Pb as the principal constituent

Industry

CPC
B23K35/268

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

Current Industry

B23K35/268Pb as the principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Co-production of lead and tin products
- Patent number 12,060,626
- Issue date Aug 13, 2024
- METALLO BELGIUM
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder and method for producing high purity lead
- Patent number 11,992,903
- Issue date May 28, 2024
- METALLO BELGIUM
- Koen Govaerts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder and method for producing high purity lead
- Patent number 11,839,938
- Issue date Dec 12, 2023
- METALLO BELGIUM
- Koen Govaerts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pyrorefining process
- Patent number 11,827,953
- Issue date Nov 28, 2023
- METALLO BELGIUM
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper production process
- Patent number 11,739,394
- Issue date Aug 29, 2023
- METALLO BELGIUM
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,615,145
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coated solder material and method for producing same
- Patent number 10,512,988
- Issue date Dec 24, 2019
- Sumitomo Metal Mining Co., Ltd.
- Hiroshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High quality, void and inclusion free alloy wire
- Patent number 10,421,161
- Issue date Sep 24, 2019
- Honeywell International Inc.
- Younes Sina
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free eutectic solder alloy comprising zinc as the main compone...
- Patent number 10,399,186
- Issue date Sep 3, 2019
- Heraeus Materials Singapore Pte., Ltd.
- Wei Chih Pan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stick electrode
- Patent number 10,279,435
- Issue date May 7, 2019
- Lincoln Global, Inc.
- Joseph Kenneth Zalokar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with flux reservoir
- Patent number 10,085,338
- Issue date Sep 25, 2018
- Seagate Technology LLC
- Kwang Hoon Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead solder joint structure and manufacturing method thereof
- Patent number 9,877,399
- Issue date Jan 23, 2018
- NEC SPACE TECHNOLOGIES, LTD.
- Bunsuke Ogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass comprising molybdenum and lead in a solar cell paste
- Patent number 9,722,102
- Issue date Aug 1, 2017
- Heraeus Precious Metals North America Conshohocken LLC
- Devidas Raskar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Toughened solder for downhole applications, methods of manufacture...
- Patent number 9,707,642
- Issue date Jul 18, 2017
- Baker Hughes Incorporated
- David Peter Gerrard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adaptive interposer and electronic apparatus
- Patent number 9,706,662
- Issue date Jul 11, 2017
- Raytheon Company
- Tse E. Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metal bonding layer and method of manufacturing s...
- Patent number 9,676,047
- Issue date Jun 13, 2017
- Samsung Electronics Co., Ltd.
- Yung Ho Ryu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered solder material for bonding different species of electrodes...
- Patent number 9,669,493
- Issue date Jun 6, 2017
- Senju Metal Industry Co., Ltd.
- Koji Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of refining solder materials
- Patent number 9,666,547
- Issue date May 30, 2017
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste composition and semiconductor devices made therefrom
- Patent number 9,640,675
- Issue date May 2, 2017
- E I du Pont de Nemours and Company
- Kenneth Warren Hang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive compositions comprising non-eutectic solder...
- Patent number 9,005,330
- Issue date Apr 14, 2015
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder connection structure and solder ball
- Patent number 8,975,757
- Issue date Mar 10, 2015
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste composition and semiconductor devices made therefrom
- Patent number 8,900,487
- Issue date Dec 2, 2014
- E I du Pont de Nemours and Company
- Kenneth Warren Hang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode assembly for the removal of surface oxides by electron at...
- Patent number 8,617,352
- Issue date Dec 31, 2013
- Air Products and Chemicals, Inc.
- Chun Christine Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for conductively connecting a component on a transparent sub...
- Patent number 8,484,837
- Issue date Jul 16, 2013
- Schott AG
- Andreas Nickut
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally decomposable polymer coated metal powders
- Patent number 8,486,498
- Issue date Jul 16, 2013
- Henkel Corporation
- Puwei Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removal of surface oxides by electron attachment
- Patent number 8,361,340
- Issue date Jan 29, 2013
- Air Products and Chemicals, Inc.
- Chun Christine Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
JOINING OF LEAD AND LEAD ALLOYS
- Publication number 20230256532
- Publication date Aug 17, 2023
- LEAD TECHNOLOGIES LIMITED
