Patent Grant
11635786
The described embodiments relate generally to electronic devices. More particularly, the present embodiments relate to wearable electronic devices.
Electronic devices are increasingly being designed with device portability in mind, for example, to allow users to use these devices in a wide variety of situations and environments. In the context of wearable devices, these devices can be designed to include many different functionalities and to be operated in many different locations and environments. The components of an electronic device, for example, the processors, memory, antennas, display, and other components can partially determine a level of performance of the electronic device. Further, the arrangement of these components with respect to one another in the device can also determine the level of performance of the electronic device.
Continued advances in electronic devices and their components have enabled considerable increases in performance. Existing components and structures for electronic devices can, however, limit the levels of performance of such devices. For example, while some components can achieve high levels of performance in some situations, the inclusion of multiple components in devices sized to enhance portability can limit the performance of the components, and thus, the performance of the device. Consequently, further tailoring an arrangement of components for electronic devices to provide additional or enhanced functionality, without introducing or increasing undesirable device properties, can be desirable.
According to some examples of the present disclosure, an electronic device can include a housing at least partially defining an internal volume, the housing including an electromagnetically transparent portion at least partially defining an exterior surface of the electronic device. The electronic device can also include an antenna disposed in the internal volume and positioned to emit a signal at a power level through the electromagnetically transparent portion, and a sensing circuit disposed in the internal volume and positioned to receive the signal. The sensing circuit can be configured to measure a transmitted power of the signal. A processor can also be disposed in the internal volume, the processor being configured to compare the transmitted power with the power level.
According to some examples of the present disclosure, an electronic device can include a housing at least partially defining an internal volume, the housing including an optically transparent component at least partially defining an exterior surface of the electronic device, a first light emitter positioned in the internal volume, a second light emitter positioned in the internal volume, a light detector positioned in the internal volume, the light detector optically isolated from the first light emitter and the second light emitter within the internal volume, and an opaque material disposed on the optically transparent component, the opaque material positioned to inhibit light emitted from the second light emitter from reaching the light detector along a path from the second emitter, through a medium adjacent to a portion of exterior surface defined by the optically transparent component, and onto the light detector through the optically transparent component, and allow light emitted from the first light emitter to reach the light detector along a path from the first emitter, through the medium, and onto the light detector through the optically transparent component.
In some examples, the optically transparent component includes glass. The opaque material can be opaque to generally visible light, and/or specifically to green light. The opaque material can be transparent to infrared light. The opaque material can have a major dimension of 10 mm or less. The opaque material can have a thickness of 10 microns or less. The electronic device can further include a lens positioned over the opaque material. The optically transparent component can include sapphire. The optically transparent component can include a silicon dioxide layer, and the opaque material can be disposed on the silicon dioxide layer.
According to some examples, an electronic device can include a housing defining an internal volume, the housing including an optically transparent portion, a light emitter disposed in the internal volume, a first light detector disposed in the internal volume, a second light detector disposed in the internal volume, and a light blocking component disposed on an internal surface of the optically transparent portion, the light blocking component sized and positioned to prevent light emitted by the light emitter from passing out of the electronic device through the optically transparent component in a direction oriented more towards the second light detector than the first light detector and allow light emitted by the light emitter to pass out of the electronic device through the optically transparent component in a direction oriented more towards the first light detector than the second light detector.
In some examples, the light blocking component has a substantially circular shape. The light blocking component can have a diameter of 10 mm or less. The light blocking component can include a layer of ink. The layer can have a thickness of about 10 microns or less. The light emitter can include an LED. The light blocking component includes a first light blocking component and the electronic device further includes a second light blocking component positioned in the internal volume between the light emitter and the first light detector.
According to some examples, a housing for an electronic device can include a cover defining an aperture an optically transparent component positioned in the aperture and secured to the cover, the optically transparent component at least partially defining an internal surface of the housing and an external surface of the housing, a lens overlying a portion of the optically transparent component defining the internal surface, and an opaque material disposed on the portion of the optically transparent component defining the internal surface, the opaque material positioned between the optically transparent component and the lens. The opaque material can be opaque to visible light and at least partially transparent to infrared light. The lens can include a Fresnel lens. The optically transparent component can include glass.
The disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and in which:
Reference will now be made in detail to representative embodiments illustrated in the accompanying drawings. It should be understood that the following descriptions are not intended to limit the embodiments to one preferred embodiment. To the contrary, it is intended to cover alternatives, modifications, and equivalents as can be included within the spirit and scope of the described embodiments as defined by the appended claims.
The architecture and components of the electronic devices described herein can allow for configurations and designs that can maximize the number of functions and performance of a portable or wearable electronic device, while also allowing for the use of relatively low cost or abundant materials, and the reduction of manufacturing and assembly complexity and costs. While the use of high performance materials or highly complex components can enable high levels of device performance and functionality, these materials and components can also increase the cost of a device, thereby reducing the number of users who may be able to reasonably afford the device. Accordingly, it can be desirable to provide component designs that can incorporate relatively lower cost materials and that have relatively lower manufacturing complexity, but that still enable levels of performance and functionality that are on par with, or sufficiently close to levels achieved by devices including high performance materials and components.
These and other embodiments are discussed below with reference to
Referring now to
In some examples, the housing 102 can include a component 130 that defines at least an exterior surface of the device 100. The component 130 can be referred to as a back case or a back cover, and in some examples, can be attached to one or more other components, such as the housing 102. The component 130 can be attached to the housing 102 by any method known in the art or developed in the future, such as adhesive bonding, brazing, welding, overmolding, interference fitting, or other securing methods.
The back cover 130 can define one or more apertures or through holes. A transparent material 132 can be disposed in the one or more apertures. In some examples, the transparent material 132 can be visually transparent and can include any transparent including a ceramic material such as sapphire. The transparent material 132 can provide visual and electromagnetic access to an exterior environment for one or more components of the device 100, as described herein.
The housing 102 can include one or more features to receive or couple to other components of the device 100. For example, housing 102 can include features, such as an indentation 104 to receive strap 103, and an aperture 108 to receive a button 148. The housing can also define one or more apertures to receive additional input components, such as a dial or a crown 146.
The device 100 is merely one example of an electronic device 100. Additional electronic devices and designs thereof, are expressly contemplated. Further details of example electronic devices and components are provided below with reference to
The housing 202 can be a substantially continuous or unitary component, and can define one or more openings 204, 206, 208 to receive components of the electronic device 200 and/or to provide access to an internal portion of the electronic device 200. In some examples, the device 200 can include input components such as one or more buttons 248 and/or a crown 244 that can be disposed in the openings 206, 208. A microphone can be disposed in the internal volume such that it is in communication with the external or ambient environment through the opening 204.
The display assembly 210 can be received by and can be attached to the housing 202. The display assembly can include a cover 214 including a transparent material, such as plastic, glass, and/or ceramic. The display assembly 210 can also include a display stack 212 that can include multiple layers and components, each of which can perform one or more desired functions. For example, the display stack 212 can include a display layer 212 that can include a touch detection layer or component, a force sensitive layer or component, and one or more display layers or components that can include one or more pixels and/or light emitting portions to display visual content and/or information to a user. In some examples, the display layer or component 212 can include a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, and/or any other form of display. The display layer 212 can also include one or more electrical connectors to provide signals and/or power to the display layer 212 from other components of the device 200.
