This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2022-034838, filed on Mar. 7, 2022, the entire contents of which are incorporated herein by reference.
The embodiment discussed herein is directed to an electronic device.
Conventionally, for example, in a case where a short electronic part and a tall electronic part are mounted on the same substrate in an electronic device provided in a vehicle, a height of a product chassis is decided by the tall electronic part. In such a kind of electronic device, there has been a technology in which a short electronic part and a tall electronic part are separately arranged, and heat radiating fins are provided according to heating value of the respective electronic parts (see Japanese Patent No. 6222125, for example).
However, in the conventional technology, there has been a room for improvement in increasing a heat radiating effect.
In order to solve the above-mentioned problem to achieve an object, an electronic device according to an embodiment includes a substrate, a first electric part, a second electric part, a chassis, and heat radiating fins. The first electric part is mounted on the substrate. The second electric part is mounted on the substrate, the second electric part having a height that is smaller than a height of the first electric part. The chassis houses therein the substrate, the first electric part, and the second electric part. Heat radiating fins protruding from an outer surface of the chassis. The heat radiating fins continuously extend from a side of the second electric part to a side of the first electric part. A portion of the outer surface of the chassis between the first electric part and the second electric part is formed in a slope.
Hereinafter, an embodiment of an electronic device according to the present application will be described in detail with reference to the accompanying drawings. The present disclosure is not limited to the embodiment described in the following.
In the following drawings including
Next,
The chassis 2 houses therein various parts such as electronic parts related to the electronic device 1. An internal structure of the chassis 2 will be mentioned later with reference to
The chassis 2 includes the plurality of heat radiating fins 6 that functions as a heatsink in a lower side (Y-axis negative side) thereof. The heat radiating fins 6 constitute a heat radiating member that protrudes from an outer surface 21 (see
In the present disclosure, in order to increase air flow between the plurality of heat radiating fins 6, a portion of the outer surface 21 of the chassis 2 is sloped, details thereof will be mentioned later with reference to
The lid part 3 functions as a lid that closes an opening of the chassis 2. The lid part 3 closes the opening of the chassis 2 so as to prevent entry of an extraneous matter (moisture, dirt, dust, and the like) into an inner part of the chassis 2. Note that in the present disclosure, the chassis 2 and the lid part 3 may be collectively referred to as the chassis 2.
The bus bar 4 is an electric conductive member that causes current generated by the electronic device 1 to flow to a drive motor provided in the vehicle C, and is configured such that the bus bar 4 protrudes from a hole part provided in the lid part 3 (chassis 2) through the hole part from an inner part of the chassis 2. In an inner part of the chassis 2, the bus bar 4 is mounted on a substrate 7 (see
The grommet 5 is interposed between the chassis 2 (lid part 3) and the bus bar 4 so as to electrically insulate the bus bar 4 from the chassis 2, and prevents entry of an extraneous matter (moisture, dirt, dust, and the like) into an inner part of the chassis 2. The grommet 5 is an elastic member made of resin material or the like, for example.
Next, a configuration of the electronic device 1 will be further explained with reference to
As illustrated in
A part of the outer surface 21 of the chassis 2, from which the heat radiating fins 6 protrudes, is formed to be a slope 21b, and details thereof will be mentioned later with reference to
Next, a cross-section of the electronic device 1 will be explained with reference to
As illustrated in
The first substrate 7 is a power substrate, and the second substrate 8 is a control-system substrate. The power substrate means a substrate through which large current flows, and a power part of e.g., a power integrated circuit (IC) such as a switching element that causes large current to flow into a load, is mounted thereon. Commonly, heating value of a power IC is large and thus is mounted on a power substrate, and is not mounted on a control-system substrate. The control-system substrate is a control board on which electronic parts related to a control circuit are mounted.