- Ian Crabbe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE QUENCH PROTECTION TECHNIQUES FOR NON-INSULATED SUPERCONDUCT...
- Publication number 20230146164
- Publication date May 11, 2023
- Massachusetts Institute of Technology
- Brian LABOMBARD
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER AND METHOD FOR PRODUCING HIGH PURITY LEAD
- Publication number 20220203482
- Publication date Jun 30, 2022
- Metallo Belgium
- Koen Govaerts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVED CO-PRODUCTION OF LEAD AND TIN PRODUCTS
- Publication number 20220064760
- Publication date Mar 3, 2022
- Metallo Belgium
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVED COPPER PRODUCTION PROCESS
- Publication number 20210172039
- Publication date Jun 10, 2021
- Metallo Belgium
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20210118843
- Publication date Apr 22, 2021
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVED PYROREFINING PROCESS
- Publication number 20200392604
- Publication date Dec 17, 2020
- Metallo Belgium
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MAN...
- Publication number 20200346293
- Publication date Nov 5, 2020
- HORACIO RAFART E HIJOS SPA.
- Horacio RAFART MOUTHON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200243480
- Publication date Jul 30, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200219841
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVED SOLDER AND METHOD FOR PRODUCING HIGH PURITY LEAD
- Publication number 20200023473
- Publication date Jan 23, 2020
- Metallo Belgium
- Koen Govaerts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20190035764
- Publication date Jan 31, 2019
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180318968
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180318969
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Eutectic Alloy Bonding for Foreign Parts or Items During the Additi...
- Publication number 20180117674
- Publication date May 3, 2018
- United States of America as represented by the Secretary of the Navy
- Nicholas Cavaliere
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
COATED SOLDER WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170348807
- Publication date Dec 7, 2017
- Sumitomo Metal Mining Co., Ltd.
- Hiroshi KOBAYASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH QUALITY, VOID AND INCLUSION FREE ALLOY WIRE
- Publication number 20170320172
- Publication date Nov 9, 2017
- HONEYWELL INTERNATIONAL INC.
- Younes Sina
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LASER MANUFACTURING OF SOLDER PREFORMS
- Publication number 20170239756
- Publication date Aug 24, 2017
- Materion Corporation
- Ramesh Kothandapani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170202539
- Publication date Jul 20, 2017
- SAMSUNG MEDISON CO., LTD.
- Young-il KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COATED SOLDER MATERIAL AND METHOD FOR PRODUCING SAME
- Publication number 20170100802
- Publication date Apr 13, 2017
- Sumitomo Metal Mining Co., Ltd.
- Hiroshi KOBAYASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD WITH FLUX RESERVOIR
- Publication number 20170094782
- Publication date Mar 30, 2017
- Seagate Technology LLC
- Kwang Hoon Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTIVE INTERPOSER AND ELECTRONIC APPARATUS
- Publication number 20170006705
- Publication date Jan 5, 2017
- Tse E. Wong
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
STICK ELECTRODE
- Publication number 20150360325
- Publication date Dec 17, 2015
- LINCOLN GLOBAL, INC.
- Joseph Kenneth Zalokar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METH...
- Publication number 20150314396
- Publication date Nov 5, 2015
- SENJU METAL INDUSTRY CO., LTD
- Koji WATANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
SOLDER ALLOY
- Publication number 20150196978
- Publication date Jul 16, 2015
- Sumitomo Metal Mining Co., Ltd.
- Takashi Iseki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...
- Publication number 20140273318
- Publication date Sep 18, 2014
- Samsung Electronics Co., Ltd.
- Yung Ho RYU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUGHENED SOLDER FOR DOWNHOLE APPLICATIONS, METHODS OF MANUFACTURE...
- Publication number 20140158255
- Publication date Jun 12, 2014
- BAKER HUGHES INCORPORATED
- David Peter Gerrard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE COMPOSITIONS COMPRISING NON-EUTECTIC SOLDER...
- Publication number 20140042212
- Publication date Feb 13, 2014
- ORMET CIRCUITS, INC.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREFROM
- Publication number 20130068290
- Publication date Mar 21, 2013
- E I DU PONT DE NEMOURS AND COMPANY
- KENNETH WARREN HANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BONDED BODY, METHOD OF PRODUCING SOLDER BONDED BODY, ELEMENT...
- Publication number 20130042912
- Publication date Feb 21, 2013
- Hitachi Chemical Company, Ltd.
- Yoshiaki KURIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Pb as the principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Co-production of lead and tin products