In some examples, the device 200 can include a gasket or a seal 216 that can be disposed between the display assembly 210 and the housing 202 to substantially define a barrier to the ingress of liquids or moisture into the internal volume from the external environment at the location of the seal 216. As described herein, the seal 216 can include polymer, metal, and/or ceramic materials. The device 200 can also include a seal 234 that can be disposed between the housing 202 and the back cover 230 to substantially define a barrier to the ingress of liquids or moisture into the internal volume from the external environment at the location of the seal 234. As described herein, the seal 234 can include polymer, metal, and/or ceramic materials. The seal 234 can be substantially similar to and can include some or all of the features of the seal 216.
The device 200 can also include internal components, such as a haptic engine 224, a battery 222, and a logic board 240, also referred to as a main logic board 240, that can include a system in package (SiP) 242 disposed thereon, including one or more integrated circuits, such as processors, sensors, and memory. The SiP can also include a package.
In some examples, internal components can be disposed below the main logic board 240 and can be disposed at least partially in a portion of the internal volume defined by the back cover 230. For example, the device 200 can include an electromagnetic shielding component, otherwise referred to as an e-shield 252, that can shield other components in the device 200 from electromagnetic radiation from the ambient environment and/or as emitted by other components in the device 200. The device 200 can also include a second logic board 250 that can be in communication with one or more sensors or emitters of the device 200, for example, to receive information or signals from an external environment. In some examples, the second logic board 250 can also include a SiP. In some examples, the device 200 can include one or more wireless antennas, such as antenna 254, that can be in electrical communication with one or more other components of the device 200. In some examples, the antenna 254 can receive and/or transmit wireless signals at one or more frequencies and can be, for example, one or more of a cellular antenna such as an LTE antenna, a Wi-Fi antenna, a Bluetooth antenna, a GPS antenna, a multifrequency antenna, and the like. The antenna 254 can be communicatively coupled to one or more additional components of the electronic device 200
The internal components can be disposed within the internal volume defined at least partially by the housing 202, and can be affixed to the housing 202 via internal surfaces, attachment features, threaded connectors, studs, posts, or other features, that are formed into, defined by, or otherwise part of the housing 202 and/or the cover 214 and/or back cover 330.
Any number or variety of components in any of the configurations described herein can be included in an electronic device, as described herein. The components can include any combination of the features described herein and can be arranged in any of the various configurations described herein. The structure and arrangement of components of a device, as well as the concepts regarding the use and operation of the components can apply not only to the specific examples discussed herein, but to any number of embodiments in any combination. Various examples of electronic devices and electronic device components including having various features in various arrangements are described below, with reference to
The input component 400 can include an outer portion or dial 402 that is connected to a shaft 410, for example, with a lock ring 406. The dial 402 can define an exterior surface of both the crown module and the electronic device including the crown module. Further, the dial 402 can be sized and shaped to be manipulated by a user, for example, to be rotated by a user about an axis defined by the shaft 410. In some examples, the dial 402 can include a cap or a ring 404 that can include a different material than the dial 402, and that can provide a desired aesthetic appearance to the exterior of the dial 402. For example, the cap 404 can be brightly colored so as to be readily identifiable by a user.
In some examples, the shaft 410 can be affixed to the lock ring 406 by any desired technique, such as one or more of an adhesive, brazing, or welding. In some examples, the shaft 410 can also include a threaded portion that can be received by other components of the crown module (not shown) and that can transmit rotational forces exerted on the dial 402 to the module. All or a portion of the shaft 410 can extend through a collar 420 that can define an aperture or an orifice through which the shaft 410 can pass. The collar 420 can house the shaft 410 and can retain the shaft 410 in a desired position. In some examples, the shaft 410 can include a protruding portion, for example, that protrudes substantially perpendicularly from a central axis of the shaft 410. In some examples, the protruding portion and a central portion of the shaft can define a channel. One or more gaskets or o-rings 432 can be disposed between the shaft 410 and the collar 420 to provide or define a seal therebetween, for example, to prevent the ingress of liquid or contaminants into the internal volume of the device and/or the crown module. An additional gasket or o-ring 434 can be disposed on another surface of the collar 420 to provide or define a seal between the collar 420 and one or more other components of the crown module. In some examples, a bushing 422 can be mounted on an outer surface of the collar 420 between the collar 420 and the shaft 410, such as the protruding portion that defines the channel.
In some examples, the dial 402 can define a recess, a cavity, a trench, or a channel that can receive and/or retain the cap 404, for example, an engagement portion 405 thereof. In some examples, the cap 404 can have a toroidal or ring shape, however in some other examples, the cap can have a substantially circular shape, as shown. In some examples, the engagement portion 405 can extend substantially perpendicularly from a plane of the circle or ring, as shown. The cap 404 can include any desired material, such as a polymer, a metal, or a ceramic material. In some examples, the cap 404 can include a polymer material and can have any desired color, such as a bright or visually distinctive color. Thus, in some examples, the cap 404 can provide a desired cosmetic or aesthetic appearance to the dial 402 without the need for a multi-part or multi-section dial 402 architecture that can result in an undesirable increase in dial size or an undesirable increase in the distance the dial protrudes from the housing and/or crown module. The cap 404 can be retained at a desired location on the dial 402 by any desired technique. In some examples, a layer of adhesive or glue 403 can be provided in the trench defined by the dial 402 to retain the cap 404. In some other examples, a mechanical interlock between the engagement portion of the cap and a corresponding engagement feature defined by the dial 402 can additionally or alternatively retain the cap 404 in a desired position on the dial 402.
In some examples, an adhesive or glue material 403 can be disposed in the channel 407 and can additionally or alternatively serve to affix the cap 404 to the dial 402. In some examples, in addition to affixing the cap 404 to the dial 402, the adhesive 403 can fill any empty volume in the channel 407 and ensure that the cap 404 is disposed at a desired depth in the channel 407, and thus relative the exterior surface of the dial 402. In some examples, the exterior surface of the cap 404 is substantially flush, level, parallel with, and/or in-plane with the exterior surface of the dial 402.
In some examples, the collar 420 can include a metal or metal alloy, such as steel or aluminum. In some examples, the bushing 422 can include a polymer and/or ceramic material, such as a plastic or resin. In some examples, the bushing 422 can include an acetal resin, such as DELRIN brand resin. In some examples, an inner surface of the bushing 422 can have a chamfer to allow for the press-fit process. In some examples, a height of the bushing can be about 1 mm or less, about 0.75 mm or less, or even about 0.6 mm or less. In some examples, an outer surface of the bushing 422 can define a groove or a channel 423. The groove 423 can be positioned at or near a lower edge of the bushing 422, as shown. In some examples, the components of the crown module that abut the bushing 422, such as the shaft 410, can cause wear on the bushing material over time. If no groove 423 was present, this wear could result in the formation of channel that can then have a lip. This lip could produce an undesirable sensation during depression of the dial 402 into the device, as the shaft would pass back and forth over the lip. By preemptively removing material from the bushing 422 at the location of the groove 423, the material that might define the lip is no longer present, eliminating this issue if bushing wear does occur. In some examples, the groove 423 can have a height of between about 0.01 mm to about 0.1 mm, for example, about 0.05 mm.
