Patent Application
20180117674
Additive manufacturing (AM), also known as 3D printing or powder bed fusion printing, refers to the various processes used to synthesize a three-dimensional object from metallic powders. In additive manufacturing, successive layers of material are added or formed under computer control to create an object. A print head moves across the work surface depositing a very thin layer of powder which is then selectively fused to the layer below via an overhead power source, such as a laser, to form components layer-by-layer. The work surface retracts and the process repeats. Additive manufacturing printers are capable of printing novel geometries not possible via traditional methods of manufacturing.
Currently, there are several limitations to additive manufacturing. Most additive manufacturing printers can only print with one material at a time. Powder bed fusion printers cannot print overhangs, or objects directly supported from layers, and internal cavities are typically filled with powder. Integration of different alloys, foreign parts, items, or bodies cannot be printed into an additive manufacturing part where the alloy is required for desired material, mechanical, or electrical properties. In certain instances, a foreign part, item, or body needs to be placed within an item. This foreign part, item, or body may be, but without limitation, a sensor, an alloy, of any other type of foreign part, item, body, or material.
The present invention is directed to with the needs enumerated above and below.
The present invention is directed to a method for eutectic alloy bonding of foreign parts or items during the additive manufacturing process, which includes the following steps: designing a component for additive manufacturing which will include a foreign part such that the foreign part is bonded to the component via an eutectic alloy solder and disposed within a recess; starting to print the component using an additive manufacturing printer; stopping the additive manufacturing printer at a point where the foreign part and the eutectic alloy solder will be placed; placing the foreign part and solder into the recess; restarting the additive manufacturing printer such that the component is completed; and, heat treating the completed component such that the eutectic alloy solder forms a secure bond between the foreign part and the printed component. The foreign part is thus secured during the cooling phase of the heat treat process, permitting relief of internal stresses within the host component (during heat treat) without sacrificing structural integrity of the foreign part.
It is a feature of the present invention to provide a method for eutectic alloy bonding of foreign parts or items during the additive manufacturing process where a foreign part or item may be integrated into an additive manufactured component.
It is a feature of the present invention to provide a method for eutectic alloy bonding of foreign parts or items during the additive manufacturing process which allows integration of different materials within the additive manufactured component.
It is a feature of the present invention to provide a method for eutectic alloy bonding of foreign parts or items during the additive manufacturing process that secures foreign parts within a component manufactured using additive manufacturing.
it is a feature of the present invention to provide a method for eutectic alloy bonding of foreign parts or items during the additive manufacturing process that secures an embedded part or item within an additive manufactured component.
These and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims, and accompanying drawings wherein:
The preferred embodiments of the present invention are illustrated by way of example below and in
In the description of the present invention, the invention will be discussed in a powder bed fusion printing environment; however, this invention can be utilized for any type of application that requires use of a bond in the additive manufacturing process.
The method described herein utilizes additive manufacturing in order to produce a final component 100. The preferred additive manufacturing printer is a Direction Metal Laser Sintering (DMSL) Printer; however, any additive manufacturing printer or the equivalent may be utilized.
The preferred component material (the additive manufacture material) used to print the component 100 and act as a substrate material is 4340 steel powder, though any material that is suitable for additive manufacturing can be used.
The preferred solder material is eutectic 63%/37% Pb-Sn. However, any alloy or solder material may be utilized, so long as the alloy is eutectic and has a melting temperature below the stress relief temperature of the substrate material or component material, and/or lower than the melting point of the substrate material or component material.
The foreign part 400 is installed in-situ during the additive manufacturing process. In operation, the additive manufacturing printer is stopped at the point where the foreign part 400 will be placed.
In one of the preferred embodiments, the eutectic alloy solder 300 permits rigid bonding of the foreign part 400 during ambient conditions but is designed in such a way to melt in certain use conditions so as to act as a mechanical indicator of sorts. (e.g.: fuse/recalibration or repair of internal sensors/thermal switch). Additionally, the eutectic alloy solder 300 may be oriented in such a way as to solidify in a specific manner during the heat treat process (which may be different than the orientation during the additive manufacturing process) and remain solid during ambient conditions.
When introducing elements of the present invention or the preferred embodiment(s) thereof; the articles “a,” “an,” “the,” and “said” are intended to mean there are one or more of the elements. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements.
Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the preferred embodiment(s) contained herein.
The invention described herein may be manufactured and used by or for the Government of the United States of America for governmental purposes without payment of any royalties thereon or therefor.