Solder and method for producing high purity lead

Solder and method for producing high purity lead

Pyrorefining process

Copper production process

Soldering a conductor to an aluminum metallization

Alternative compositions for high temperature soldering applications

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Coated solder material and method for producing same

High quality, void and inclusion free alloy wire

Lead-free eutectic solder alloy comprising zinc as the main compone...

Stick electrode

Printed circuit board with flux reservoir

Lead solder joint structure and manufacturing method thereof

Glass comprising molybdenum and lead in a solar cell paste

Toughened solder for downhole applications, methods of manufacture...

Adaptive interposer and electronic apparatus

Method of forming metal bonding layer and method of manufacturing s...

Layered solder material for bonding different species of electrodes...

Method of refining solder materials

Conductive paste composition and semiconductor devices made therefrom

Electrically conductive compositions comprising non-eutectic solder...

Lead-free solder connection structure and solder ball

Conductive paste composition and semiconductor devices made therefrom

Electrode assembly for the removal of surface oxides by electron at...

Method for conductively connecting a component on a transparent sub...

Thermally decomposable polymer coated metal powders

Removal of surface oxides by electron attachment

Patents Applicationslast 30 patents

JOINING OF LEAD AND LEAD ALLOYS

PASSIVE QUENCH PROTECTION TECHNIQUES FOR NON-INSULATED SUPERCONDUCT...

SOLDER AND METHOD FOR PRODUCING HIGH PURITY LEAD

IMPROVED CO-PRODUCTION OF LEAD AND TIN PRODUCTS

IMPROVED COPPER PRODUCTION PROCESS

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

IMPROVED PYROREFINING PROCESS

PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MAN...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

IMPROVED SOLDER AND METHOD FOR PRODUCING HIGH PURITY LEAD

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

Solder for Limiting Substrate Damage Due to Discrete Failure

Solder for Limiting Substrate Damage Due to Discrete Failure

Eutectic Alloy Bonding for Foreign Parts or Items During the Additi...

COATED SOLDER WIRE AND METHOD FOR MANUFACTURING SAME

HIGH QUALITY, VOID AND INCLUSION FREE ALLOY WIRE

LASER MANUFACTURING OF SOLDER PREFORMS

ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME

COATED SOLDER MATERIAL AND METHOD FOR PRODUCING SAME

PRINTED CIRCUIT BOARD WITH FLUX RESERVOIR

ADAPTIVE INTERPOSER AND ELECTRONIC APPARATUS

STICK ELECTRODE

LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METH...

SOLDER ALLOY

METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...

TOUGHENED SOLDER FOR DOWNHOLE APPLICATIONS, METHODS OF MANUFACTURE...

ELECTRICALLY CONDUCTIVE COMPOSITIONS COMPRISING NON-EUTECTIC SOLDER...

CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREFROM

SOLDER BONDED BODY, METHOD OF PRODUCING SOLDER BONDED BODY, ELEMENT...