Any number or variety of components in any of the configurations described herein can be included in an electronic device as described herein. The components can include any combination of the features described herein and can be arranged in any of the various configurations described herein. The structure and arrangement of components of a device, as well as the concepts regarding can apply not only to the specific examples discussed herein, but to any number of embodiments in any combination. Various examples of electronic devices and electronic device components including having various features in various arrangements are described below, with reference to
In some examples, polymer layers 523 and 525 can be disposed on the top and bottom surfaces of the silicone layer 520. These polymer layers 523, 525 can be the same or different materials, and in some examples, can include polyimide. In some examples, the polymer layers 523, 525 can be transparent or translucent. In some examples, the polymer layers 523, 525 can be a colored translucent material, such as a translucent amber colored material. In some examples, the polymer layers 523, 525 can be the same or different thicknesses. The polymer layers 523, 525 can have thicknesses between about 25 microns and about 150 microns, or between about 50 microns and about 100 microns, for example, about 75 microns.
In order to secure the cover 514 to the housing 502 as shown in
Thus, in some examples, the entire seal 516 can have a thickness of between about 200 microns and about 600 microns, or between about 300 microns and about 600 microns, for example, about 400 microns. Further, the seal can have a width of between about 500 microns and about 1500 microns, or between about 750 microns and about 550 microns, for example, about 900 microns.
Referring again to
In some examples, however, liquids, particles, contaminants, and/or corrosive materials can inadvertently enter the gap 505, and can come in contact with the seal 516. Thus, it can be desirable for the seal 516 to be corrosion resistant and for the bond length between the seal 516 and the housing 502 and cover 514 to be relatively large.
The seal 616 can also include a core 622 that can include one or more metals and/or polymers, such as stainless steel, and that can be overmolded with a polymer material 620, such as silicone. As shown, the seal 616 can have a substantially X-shaped cross-section, for example, defining one or more indentations or divots that can extend partially or entirely along one or more surfaces of the seal 616. In some examples, the shape of the seal 616 can allow for desired levels of compression or deformation of the seal 616 to effectively dissipate energy and to provide a desired level of sealing between components.
Any number or variety of components in any of the configurations described herein can be included in an electronic device, as described herein. The components can include any combination of the features described herein and can be arranged in any of the various configurations described herein. The structure and arrangement of components of a device, as well as the concepts regarding the function and use thereof can apply not only to the specific examples discussed herein, but to any number of embodiments in any combination. Various examples of electronic devices and electronic device sensor components including having various features in various arrangements are described below, with reference to
In some examples, the sensing antenna 940 can be used to determine a presence of a material at or near the exterior surface of an electronic device including the sensing antenna, for example, at or near an exterior surface at least partially defined by the electromagnetically transparent portion 932. In use, the sensing antenna 940 can be in electrical communication with one or more other components of the device and can be driven to emit and/or reflect electromagnetic radiation at one or more desired frequencies. In some examples, the sensing antenna 940 can radiate energy at about 2.4 GHz, although substantially any frequency can be used. The device can also include an integrated circuit, for example, disposed on the logic board 950, another logic board of the device, such as a main logic board, or at any desired location.
In use, the sensing antenna 940 is driven at a desired frequency, and an associated sensing integrated circuit in the device can measure the performance, efficiency, and/or resonance of the sensing antenna 940. In some examples, a sensing integrated circuit can measure a difference between a power used to drive the antenna and a transmitted power at the location of the sensing integrated circuit. In some examples, a sensing integrated circuit can measure a level of reflected power from the driven antenna, or a level of reflectance, based on a signal and/or power used to drive the antenna. In some examples, the sensing integrated circuit can be located near the back cover of the device, for example, on the logic board 950. Consequently, the sensing integrated circuit can measure antenna efficiency and/or performance in a direction extending out of the back cover and/or electromagnetically transparent component 932. In some examples, the device can include any number of desired sensing integrated circuits, positioned at any number of locations within the internal volume of the device.
As a material or object is brought near the device, for example, near the electromagnetically transparent component 932, the dielectric properties, or permittivity of the material or object can affect the performance, efficiency, and/or resonance of the sensing antenna 940 because at least some of the material or object can be in the transmission path between the sensing antenna 940 and the sensing integrated circuit and/or because a change in the dielectric properties of the region now including the material or object can shift the resonance or resonant frequency of the antenna. The presence of a material or object having a permittivity different than air in the transmission path can result in a tuning and/or detuning of the sensing antenna 940 performance, which is then measured by the sensing integrated circuit, for example, by measuring a change in the transmitted efficiency and/or level or reflectance from the antenna. The degree to which the performance, efficiency, tuning, and/or resonance of the sensing antenna 940 is changed can be measured and can be used to at least partially determine a presence and/or proximity of an object or material near the device. In some examples, the degree to which the performance, efficiency, tuning, and/or resonance of the sensing antenna 940 is changed can be used to at least partially determine a composition of the material and/or object.
In some examples, this proximity detecting functionality can be used to assist the device in determining whether it is actively being worn by a user or whether the device has been removed from a user's wrist. That is, the sensing antenna 940 and the sensing integrated circuit can detect a presence and/or proximity of a body part at or near the device. In some examples, the sensing antenna 940 and the sensing integrated circuit can distinguish the presence of a body part at or near the device from the presence of a different object or material, such as a table. In this way, a user can initially authenticate themselves when the device, such as a smartwatch, is put on, and the device may not require further authentication until the device determines that it has been removed from the user's wrist.
In some examples, the sensing antenna 940 can include a conductive material that is substantially surrounded and/or encapsulated by an insulating material. In some examples, the conductive material can include a metal or metal alloy, such as copper. In some examples, the insulating material can include a polymer material. In some examples, the insulating material can include an adhesive material, such as a pressure sensitive adhesive material. The pressure sensitive adhesive material can aid in fixing the sensing antenna 940 in a desired location, and can further assist in securing other components in the device. In some examples, the sensing antenna 940 can have a substantially annular or ring shape, as shown. In some examples, the sensing antenna 940 can be a monopole antenna, a dipole antenna, or any desired antenna topology. Further, in some examples, a spring finger or connection component can be in electrical communication with the conductive material of the sensing antenna 940 and one or more other components of the device, such as a component that can provide power to and can drive the sensing antenna 940. In some examples, the sensing antenna 940 can include a first layer of pressure sensitive adhesive, a layer of copper, and a second layer of pressure sensitive adhesive overlying the copper and the first layer of pressure sensitive adhesive.
