with the element body 3 on the above-described part of the main surface 3a and on the entire ridge portion 3g. In the electrode portion 5a, the first electrode layer E1 is in direct contact with the element body 3. The main surface 3a is directly covered with the first electrode layer E1 at the above-described part, and is exposed from the first electrode layer E1 at the remaining part except the above-described part.
In the electrode portion 5a, the second electrode layer E2 is disposed on the first electrode layer E1 and the element body 3 to cover the first electrode layer E1 and a part of the main surface 3a. In the electrode portion 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the element body 3. In the electrode portion 5a, the second electrode layer E2 indirectly covers the main surface 3a in such a manner that the first electrode layer E1 is located between the second electrode layer E2 and the main surface 3a. In the electrode portion 5a, the second electrode layer E2 directly covers the main surface 3a.
As illustrated in
Also in the multilayer capacitor C1 according to the first modified example, the film portion EIa is located at least on a region included in the surface of the element body 3, the region being between the plurality of external electrodes 5. Therefore, the multilayer capacitor C1 according to the first modified example reduces occurrence of migration as described above.
Next, a configuration of a multilayer capacitor C1 according to a second modified example of the first example will be described with reference to
The multilayer capacitor C1 according to the second modified example is generally similar to or the same as the multilayer capacitor C1 according to the first example described above. However, the second modified example is different from the above-described first example in a configuration of the electrical insulating film EI. Hereinafter, differences between the above-described first example and the second modified example will be mainly described. In
As illustrated in
The first electrode layer E1 of the electrode portion 5a is disposed on the electrical insulating film EI. The first electrode layer E1 of the electrode portion 5a is in direct contact with the electrical insulating film EI on the ridge portions 3j and 3g.
In the multilayer capacitor C1 according to the second modified example, the film portion EIa is located on ridge regions included the pair of ridge portions 3j, the ridge regions being between the plurality of external electrodes 5. The metal tends not to deposit not only on the main surface 3a but also on the pair of ridge portions 3j. Therefore, he multilayer capacitor C1 according to the second modified example further reduces the occurrence of the migration.
The electrical insulating film EI may also be disposed on a part of the side surface 3c. In this case, the electrical insulating film EI includes the film portion EIa on the main surface 3a and a film portion on the above-described part of the side surface 3c. The film portion on the above-described part of the side surface 3c is continuous with the film portion EIa. The side surface 3c is exposed from the electrical insulating film EI except for the above-described part covered with the electrical insulating film EI.
The electrical insulating film EI may also be disposed on a part of the end surface 3e. In this case, the electrical insulating film EI includes the film portion EIa on the main surface 3a and a film portion on the above-described part of the end surface 3e. The film portion on the above-described part of the end surface 3e is continuous with the film portion EIa. The end surface 3e is exposed from the electrical insulating film EI except for the above-described part covered with the electrical insulating film EI. In a configuration in which the electrical insulating film EI includes the film portion on the above-described part of the end surface 3e, one end of each of the plurality of internal conductors included in the multilayer capacitor C1 may be exposed from the electrical insulating film EI in the remaining part excluding the above-described part.
As in the first modified example, the electrical insulating film EI (film portion EIa) may be disposed on a region included in the main surface 3a and the pair of ridge portions 3j, the region being exposed from the second electrode layer E2 included in the electrode portion 5a.
A configuration of a multilayer capacitor C2 according to the second example will be described with reference to
In the second example, an electronic component includes, for example, the multilayer capacitor C2. The multilayer capacitor C2 is generally similar to or the same as the multilayer capacitor C1. However, the multilayer capacitor C2 is different from the multilayer capacitor C1 in a configuration of the plurality of internal conductors and the electrical insulating film EI. Hereinafter, differences between the multilayer capacitor C1 and the multilayer capacitor C2 will be mainly described.
As illustrated in
The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are alternately disposed in the third direction D3 in the same manner as the plurality of internal electrodes 7 and 9 included in the multilayer capacitor C1. In the multilayer capacitor C2, the plurality of internal conductors includes the conductors 11 and 13. In
As illustrated in
Each film portion EIc is disposed on a corresponding side surface 3c of the pair of side surfaces 3c. Each film portion EIc is disposed on a part of the corresponding side surface 3c. Each film portion EIc covers the above-described part of the corresponding side surface 3c and is in direct contact with the above-described part of the corresponding side surface 3c. The side surface 3c is covered with the film portion EIc at the above-described part and is exposed from the film portion EIc at the remaining part excluding the above-described part. In the side surface 3c, the above-described part is located closer to the main surface 3a than the remaining part.
Each film portion EIe is disposed on a corresponding end surface 3e of the pair of end surfaces 3e. Each film portion EIe is disposed on a part of the corresponding end surface 3e. Each film portion EIe covers the above-described part of the corresponding end surface 3e and is in direct contact with the above-described part of the corresponding end surface 3e. The end surface 3e is covered with the film portion EIe at the above-described part and is exposed from the film portion EIe at the remaining part excluding the above-described part. In the end surface 3e, the above-described part is located closer to the main surface 3a than the remaining part.
