Patent Application
20130070419
1. Technical Field
The present disclosure relates to electronic devices, and particularly to an electronic device with a heat dissipating module.
2. Description of Related Art
Circuit boards, such as a motherboard, are located on an enclosure of a server or a computer. A plurality of heat generating parts may be located on the circuit board. A typical heat dissipating module is installed on the circuit board for dissipating heat generated by the heat generating parts. The heat dissipating module may include a heat dissipating device, a heat pipe located on the heat dissipating device, and a plurality of heating pieces attached to the heat pipe. Each of the heat dissipating modules abuts each of the heat generating parts and is secured to the corresponding heat generating parts by a plurality of screws. However, assembly or disassembly of the heat dissipating pieces is very time-consuming and inconvenient.
Therefore, there is room for improvement within the art.
Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The circuit board 10 includes a body 11. A first heat generating part 15, a second heat generating part 16, and a third heat generating part 17 are located on the body 11. The body 11 defines two through holes 111 at two opposite sides of the first heat generating part 15. The body 11 defines a cutout 113 in one side of the first heat generating part 15. In one embodiment, the cutout 113 is substantially U-shaped.
The heat dissipating module 80 includes a heat dissipating device 20, a heat pipe 30, a first heat dissipating piece 40, two resilient pieces 50, and a second heat dissipating piece 60. In one embodiment, the heat pipe 30 is substantially L-shaped.
Referring to
The resilient arm 57 includes a latch portion 571 and an operating portion 573 extending from the latch portion 571. In one embodiment, a cross-section of the resilient arm 57 is substantially S-shaped. The latch portion 571 includes a second resilient portion 5711 and a resisting portion 5713. The second resilient portion 5711 extends from a free distal end of the stretching portion 5153. The resisting portion 5713 is bent backwards from a distal end of the second resilient portion 5711. In one embodiment, the resisting portion 5713 is substantially arc-shaped. The operating portion 573 extends from a distal end of the resisting portion 5713 to tilt away the stretching portion 5153. In one embodiment, a first plane contains the operating portion 5713, and a second acute angle is defined between the first plane and stretching portion 5153.
Referring to
In assembling the dissipating module 80 to the circuit board 10, the heat dissipating device 20 is received in the cutout 113. The second heat dissipating piece 60 can be secured to the circuit board 10 by a plurality of fixing members 70, such as fasteners, and abuts the second heat generating part 16 and the third heat generating part 17. The first heat dissipating piece 40 is placed on the first heat generating part 15. The second resilient portion 5711 of each resilient piece 50 can elastically bend to towards the stretching portion 5153 by biasing the operating portion 573. The first resilient portion 513 elastically bends to move the resilient arm 57 towards the body 11 of the circuit board 10, until the latch portion 571 extends through the through hole 111. The second resilient portion 5711 elastically returns with the resisting portion 5713 engaging with the body 11, and the operating portion 573 abutting an edge of the through hole 111. Thus, the first heat dissipating piece 40 closely abuts the first heat generating part 15 to dissipate heat generated by the first heat generating part 15.
Referring to
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201110281681.X | Sep 2011 | CN | national |