In some examples, the sensing antenna 940 can include any conductive material in any shape or configuration as desired. In some examples, the sensing antenna 940 can be a pre-formed component including conductive material that is disposed in the internal volume of the electronic device. In some examples, however, the sensing antenna 940 can be deposited, plated, or otherwise formed onto another component of the electronic device. For example, a conductive material can be deposited in a desired shape or configuration onto the electromagnetically transparent portion 932 to form the sensing antenna 940. In some examples, the sensing antenna 940 can be formed by a vapor deposition and/or plating process, such as a physical vapor deposition and/or electroplating process. Further, in some examples, an existing antenna of the electronic device can be used or can function as the sensing antenna 940. That is, an electronic device can include one or more antennas, such as a cellular antenna, NFC antenna, LTE antenna, a Wi-Fi antenna, a Bluetooth antenna, and/or a GPS antenna, and one or more of these antennas can additionally or alternatively be driven or used as the sensing antenna. In some examples, any antenna positioned adjacent to, or near the back cover of the device, and/or the electromagnetically transparent portion 930 can be used as the sensing antenna.
At block 1210, an antenna of an electronic device, such as the sensing antennas 940, 1040, 1140 can be driven at one or more desired frequencies and using a desired power. The antenna can be driven by one or more operational components of the device that are in communication with the antenna component.
At block 1220, an efficiency, a level of performance, a level of tuning or detuning of the antenna, and/or a resonance or resonant frequency of the antenna can be measured at one or more locations on or in the electronic device, as described with respect to
At block 1230, a presence of a material at or near an exterior surface of the electronic device can be determined, at least partially, based on the measured efficiency and/or resonance. As described with respect to
At block 1310, an antenna of an electronic device, such as the sensing antennas 940, 1040, 1140 can be driven at one or more desired frequencies and using a desired power. The antenna can be driven by one or more operational components of the device that are in communication with the antenna component.
At block 1320, an efficiency, level of performance, level of tuning or detuning of the antenna, and/or a resonance or resonant frequency of the antenna can be measured at a first location on or in the electronic device, as described with respect to
At block 1330, an efficiency, level of performance, level of tuning or detuning of the antenna, and/or a resonance or resonant frequency of the antenna can be measured at a second, different location on or in the electronic device, as described with respect to
At block 1340, a presence of a material at or near an exterior surface of the electronic device can be determined at least partially based on the measured efficiency at the first location and/or the measure efficiency at the second location. As described with respect to
In some examples, one or more algorithms stored in the memory of the device can determine whether to determine the presence of the object based on the measured efficiency at the first location, at the second location, and/or by using a weighted combination of the first location and the second location. In some examples where a weight combination of the measured efficiency at the first and second locations is used, an algorithm can determine weights to assign to the efficiencies measured at the first and/or second location. In some examples, the weights can be between 0% and 100%. In some examples, a determination of whether to use the efficiency measured at the first location, at the second location, or a combination of efficiencies measured at the first and second locations, can be based on factors other than the measured efficiencies. These factors are not limited and can include the date or time, a geographical location, input or signals from one or more other sensors, a user input, and others. Additional sensing components and processes can similarly be included.
The device can include light emitting components 1466, 1468. In some examples, the light emitting components 1466, 1468 can include light emitting diodes (LEDs) that can emit light at one or more desired wavelengths. The device can also include light detecting components 1462, 1464 that can be designed and arranged to receive light that has been emitted by LEDs 1466, 1468, that has passed out of the device through the lens 1434 and electromagnetically transparent component 1432, and back into the device through the lens 1434 and electromagnetically transparent component 1432. In some examples, light blocking components, such as component 1436 can substantially optically isolate the LEDs 1466, 1468 from the detectors 1462, 1464 except along desired light paths. In some examples, the device can include a light directing component, or light control component 1463 disposed opposite one or both light detectors 1462, 1464. In some examples, the light control component 1463 can serve to allow only light incident on the light control component 1463 at a certain angle or range of angles to pass through, thereby serving as a filter.
The light paths from the LEDs 1466, 1468 to the detectors 1462, 1464 are shown. In some examples, light that is emitted from the LEDs 1466, 1468 and that passed into a user's body, and is then reflected back to the detectors 1462, 1464 can be used to determine one or more physiological and/or biological properties of the user. In some examples, however, the determination of the physiological and/or biological property can be based receiving light that has passed through desired depths of tissue. For example, light emitted from LED 1468 and received by detector 1464 can penetrate a certain depth, while light emitted from LED 1466 and received by detector 1464 can reach a different depth. Difficulties can arise, however, when these two light paths overlap within the user's tissue, potentially introducing noise and making it more difficult to distinguish whether light as been emitted from detector 1466 or 1468. Accordingly, it can be desirable to reduce an amount of overlap of light paths within the user's tissue.
In the example shown in
Accordingly, as shown in
In some examples, the light blocking component 1470 can take the form of a dot or circular portion of ink or other material that can be opaque to one or more desired wavelengths, or ranges of wavelengths of light. In some examples, the light blocking component 1470 can be opaque to visible light, that is light having wavelengths between about 380 nm and about 740 nm. In some examples, the light blocking component 1470 can be opaque to wavelengths of light emitted by the LEDs 1466, 1468. In some examples, the LEDs 1466, 1468 can emit green light and thus the light blocking component 1470 can be opaque to a range of wavelengths of light including green light. That is, in some examples, the light blocking component 1470 can be opaque to light including light having wavelengths between about 520 nm and about 560 nm. In some examples, the light blocking component 1470 can, in some examples, be transparent to one or more other wavelengths of light, so as not to affect the functionality of other sensors, emitters, and/or detectors of the device, such as those which might utilize infrared wavelengths, or light having wavelengths between about 740 nm and about 1 mm. In some examples, the ink or material of the light blocking component 1470 can have a thickness of about 15 microns or less, about 10 microns or less, about 7 microns or less, about 5 microns or less, or even about 2 microns or less. In some examples, the light blocking component 1470 can have a diameter or major dimension of about 10 mm or less, about 5 mm or less, about 4 mm or less, or even about 2 mm or less.
In some examples, the light blocking component 1470 can be deposited on the component 1432 by any combination of printing and/or deposition processes, such as a pad printing and/or one or more physical vapor deposition processes. In some examples, the surface of the component 1432 can be treated prior to forming the light blocking component 1470. For example, a layer of silicon dioxide can be deposited on the surface prior to forming the light blocking component 1470.
Any of the features or aspects of the devices and components discussed herein can be combined or included in any varied combination. For example, the design and shape of the components or devices is not limited in any way and can be formed by any number of processes, including those discussed herein. As used herein, the terms exterior, outer, interior, and inner are used for reference purposes only. An exterior or outer portion of a component can form a portion of an exterior surface of the component, but may not necessarily form the entire exterior of outer surface thereof. Similarly, the interior or inner portion of a component can form or define an interior or inner portion of the component, but can also form or define a portion of an exterior or outer surface of the component.