The electrical insulating film EI includes a plurality of film portions disposed on the ridges 3g, 3i, and 3j, respectively. The film portion EIa and the film portion EIc are coupled by the film portion on the ridge portion 3j. The film portion EIa and the film portion EIe are coupled by the film portion on the ridge portion 3g. The film portion EIc and the film portion EIe are coupled by the film portion on the ridge portion 3i. For example, the electrical insulating film EI covers only a part of the element body 3. The main surface 3b is exposed from the electrical insulating film EI.
A height H1 of the electric insulating film EI in the second direction D2 from a reference plane PL is larger than a height H2 of the second electrode layer E2 in the second direction D2 from the reference plane PL. The height H1 includes, for example, the height of the film portion EIc in the second direction D2 from the reference plane PL. The height H2 includes, for example, the height of the second electrode layer E2 included in the electrode portion 5c in the second direction D2 from the reference plane PL. The reference plane PL includes the main surface 3a.
The internal electrode 7A opposes the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 in the third direction D3. When the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 are viewed from in the third direction D3, the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 overlap each other. Therefore, an electric field tends to be generated between the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9.
The film portion EIc is located between the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9. The internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 oppose each other in a state in which the film portion EIc is present between the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9. The internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 indirectly oppose each other.
The internal electrode 9A opposes the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 in the third direction D3. When the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 are viewed from in the third direction D3, the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 overlap each other. Therefore, an electric field tends to be generated between the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7.
The film portion EIc is located between the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7. The internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 oppose each other in a state in which the film portion EIc is present between the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7. The internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7 indirectly oppose each other.
As described above, the end surface 3e is exposed from the film portion EIe at the remaining part. The one end of each of the plurality of internal electrodes 7 and 9 is exposed from the film portion EIe at the remaining part of the corresponding end surface 3e. Therefore, the plurality of internal electrodes 7 and 9 are directly connected to the corresponding external electrode 5 (electrode portion 5e).
As described above, the end surface 3e is covered with the film portion EIe at the above-described part. However, the one end of each of the plurality of internal electrodes 7 and 9 can be directly connected to the corresponding external electrode 5 (electrode portion 5e) even at the above-described part of the corresponding end surface 3e.
The electrical insulating film EI (film portion EIe) is not always uniformly formed with a predetermined film thickness. The material component constituting the electrical insulating film EI, for example, silicon oxide, is not densely attached to the outer surface of the element body 3 but sparsely attached thereto. Therefore, the first electrode layer E1 can be partially directly connected to the corresponding internal electrodes 7 and 9.
When the conductive paste for forming the second electrode layer E1 is heated, the material component constituting the electrical insulating film EI diffuses into the conductive paste, so that the material component constituting the electrical insulating film EI and the conductive paste are mixed. Therefore, even when the material component constituting the electrical insulating film EI is densely attached to the outer surface of the element body 3, the first electrode layer E1 can be partially directly connected to the corresponding internal electrodes 7 and 9.
In the multilayer capacitor C2, similarly to the multilayer capacitor C1, the film portion EIa included in the electrical insulating film EI is located at least on the region included in the main surface 3a, the region being between the plurality of external electrodes 5. Therefore, the multilayer capacitor C2 reduces occurrence of migration.
In the multilayer capacitor C2, the one end of each of the plurality of internal electrodes 7 and 9 is exposed from the electrical insulating film EI (film portion EIe) at the corresponding end surface 3e. Therefore, the electrical insulating film EI on the element body 3 tends not to impede the connection between the internal electrodes 7 and 9 and the external electrodes 5. Consequently, the multilayer capacitor C2 reduces deterioration of connectivity between the internal electrodes 7 and 9 and the external electrodes 5.
In the multilayer capacitor C2, the film portion EIc included in the electrical insulating film EI is located on the region included in the side surface 3c, the region being between the plurality of external electrodes 5. The metal tends not to deposit not only on the main surface 3a but also on side surface 3c. Consequently, the multilayer capacitor C2 further reduces the occurrence of the migration.
In the multilayer capacitor C2, the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9 indirectly oppose each other with the film portion EIc interposed therebetween.
In the multilayer capacitor C2, the film portion EIc reliably prevents the metal ion generated from the metal particle included in the second electrode layer E2 of the electrode portion 5c that is electrically connected to the internal electrode 9 on the side surface from reacting with the electron supplied from the internal conductor or the external electrode 5. Therefore, the multilayer capacitor C2 reliably reduces the occurrence of the migration.
The film portion EIc is located between the internal electrode 7A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 9. Therefore, even when the external electrode 5 to which the internal electrode 9 is electrically connected has, for example, a positive polarity, electrons are reliably prevented from being supplied from the internal electrode 7A to metal ions. Consequently, the multilayer capacitor C2 further reduces the occurrence of the migration.
