Claims
- 1. A process for producing an electrostatic chucking device comprising:
- forming a metal layer on one face of a heat resistant film using a depositing or plating method;
- forming an electrode layer by providing a photoresist layer on the surface of the metal layer, and carrying out pattern exposure, development, and etching processes;
- forming a laminated sheet by forming a semi-cured adhesive layer on the surface of the electrode layer using an adhesive;
- punching the laminated sheet according to the shape of a metal base; adhering the punched laminated sheet on the metal base by placing the semi-cured adhesive layer in contact with the metal base; and
- curing the semi-cured adhesive layer to form a laminated product.
- 2. A process for producing an electrostatic chucking device according to claim 1, wherein said semi-cured adhesive layer is formed by applying the adhesive to the surface of the electrode layer.
- 3. A process for producing an electrostatic chucking device according to claim 1, wherein said semi-cured adhesive layer is formed by forming the adhesive into a sheet of semi-cured adhesive and laminating the sheet on a surface of a releasing film.
- 4. A process for producing an electrostatic chucking device according to claim 1, wherein said adhesive exhibits adhesion with respect to three different materials.
- 5. A process for producing an electrostatic chucking device according to claim 4, wherein said three different materials are respectively included in an electric insulating layer, and electrode layer and a metal layer.
- 6. A process for producing an electrostatic chucking device according to claim 1, wherein said adhesive is one of a thermosetting adhesive, a two-liquid ingredient system curable adhesive, and a thermoplastic adhesive.
Priority Claims (1)
Number |
Date |
Country |
Kind |
6-311335 |
Nov 1994 |
JPX |
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Parent Case Info
This application is a division of application Ser. No. 08/561,731 filed Nov. 22, 1995 now U.S. Pat. No. 5,645,921.
US Referenced Citations (11)
Foreign Referenced Citations (1)
Number |
Date |
Country |
5-87177 |
Dec 1993 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
561731 |
Nov 1995 |
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