Various inventions have been described herein with reference to certain specific embodiments and examples. However, they will be recognized by those skilled in the art that many variations are possible without departing from the scope and spirit of the inventions disclosed herein, in that those inventions set forth in the claims below are intended to cover all variations and modifications of the inventions disclosed without departing from the spirit of the inventions. The terms “including:” and “having” come as used in the specification and claims shall have the same meaning as the term “including.”
To the extent applicable to the present technology, gathering and use of data available from various sources can be used to improve the delivery to users of invitational content or any other content that may be of interest to them. The present disclosure contemplates that in some instances, this gathered data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data can include demographic data, location-based data, telephone numbers, email addresses, TWITTER® ID's, home addresses, data or records relating to a user's health or level of fitness (e.g., vital signs measurements, medication information, exercise information), date of birth, or any other identifying or personal information.
The present disclosure recognizes that the use of such personal information data, in the present technology, can be used to the benefit of users. For example, the personal information data can be used to deliver targeted content that is of greater interest to the user. Accordingly, use of such personal information data enables users to calculated control of the delivered content. Further, other uses for personal information data that benefit the user are also contemplated by the present disclosure. For instance, health and fitness data may be used to provide insights into a user's general wellness, or may be used as positive feedback to individuals using technology to pursue wellness goals.
The present disclosure contemplates that the entities responsible for the collection, analysis, disclosure, transfer, storage, or other use of such personal information data will comply with well-established privacy policies and/or privacy practices. In particular, such entities should implement and consistently use privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining personal information data private and secure. Such policies should be easily accessible by users, and should be updated as the collection and/or use of data changes. Personal information from users should be collected for legitimate and reasonable uses of the entity and not shared or sold outside of those legitimate uses. Further, such collection/sharing should occur after receiving the informed consent of the users. Additionally, such entities should consider taking any needed steps for safeguarding and securing access to such personal information data and ensuring that others with access to the personal information data adhere to their privacy policies and procedures. Further, such entities can subject themselves to evaluation by third parties to certify their adherence to widely accepted privacy policies and practices. In addition, policies and practices should be adapted for the particular types of personal information data being collected and/or accessed and adapted to applicable laws and standards, including jurisdiction-specific considerations. For instance, in the US, collection of or access to certain health data may be governed by federal and/or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA); whereas health data in other countries may be subject to other regulations and policies and should be handled accordingly. Hence different privacy practices should be maintained for different personal data types in each country.
Despite the foregoing, the present disclosure also contemplates embodiments in which users selectively block the use of, or access to, personal information data. That is, the present disclosure contemplates that hardware and/or software elements can be provided to prevent or block access to such personal information data. For example, in the case of advertisement delivery services, the present technology can be configured to allow users to select to “opt in” or “opt out” of participation in the collection of personal information data during registration for services or anytime thereafter. In another example, users can select not to provide mood-associated data for targeted content delivery services. In yet another example, users can select to limit the length of time mood-associated data is maintained or entirely prohibit the development of a baseline mood profile. In addition to providing “opt in” and “opt out” options, the present disclosure contemplates providing notifications relating to the access or use of personal information. For instance, a user may be notified upon downloading an app that their personal information data will be accessed and then reminded again just before personal information data is accessed by the app.
Moreover, it is the intent of the present disclosure that personal information data should be managed and handled in a way to minimize risks of unintentional or unauthorized access or use. Risk can be minimized by limiting the collection of data and deleting data once it is no longer needed. In addition, and when applicable, including in certain health related applications, data de-identification can be used to protect a user's privacy. De-identification may be facilitated, when appropriate, by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of data stored (e.g., collecting location data a city level rather than at an address level), controlling how data is stored (e.g., aggregating data across users), and/or other methods.