The film portion EIc is located between the internal electrode 9A and the second electrode layer E2 included in the electrode portion 5c that is electrically connected to the internal electrode 7. Therefore, even when the external electrode 5 to which the internal electrode 7 is electrically connected has, for example, a positive polarity, electrons are reliably prevented from being supplied from the internal electrode 9A to metal ions. Consequently, the multilayer capacitor C2 further reduces the occurrence of the migration.
In the multilayer capacitor C2, the height H1 of the electrical insulating film EI in the second direction D2 is larger than the height H2 of the second electrode layer E2 in the second direction D2. Therefore, the multilayer capacitor C2 reliably reduces the occurrence of the migration.
Next, a configuration of a multilayer capacitor C2 according to a modified example of the second example will be described with reference to
The multilayer capacitor C2 according to the present modified example is generally similar to or the same as the multilayer capacitor C2 according to the second example described above. However, the present modified example is different from the above-described second example in a configuration of the internal electrodes 7 and 9. Hereinafter, differences between the above-described second example and the present modified example will be mainly described.
The internal electrodes 7 and the internal electrodes 9 are disposed in different positions (layers) in the second direction D2. The internal electrodes 7 and the internal electrodes 9 are alternately disposed in the element body 3 to oppose each other in the second direction D2 with an interval therebetween.
The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are alternately disposed in the second direction D2. The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are disposed in the element body 3 to be distributed in the second direction D2. Each of the plurality of internal electrodes 7 and the plurality of internal electrodes 9 is located in a plane substantially parallel to the main surfaces 3a and 3b. The internal electrode 7 and the internal electrode 9 oppose each other in the second direction D2. The direction in which the internal electrode 7 and the internal electrode 9 oppose each other, that is, the second direction D2 is orthogonal to a direction parallel to the main surfaces 3a and 3b (first direction D1 and third direction D3).
In the multilayer capacitor C2, the plurality of internal conductors does not include the conductors 11 and 13. In
As described above, the end surface 3e is exposed from the film portion EIe at the remaining part. The plurality of internal electrodes 7 includes the internal electrode 7 whose the one end exposed to the remaining part of the corresponding end surface 3e and the plurality of internal electrodes 9 includes the internal electrode 9 whose the one end exposed to the remaining part of the corresponding end surface 3e. The internal electrode 7 including the one end exposed to the remaining part of the corresponding end surface 3e is directly connected to the corresponding external electrode 5 (electrode portion 5e) and the internal electrode 9 including the one end exposed to the remaining part of the corresponding end surface 3e is directly connected to the corresponding external electrode 5 (electrode portion 5e).
As described above, the end surface 3e is covered with the film portion EIe at the above-described part. The plurality of internal electrodes 7 can include the internal electrode 7 whose the one end exposed to the above-described part of the corresponding end surface 3e and the plurality of internal electrodes 9 can include the internal electrode 9 whose the one end exposed to the above-described part of the corresponding end surface 3e. Even in a configuration in which the plurality of internal electrodes 7 and 9 include the internal electrodes 7 and 9 each including the one end exposed to the above-described part of the corresponding end surface 3e, the internal electrodes 7 and 9 each including the one end exposed to the above-described part of the corresponding end surface 3e can be directly connected to the corresponding external electrode 5 (electrode portion 5e) as described above.
The multilayer capacitor C2 according to the present modified reduces occurrence of migration and reduces deterioration of connectivity between the internal electrodes 7 and 9 and the external electrodes 5 as described above.
In the present specification, in a case where an element is described as being disposed on another element, the element may be directly disposed on the other element or be indirectly disposed on the other element. In a case where an element is indirectly disposed on another element, an intervening element is present between the element and the other element. In a case where an element is directly disposed on another element, no intervening element is present between the element and the other element.
In the present specification, in a case where an element is described as being located on another element, the element may be directly located on the other element or be indirectly located on the other element. In a case where an element is indirectly located on another element, an intervening element is present between the element and the other element. In a case where an element is directly located on another element, no intervening element is present between the element and the other element.
In the present specification, in a case where an element is described as covering another element, the element may directly cover the other element or indirectly cover the other element. In a case where an element indirectly covers another element, an intervening element is present between the element and the other element. In a case where an element directly covers another element, no intervening element is present between the element and the other element.
It is to be understood that not all aspects, advantages and features described herein may necessarily be achieved by, or included in, any one particular example. Indeed, having described and illustrated various examples herein, it should be apparent that other examples may be modified in arrangement and detail.
The plurality of internal conductors included in the multilayer capacitor C1 are disposed in different positions (layers) in the third direction D3. However, the plurality of internal conductors included in the multilayer capacitor C1 may be disposed in different positions (layers) in the second direction D2.
The electronic component device may include the multilayer capacitor C2 instead of the multilayer capacitor C1.
In the present examples and modified examples, the electronic component includes the multilayer capacitor. However, applicable electronic component is not limited to the multilayer capacitor. The applicable electronic component includes, for example, a multilayer electronic component such as a multilayer inductor, a multilayer varistor, a multilayer piezoelectric actuator, a multilayer thermistor, a multilayer solid-state battery component, or a multilayer composite component, or electronic components other than the multilayer electronic components.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-204643 | Dec 2022 | JP | national |
