Claims
- 1. A method of fabricating a thermal management device, comprising the steps of:
a) using a solid-state consolidation process to deposit a plurality of first material layers exhibiting a relatively high degree of thermal conductivity; and b) separating the first material layers with a different, second material having a desired physical property.
- 2. The method of claim 1, wherein the desired physical property is a relatively high coefficient of thermal expansion.
- 3. The method of claim 1, wherein the second material is air.
- 4. The method of claim 1, wherein the first material is copper.
- 5. The method of claim 1, wherein the first material is aluminum.
- 6. The method of claim 1, wherein the first material is in the form of a mesh or screen.
- 7. The method of claim 1, wherein the second material is molybdenum.
- 8. The method of claim 1, wherein the second material is Kovar.
- 9. The method of claim 1, wherein the solid-state consolidation process is an ultrasonic consolidation process.
- 10. The method of claim 1, wherein the solid-state consolidation process includes electrical resistance consolidation.
- 11. The method of claim 1, wherein the solid-state consolidation process includes frictional consolidation.
- 12. A thermal management device fabricated in accordance with the method of claim 1.
- 13. A thermal management device fabricated in accordance with the method of claim 2.
- 14. A thermal management device fabricated in accordance with the method of claim 3.
- 15. A thermal management device fabricated in accordance with the method of claim 4.
- 16. A thermal management device fabricated in accordance with the method of claim 5.
- 17. A thermal management device fabricated in accordance with the method of claim 6.
- 18. A thermal management device fabricated in accordance with the method of claim 7.
- 19. A thermal management device fabricated in accordance with the method of claim 8.
- 20. A thermal management device fabricated in accordance with the method of claim 9.
- 21. A thermal management device fabricated in accordance with the method of claim 10.
- 22. A thermal management device fabricated in accordance with the method of claim 11.
- 23. The method of claim 1, wherein the material layers form a cooling channel.
- 24. The method of claim 1, furthering including the addition of wicking material.
- 25. The method of claim 1, furthering including the step of embedding a sensor into the device.
- 26. The method of claim 1, furthering including the step of embedding a fan, heat pump, or other active device to increase heat dissipation rate into the device.
- 27. The method of claim 1, wherein the material layers form a thermal bus.
REFERENCE TO RELATED APPLICATION
[0001] This application claims priority from U.S. Provisional Patent Application Serial No. 60/399,222, filed Jul. 29, 2002, the entire content of which is incorporated herein by reference.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60399222 |
Jul 2002 |
US |