Therefore, although the present disclosure broadly covers use of personal information data to implement one or more various disclosed embodiments, the present disclosure also contemplates that the various embodiments can also be implemented without the need for accessing such personal information data. That is, the various embodiments of the present technology are not rendered inoperable due to the lack of all or a portion of such personal information data. For example, content can be selected and delivered to users by inferring preferences based on non-personal information data or a bare minimum amount of personal information, such as the content being requested by the device associated with a user, other non-personal information available to the content delivery services, or publicly available information.
The foregoing description, for purposes of explanation, used specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the described embodiments. Thus, the foregoing descriptions of the specific embodiments described herein are presented for purposes of illustration and description. They are not target to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to one of ordinary skill in the art that many modifications and variations are possible in view of the above teachings.
This claims priority to U.S. Provisional Patent Application No. 63/037,961, filed 11 Jun. 2020, and entitled “ELECTRONIC DEVICE,” the entire disclosure of which is hereby incorporated by reference.
| Number | Name | Date | Kind |
|---|---|---|---|
| 2771734 | Ernest | Nov 1956 | A |
| 3040514 | Hyman | Jun 1962 | A |
| 3056030 | Kelchner | Sep 1962 | A |
| 3130539 | Davis | Apr 1964 | A |
| 3355873 | Ernest | Dec 1967 | A |
| 3495398 | Widmer et al. | Feb 1970 | A |
| 3621649 | Vulcan et al. | Nov 1971 | A |
| 4007347 | Haber | Feb 1977 | A |
| 4031341 | Wuthrich et al. | Jun 1977 | A |
| 4037068 | Gaynor | Jul 1977 | A |
| 4077200 | Schneider | Mar 1978 | A |
| 4133404 | Griffin | Jan 1979 | A |
| 4170104 | Yamagata | Oct 1979 | A |
| 4258096 | Lamarche | Mar 1981 | A |
| 4287400 | Kitik et al. | Sep 1981 | A |
| 4289400 | Kubota et al. | Sep 1981 | A |
| 4311990 | Burke | Jan 1982 | A |
| 4324956 | Sakakino et al. | Apr 1982 | A |
| 4345119 | Latasiewicz | Aug 1982 | A |
| 4364674 | Tesch | Dec 1982 | A |
| 4379642 | Meyrat | Apr 1983 | A |
| 4417824 | Paterson et al. | Nov 1983 | A |
| 4581509 | Sanford et al. | Apr 1986 | A |
| 4600316 | Besson | Jul 1986 | A |
| 4617461 | Subbarao et al. | Oct 1986 | A |
| 4641026 | Garcia, Jr. | Feb 1987 | A |
| 4670737 | Rilling | Jun 1987 | A |
| 4783772 | Umemoto et al. | Nov 1988 | A |
| 4884073 | Souloumiac | Nov 1989 | A |
| 4922070 | Dorinski | May 1990 | A |
| 4931794 | Haag et al. | Jun 1990 | A |
| 4952799 | Loewen | Aug 1990 | A |
| 4980658 | Miner et al. | Dec 1990 | A |
| 5034602 | Garcia, Jr. et al. | Jul 1991 | A |
| 5214278 | Banda | May 1993 | A |
| 5258592 | Nishikawa et al. | Nov 1993 | A |
| 5288993 | Bidiville et al. | Feb 1994 | A |
| 5347123 | Jackson et al. | Sep 1994 | A |
| 5383166 | Gallay | Jan 1995 | A |
| 5471054 | Watanabe | Nov 1995 | A |
| 5572314 | Hyman, Jr. et al. | Nov 1996 | A |
| 5583560 | Florin et al. | Dec 1996 | A |
| 5726645 | Kamon et al. | Mar 1998 | A |
| 5748111 | Bates | May 1998 | A |
| 5841050 | Clift et al. | Nov 1998 | A |
| 5847335 | Sugahara et al. | Dec 1998 | A |
| 5867082 | Van Zeeland | Feb 1999 | A |
| 5943233 | Ebina et al. | Aug 1999 | A |
| 5953001 | Challener et al. | Sep 1999 | A |
| 5963332 | Feldman et al. | Oct 1999 | A |
| 6069567 | Zawilski | May 2000 | A |
| 6134189 | Carrard | Oct 2000 | A |
| 6154201 | Levin et al. | Nov 2000 | A |
| 6175679 | Veligdan et al. | Jan 2001 | B1 |
| 6246050 | Tullis et al. | Jun 2001 | B1 |
| 6252825 | Perotto | Jun 2001 | B1 |
| 6304247 | Black | Oct 2001 | B1 |
| 6355891 | Ikunami | Mar 2002 | B1 |
| 6422740 | Leuenberger | Jul 2002 | B1 |
| 6477117 | Narayanaswami et al. | Nov 2002 | B1 |
| 6525278 | Villain et al. | Feb 2003 | B2 |
| 6556222 | Narayanaswami | Apr 2003 | B1 |
| 6641438 | Billman | Nov 2003 | B1 |
| 6646635 | Pogatetz et al. | Nov 2003 | B2 |
| 6661438 | Shiraishi et al. | Dec 2003 | B1 |
| 6672758 | Ehrsam et al. | Jan 2004 | B2 |
| 6794992 | Rogers | Sep 2004 | B1 |
| 6809275 | Cheng et al. | Oct 2004 | B1 |
| 6888076 | Hetherington | May 2005 | B2 |
| 6909378 | Lambrechts et al. | Jun 2005 | B1 |
| 6914551 | Vidal | Jul 2005 | B2 |
| 6961099 | Takano et al. | Nov 2005 | B2 |
| 6963039 | Weng et al. | Nov 2005 | B1 |
| 6964099 | Zeng | Nov 2005 | B1 |
| 6985107 | Anson et al. | Jan 2006 | B2 |
| 6987568 | Dana | Jan 2006 | B2 |
| 6998553 | Hisamune et al. | Feb 2006 | B2 |
| 7016263 | Gueissaz et al. | Mar 2006 | B2 |
| 7081905 | Raghunath | Jul 2006 | B1 |
| 7119289 | Lacroix | Oct 2006 | B2 |
| 7135673 | Saint | Nov 2006 | B2 |
| 7167083 | Giles | Jan 2007 | B2 |
| 7244927 | Huynh | Jul 2007 | B2 |
| 7265336 | Hataguchi et al. | Sep 2007 | B2 |
| 7274303 | Dresti et al. | Sep 2007 | B2 |
| 7358481 | Yeoh et al. | Apr 2008 | B2 |
| 7369308 | Tsuruta et al. | May 2008 | B2 |
| 7404667 | Born et al. | Jul 2008 | B2 |
| 7465917 | Chin et al. | Dec 2008 | B2 |
| 7520664 | Wai | Apr 2009 | B2 |
| 7528824 | Kong | May 2009 | B2 |
| 7545367 | Sunda et al. | Jun 2009 | B2 |
| 7593755 | Colando et al. | Sep 2009 | B2 |
| 7605846 | Watanabe | Oct 2009 | B2 |
| 7634263 | Louch et al. | Dec 2009 | B2 |
| 7646667 | Conley et al. | Jan 2010 | B2 |
| 7646677 | Nakamura | Jan 2010 | B2 |
| 7710456 | Koshiba | May 2010 | B2 |
| 7761246 | Matsui | Jul 2010 | B2 |
| 7763819 | Ieda et al. | Jul 2010 | B2 |
| 7772507 | Orr et al. | Aug 2010 | B2 |
| 7778115 | Ruchonnet | Aug 2010 | B2 |