The short part 9 and the tall part 10, which are power parts, are electronic parts that are mounted on the first substrate 7. Compared with the tall part 10, the short part 9 has a lower part height (length in Y-axis direction illustrated in
The short part 9 and the tall part 10 are mounted on respective different mount surfaces of the first substrate 7. In the example illustrated in
The electric-current sensor 11 is mounted on the second substrate 8 so as to detect current flowing through the bus bar 4. Specifically, the bus bar 4 penetrates through the second substrate 8 and is mounted on the second surface 72 of the first substrate 7, and the electric-current sensor 11 is arranged at a penetration part of the bus bar 4 in the second substrate 8.
In the present disclosure, the above-mentioned heat radiating fin 6 of the electronic device 1 extends from a side of the tall part 10 toward a side of the short part 9 (along X-axis direction). In the heat radiating fin 6 is arranged, a portion of the outer surface 21 between the tall part 10 and the short part 9 is formed in the slope 21b.
Specifically, a first flat surface 21a, the slope 21b, and a second flat surface 21c are continuously connected along an X-axis direction so as to constitute the outer surface 21 on which the heat radiating fin 6 is arranged. The slope 21b is a rising slope that rises up from the front toward the rear in an advancing direction of the vehicle C. Namely, the slope 21b is sloped such that a distance thereto from the first substrate 7 increases as a position goes from the front toward the rear in an advancing direction of the vehicle C. In other words, the chassis 2 is attached such that the short part 9 is arranged to direct the front of a vehicle. Thus, wind caused by travelling of the vehicle C directly hits the short part 9 whose heating value is large, so that it is possible to increase a heat radiating effect.
As described above, in the electronic device 1 according to the embodiment, the slope 21b is provided to the outer surface 21 of the heat radiating fin 6, for example, wind from the front of a vehicle flows toward the rear of the vehicle along the slope 21b, so that it is possible to improve air flow between the heat radiating fins 6, and further to improve a heat radiating effect.
Moreover, the slope 21b is formed in a rising slope such that a distance thereto from the first substrate 7 increases as a position goes from the front toward the rear in the advancing direction, so that it is possible to reduce a part in which air remains between the heat radiating fins 6. If the heat radiating fin 6 does not include the slope 21b so as to extend from the first flat surface 21a to the second flat surface 21c, air between the heat radiating fins 6 hits a level difference caused by difference in height between the first flat surface 21a and the second flat surface 21c, and thus air remains at the level difference. Thus, the slope 21b is formed in a rising slope such that a distance thereto from the first substrate 7 increases as a position goes from the front toward the rear in the advancing direction, so that it is possible to reduce a part between the heat radiating fins 6 in which air remains. Thus, it is possible to improve air flow, and further to improve a heat radiating effect.
As illustrated in
As illustrated in
In other words, heat radiating efficiently on a side of the short part 9 is set to be higher than that on a side of the tall part 10. This is because heating value of the short part 9 is larger than that of the tall part 10. Thus, it is possible to efficiently radiate heat generated by the short part 9, and the heat radiating fin 6 close to the tall part 10 whose heating value is small is set to be small, so that it is further possible to realize miniaturization of the electronic device 1.
Next, relation between the heat radiating fins 6 and the slopes 21b will be explained with reference to
As illustrated in
As illustrated in
As described above, the electronic device 1 according to the embodiment includes the substrate 7, the tall part 10, the short part 9, and the heat radiating fins 6. The tall part 10 is mounted on the substrate 7. The short part 9 is mounted on the substrate 7. The heat radiating fins 6 protrude from the outer surface 21 of the chassis 2, the chassis 2 housing therein the substrate 7, the tall part 10, and the short part 9. The heat radiating fins 6 continuously extend from a side of the tall part 10 to a side of the short part 9, and a portion of the outer surface 21 between the tall part 10 and the short part 9 is formed in the slope 21b. Thus, it is possible to improve air flow between the heat radiating fins 6, and further to improve a heat radiating effect.
According to the present disclosure, it is possible to increase a heat radiating effect.
Although the invention has been described with respect to specific embodiments for a complete and clear disclosure, the appended claims are not to be thus limited but are to be construed as embodying all modifications and alternative constructions that may occur to one skilled in the art that fairly fall within the basic teaching herein set forth.
Number | Date | Country | Kind |
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2022-034838 | Mar 2022 | JP | national |