Claims
- 1. An electrostatic chuck comprising:
a) a chuck body having a chucking surface; b) a film electrode embedded in the chuck body; and c) a dielectric layer having an essentially uniform thickness between the film electrode and the chucking surface.
- 2. The electrostatic chuck of claim 1 wherein thickness of the dielectric layer has a variation expressed as a range which is smaller than about 700 microns.
- 3. The electrostatic chuck of claim 1 wherein thickness of the dielectric layer has a variation expressed as a standard deviation which is less than about 160 microns.
- 4. The electrostatic chuck of claim 1 wherein the dielectric layer has a thickness ranging from about 50 microns to about 5000 microns.
- 5. The electrostatic chuck of claim 1 wherein the chuck body includes aluminum nitride.
- 6. The electrostatic chuck of claim 1 wherein the film electrode includes a metal selected form the group consisting of molybdenum, tungsten and any combination thereof.
- 7. The electrostatic chuck of claim 1 wherein the film electrode has a thickness ranging from about 50 microns to about 250 microns.
- 8. The electrostatic chuck of claim 1 wherein the film electrode is a screen printed electrode.
- 9. A method of producing an electrostatic chuck comprising the steps of:
a) screen printing a film electrode onto a surface of a sintered substrate; b) forming a green ceramic layer onto and overlaying the film electrode; and c) sintering the green ceramic layer under pressure, thereby forming the electrostatic chuck.
- 10. The method of claim 9 wherein the sintered substrate includes aluminum nitride.
- 11. The method of claim 9 wherein the green ceramic layer includes aluminum nitride.
- 12. The method of claim 1 wherein the film electrode includes a first metal selected form the group consisting of molybdenum, tungsten and any combination thereof.
- 13. The method of claim 12 wherein the film electrode further includes a second metal selected from the group consisting of nickel, cobalt and any combination thereof.
- 14. The method of claim 13 wherein the second metal is essentially dissolved in the first metal.
- 15. The method of claim 9 wherein screen printing includes silk screening glass-free conductive pastes.
- 16. The method of claim 9 wherein agglomerates are removed prior to forming the green ceramic layer.
- 17. The method of claim 9 wherein the green ceramic layer is evenly distributed onto the film electrode.
- 18. The method of claim 9 wherein hot pressing is in an inert atmosphere.
- 19. The method of claim 9 further including heat treating in an atmosphere consisting essentially of argon.
- 20. An electrostatic chuck produced by a method comprising the steps of:
a) screen printing a film electrode onto a surface of a sintered substrate; b) forming a green ceramic layer onto and overlaying the film electrode; and c) sintering the green ceramic layer under pressure, thereby forming the electrostatic chuck.
- 21. A method of producing an electrostatic chuck comprising the steps of:
a) depositing a film electrode by a process selected from the group consisting of chemical vapor deposition and physical vapor deposition onto a surface of a sintered substrate; b) forming a green ceramic layer onto and overlaying the film electrode; and c) sintering the green ceramic layer under pressure, thereby forming the electrostatic chuck.
- 22. An electrostatic chuck produced by the method of claim 21.
- 23. A method of producing an electrostatic chuck comprising the steps of:
(a) screen printing a film electrode onto a surface of a sintered substrate, wherein the film electrode includes a first metal and a second metal, all the second metal being essentially dissolved in the first metal; (b) forming a green ceramic layer onto and overlaying the film electrode; and (c) sintering the green ceramic layer under pressure, thereby forming the electrostatic chuck.
RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional Application No.: 60/169,859, filed Dec. 9, 1999, the entire teachings of which are incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60169859 |
Dec 1999 |
US |