| 7781726 | Matsui et al. | Aug 2010 | B2 |
| RE41637 | Ohara et al. | Sep 2010 | E |
| 7791597 | Silverstein et al. | Sep 2010 | B2 |
| 7856255 | Tsuchiya et al. | Dec 2010 | B2 |
| 7858583 | Schmidt, Jr. et al. | Dec 2010 | B2 |
| 7865324 | Lindberg et al. | Jan 2011 | B2 |
| 8063892 | Shahoian et al. | Nov 2011 | B2 |
| 8138488 | Grot | Mar 2012 | B2 |
| 8167126 | Stiehl | May 2012 | B2 |
| 8169402 | Shahoian et al. | May 2012 | B2 |
| 8188989 | Levin et al. | May 2012 | B2 |
| 8195313 | Fadell et al. | Jun 2012 | B1 |
| 8220987 | Kimura et al. | Jul 2012 | B2 |
| 8248815 | Yang et al. | Aug 2012 | B2 |
| 8263886 | Lin et al. | Sep 2012 | B2 |
| 8263889 | Takahashi et al. | Sep 2012 | B2 |
| 8305171 | Kimura et al. | Nov 2012 | B2 |
| 8312495 | Vanderhoff | Nov 2012 | B2 |
| 8368677 | Yamamoto | Feb 2013 | B2 |
| 8371745 | Manni | Feb 2013 | B2 |
| 8373661 | Lan et al. | Feb 2013 | B2 |
| 8410971 | Friedlander | Apr 2013 | B2 |
| 8432368 | Momeyer et al. | Apr 2013 | B2 |
| 8439559 | Luk et al. | May 2013 | B2 |
| 8441450 | Degner et al. | May 2013 | B2 |
| 8446713 | Lai | May 2013 | B2 |
| 8477118 | Lan et al. | Jul 2013 | B2 |
| 8493190 | Periquet et al. | Jul 2013 | B2 |
| 8525777 | Stavely et al. | Sep 2013 | B2 |
| 8568313 | Sadhu | Oct 2013 | B2 |
| 8576044 | Chapman | Nov 2013 | B2 |
| 8593598 | Chen et al. | Nov 2013 | B2 |
| 8614881 | Yoo | Dec 2013 | B2 |
| 8666682 | Lavigne et al. | Mar 2014 | B2 |
| 8704787 | Yamamoto et al. | Apr 2014 | B2 |
| 8711093 | Ong et al. | Apr 2014 | B2 |
| 8724087 | Van De Kerkhof et al. | May 2014 | B2 |
| 8730167 | Ming et al. | May 2014 | B2 |
| 8743088 | Watanabe | Jun 2014 | B2 |
| 8783944 | Doi | Jul 2014 | B2 |
| 8804993 | Shukla et al. | Aug 2014 | B2 |
| 8824245 | Lau et al. | Sep 2014 | B2 |
| 8847741 | Birnbaum et al. | Sep 2014 | B2 |
| 8859971 | Weber et al. | Oct 2014 | B2 |
| 8860674 | Lee et al. | Oct 2014 | B2 |
| 8863219 | Brown et al. | Oct 2014 | B2 |
| 8878657 | Periquet et al. | Nov 2014 | B2 |
| 8885856 | Sacha | Nov 2014 | B2 |
| 8895911 | Takahashi | Nov 2014 | B2 |
| 8920022 | Ishida et al. | Dec 2014 | B2 |
| 8922399 | Bajaj et al. | Dec 2014 | B2 |
| 8928452 | Kim et al. | Jan 2015 | B2 |
| 8994827 | Mistry et al. | Mar 2015 | B2 |
| 9024733 | Wouters | May 2015 | B2 |
| 9041663 | Westerman | May 2015 | B2 |
| 9086738 | Leung et al. | Jul 2015 | B2 |
| 9105413 | Hiranuma et al. | Aug 2015 | B2 |
| 9123483 | Ferri et al. | Sep 2015 | B2 |
| 9176598 | Sweetser et al. | Nov 2015 | B2 |
| 9213409 | Redelsheimer et al. | Dec 2015 | B2 |
| 9223296 | Yang et al. | Dec 2015 | B2 |
| 9449770 | Sanford et al. | Sep 2016 | B2 |
| 9829350 | Holenarsipur et al. | Nov 2017 | B2 |
| 10165694 | Werner et al. | Dec 2018 | B1 |
| 10732571 | Ely et al. | Aug 2020 | B2 |
| 11181863 | Ely et al. | Nov 2021 | B2 |
| 20010053109 | Ehrsam et al. | Dec 2001 | A1 |
| 20030160680 | Hisamune et al. | Aug 2003 | A1 |
| 20030174590 | Arikawa et al. | Sep 2003 | A1 |
| 20040082414 | Knox | Apr 2004 | A1 |
| 20050075558 | Vecerina et al. | Apr 2005 | A1 |
| 20050164623 | Huynh | Jul 2005 | A1 |
| 20060250377 | Zadesky et al. | Nov 2006 | A1 |
| 20070013775 | Shin | Jan 2007 | A1 |
| 20070050054 | Sambandam et al. | Mar 2007 | A1 |
| 20070122076 | Ishiyama et al. | May 2007 | A1 |
| 20070124772 | Bennett et al. | May 2007 | A1 |
| 20070211042 | Kim et al. | Sep 2007 | A1 |
| 20070222756 | Wu et al. | Sep 2007 | A1 |
| 20070229671 | Takeshita et al. | Oct 2007 | A1 |
| 20070247421 | Orsley et al. | Oct 2007 | A1 |
| 20080067050 | Ieda et al. | Mar 2008 | A1 |
| 20080097221 | Florian | Apr 2008 | A1 |
| 20080130914 | Cho | Jun 2008 | A1 |
| 20080297372 | Wouters | Dec 2008 | A1 |
| 20090051649 | Rondel | Feb 2009 | A1 |
| 20090073119 | Phan et al. | Mar 2009 | A1 |
| 20090146975 | Chang | Jun 2009 | A1 |
| 20090152452 | Lee et al. | Jun 2009 | A1 |
| 20090217207 | Kagermeier et al. | Aug 2009 | A1 |
| 20090285443 | Camp, Jr. et al. | Nov 2009 | A1 |
| 20090312051 | Hansson et al. | Dec 2009 | A1 |
| 20090322583 | Reams et al. | Dec 2009 | A1 |
| 20100033430 | Kakutani et al. | Feb 2010 | A1 |
| 20100053468 | Harvill | Mar 2010 | A1 |
| 20100081375 | Rosenblatt et al. | Apr 2010 | A1 |
| 20100149099 | Elias | Jun 2010 | A1 |
| 20100187074 | Manni | Jul 2010 | A1 |
| 20110007468 | Burton et al. | Jan 2011 | A1 |
| 20110037609 | Kim et al. | Feb 2011 | A1 |
| 20110090148 | Li et al. | Apr 2011 | A1 |
| 20110235471 | Luk et al. | Sep 2011 | A1 |
| 20120041925 | Pope et al. | Feb 2012 | A1 |
| 20120067711 | Yang | Mar 2012 | A1 |
| 20120068833 | Rothkopf et al. | Mar 2012 | A1 |
| 20120068857 | Rothkopf et al. | Mar 2012 | A1 |
| 20120075082 | Rothkopf et al. | Mar 2012 | A1 |
| 20120106063 | Mathew | May 2012 | A1 |
| 20120112859 | Park et al. | May 2012 | A1 |
| 20120113044 | Strazisar et al. | May 2012 | A1 |
| 20120206248 | Biggs | Aug 2012 | A1 |
| 20130001724 | Masuda | Jan 2013 | A1 |
| 20130037396 | Yu | Feb 2013 | A1 |
| 20130087443 | Kikuchi | Apr 2013 | A1 |
| 20130163395 | Ferri et al. | Jun 2013 | A1 |
| 20130215724 | Hiranuma et al. | Aug 2013 | A1 |
| 20140071050 | Armstrong-muntner | Mar 2014 | A1 |
| 20140071098 | You et al. | Mar 2014 | A1 |
| 20140132516 | Tsai et al. | May 2014 | A1 |
| 20140197936 | Biggs et al. | Jul 2014 | A1 |
| 20140275850 | Venkatraman | Sep 2014 | A1 |
| 20140327630 | Burr et al. | Nov 2014 | A1 |
| 20140340318 | Stringer | Nov 2014 | A1 |
| 20150041289 | Ely | Feb 2015 | A1 |
| 20150070794 | Wu | Mar 2015 | A1 |
| 20150130005 | Ko | May 2015 | A1 |
| 20150168178 | Hoover et al. | Jun 2015 | A1 |
| 20150221460 | Teplitxky et al. | Aug 2015 | A1 |
| 20150227217 | Fukumoto | Aug 2015 | A1 |
| 20150341031 | Marquas et al. | Nov 2015 | A1 |
| 20160054813 | Schediwy et al. | Feb 2016 | A1 |
| 20160056194 | Rudmann | Feb 2016 | A1 |
| 20160058375 | Rothkopf | Mar 2016 | A1 |
| 20160061636 | Gowreesunker et al. | Mar 2016 | A1 |
| 20160072177 | Sharma | Mar 2016 | A1 |
| 20160098016 | Ely et al. | Apr 2016 | A1 |
| 20160240721 | Chu | Aug 2016 | A1 |
| 20160258784 | Boonsom et al. | Sep 2016 | A1 |
| 20160306437 | Zhang et al. | Oct 2016 | A1 |
| 20160313703 | Ely et al. | Oct 2016 | A1 |
| 20160327911 | Eim et al. | Nov 2016 | A1 |
| 20160378069 | Rothkopf | Dec 2016 | A1 |
| 20160378070 | Rothkopf | Dec 2016 | A1 |
| 20160378072 | Ely et al. | Dec 2016 | A1 |
| 20160378081 | Della Corte et al. | Dec 2016 | A1 |
| 20170003655 | Ely | Jan 2017 | A1 |
| 20170010751 | Shedletsky et al. | Jan 2017 | A1 |
| 20170011873 | Ely et al. | Jan 2017 | A1 |
| 20170045958 | Battlogg | Feb 2017 | A1 |
| 20170069443 | Wang et al. | Mar 2017 | A1 |
| 20170069444 | Wang et al. | Mar 2017 | A1 |
| 20170069447 | Wang et al. | Mar 2017 | A1 |
| 20190079452 | Hiemstra et al. | Mar 2019 | A1 |
| 20190198547 | Yoshigiwa | Jun 2019 | A1 |
| 20190227597 | Kim | Jul 2019 | A1 |
| Number | Date | Country |
|---|---|---|
| 1445627 | Oct 2003 | CN |
| 1624427 | Jun 2005 | CN |
| 103191557 | Jul 2013 | CN |
| 103645804 | Mar 2014 | CN |
| 103852090 | Jun 2014 | CN |
| 103956006 | Jul 2014 | CN |
| 203732900 | Jul 2014 | CN |
| 103995456 | Aug 2014 | CN |
| 203941395 | Nov 2014 | CN |
| 105096979 | Nov 2015 | CN |
| 105547146 | May 2016 | CN |
| 102008023651 | Nov 2009 | DE |
| 0556155 | Aug 1993 | EP |
| 1345095 | Sep 2003 | EP |
| 1669724 | Jun 2006 | EP |
| 2375295 | Oct 2011 | EP |
| 2720129 | Apr 2014 | EP |
| 2030093 | Oct 1970 | FR |
| 2801402 | May 2001 | FR |
| 2433211 | Jun 2007 | GB |
| S5734457 | Feb 1982 | JP |
| H05203465 | Aug 1993 | JP |
| 2001202178 | Jul 2001 | JP |
| 2003151410 | May 2003 | JP |
| 2003331693 | Nov 2003 | JP |
| 2004184396 | Jul 2004 | JP |
| 2007311153 | Nov 2007 | JP |
| 2008053980 | Mar 2008 | JP |
| 2008122377 | May 2008 | JP |
| 2008235226 | Oct 2008 | JP |
| 2010186572 | Aug 2010 | JP |
| 2011165468 | Aug 2011 | JP |
| 20080045397 | May 2008 | KR |
| 1040225 | Nov 2014 | NL |
| 0122038 | Mar 2001 | WO |
| 0169567 | Sep 2001 | WO |
| 2010058376 | May 2010 | WO |
| 2012083380 | Jun 2012 | WO |
| 2014018118 | Jan 2014 | WO |
| 2015147756 | Oct 2015 | WO |
| Entry |
|---|
| International Search Report and Written Opinion, PCT/US2013/045264, dated Mar. 25, 2014, 10 pages. |
| International Search Report and Written Opinion for PCT/US2014/050358, dated Nov. 10, 2014, 10 pages. |
| International Search Report and Written Opinion, PCT/US2014/040728, dated Oct. 15, 2014, 14 pages. |
| Author Unknown, ““mHealth””, http://mhealth.vesag.com/?m=201012, Dec. 23, 2010, 7 pages. |
| Author Unknown, “DeskThorityNet, Optical Switch Keyboards”, http://deskthority.net/keyboards-f2/optical-switch-keyboards-t1474.html, Jul. 11, 2015, 22 pages. |
| Author Unknown, “How Vesag Helps Kids Women and Visitors”, http://www.sooperarticles.com/health-fitness-articles/children-health-articles/how-vesag-helps-kids-women-visitors-218542.html, 2 pages, at least as early as May 20, 2015. |
| Author Unknown, “Re iPhone Universal Remote Control—Infrared Remote Control Accessory for iPhone and iPod Touch”, http://www.amazon.com/iPhone-Universal-Remote-Control-Accessory/dp/tech-data/B0038Z4, at least as early as Jul. 15, 2010, 2 pages. |
| Author Unknown, “RedEye mini Plug-in Universal Remote for iPhone, iPodtouch and iPad”, Amazon.com, date unknown, 4 pages. |
| Author Unknown, “Vesag Wrist Watch for Dementia Care from VYZIN”, http://vyasa-kaaranam-ketkadey.blogspot.com/2011/03/vesag-wrist-watch-for-dementia-care.html, Mar. 31, 2011, 2 pages. |
| Author Unknown, “Vyzin Electronics Private Limited launches “Vesag Watch.””, http://www.virtualpressoffice.com/showJointPage.do?page=jp&showld=1544, Jan. 6, 2011, 5 pages. |
| Author Unknown, “Vyzin Unveiled Personal Emergency Response System (PERS) with Remote Health Monitoring That Can Be Used for Entire Family”, http://www.24-7pressrelease.com/press-release/vyzin-unveiled-personal-emergency-response-system-pers-with-remote-health-monitoring-that-can-be-used-for-entire-family-219317.php, Jun. 17, 2011, 2 pages. |
| Epstein, et al., “Economical, High-Performance Optical Encoders”, Hewlett-Packard Journal, Oct. 1988, pp. 99-106. |
| Greyb, “Google Watch: Convert your arm into a keyboard”, http://www.whatafuture.eom/2014/02/28/google-smartwatch/#sthash.Yk35cDXK.dpbs, Feb. 28, 2014, 3 pages. |
| IBM, “Additional Functionality Added to Cell Phone via “Learning” Function Button”, www.ip.com, Feb. 21, 2007, 2 pages. |
| Kim, Joseph,“2010 mHealth Summit Emerges as Major One-Stop U.S. Venue for Mobile Health”, http://www.medicineandtechnology.com/2010/08/2010-mhealth-summit-emerges-as-major.html, Aug. 26, 2010, 3 pages. |
| Krishnan, et al., “A Miniature Surface Mount Reflective Optical Shaft Encoder”, Hewlett-Packard Journal, Article 8, Dec. 1996, pp. 1-6. |
| Rick, “How VESAG Helps Health Conscious Citizens”, http://sensetekgroup.com/2010/11/29/wireless-health-monitoring-system/, Nov. 29, 2010, 2 pages. |
| Sadhu, Rajendra, “How VESAG Helps People Who Want to ‘Be There’?”, http://ezinearticles.com/?How-Vesag-Helps-People-Who-Want-to-Be-There?&id-5423873, Nov. 22, 2010, 1 page. |
| Sadhu, Rajendra, “Mobile Innovation Helps Dementia and Alzheimer's Patients”, http;//www.itnewsafrica.com/2010/11/mobile-innovation-helps-dementia-andalzheimer%E2%80%99s-patients/, Nov. 22, 2010, 3 pages. |
| Tran, et al., “Universal Programmable Remote Control/Telephone”, www.ip.com, May 1, 1992, 2 pages. |
| Number | Date | Country | |
|---|---|---|---|
| 20210389798 A1 | Dec 2021 | US |
| Number | Date | Country | |
|---|---|---|---|
| 63037961 | Jun 2020 | US |
