Excess Overdrive Detector for Probe Cards

Information

  • Patent Application
  • 20070205782
  • Publication Number
    20070205782
  • Date Filed
    September 26, 2006
    17 years ago
  • Date Published
    September 06, 2007
    16 years ago
Abstract
A novel structure for a probe card that comprises a deformable metal or other deformable material for detecting excess overdrive and a method for using the same are disclosed. This detection structure may be positioned on the substrate along the bending path of the probe, such that should the probe experience excess overdrive, then the detection structure will permanently deform where it is hit by any portion of the probe. Alternatively, the detection structure may be embedded in the substrate, and may also function as a fiducial for alignment detection. Inspection of the probe card, and specifically the detection structure, will reveal whether any probe has experienced excess overdrive. Should the inspection reveal that certain regions of the card experienced excess overdrive, this may indicate a planarity problem that affects production line yield.
Description

5. BRIEF DESCRIPTION OF THE DRAWINGS


FIGS. 1A-1C are cross-sectional views of the novel probe card with an excess overdrive detecting structure.



FIGS. 2A and 2B are cross-sectional views of the novel probe card with an excess overdrive detecting structure, where the probe card experienced excess overdrive.



FIG. 3A is a cross-sectional view of the novel probe card with an excess overdrive detecting structure, where the structure also functions as a fiducial for alignment detection.



FIG. 3B is a plan view of a novel probe card, wherein a probe is misaligned relative to excess overdrive structure on the substrate.



FIGS. 4A-4C are cross-sectional views of the novel probe card with an excess overdrive detecting structure.



FIGS. 5A and 5B are cross-sectional views of the novel probe card with an excess overdrive detecting structure, where the probe card experienced excess overdrive.



FIG. 6 is a plan view of a probe card with twenty single die probe areas and a shaded area where the probes experienced excess overdrive.



FIG. 7 is a plan view of a generic probe card.



FIG. 8 is a cross-sectional view of generic probe card.



FIGS. 9A-9C is a cross-sectional view of generic probe card, where the bending element is bending (FIG. 9B) and hits the substrate (FIG. 9C).


Claims
  • 1. A probe card for testing semiconductor wafers, comprising: a substrate;a probe structure connected to the substrate; andthe substrate further comprises an excess overdrive detecting structure made of a permanently deformable material;wherein the detecting structure is positioned such that it may come into contact with the probe structure during excess overdrive.
  • 2. The probe card of claim 1, wherein excess overdrive is indicated by a permanent deformation of the excess overdrive detecting structure.
  • 3. The probe card of claim 1, further comprising: a fiducial set for determining alignment of the probe structure, wherein the set contains a first fiducial and a second fiducial;the first fiducial comprises the probe structure;the second fiducial comprises the excess overdrive detecting structure spaced apart from the first fiducial; andwherein alignment is determined by comparing the location of the first fiducial to the location of the second fiducial.
  • 4. The probe card of claim 1, wherein the deformable material is selected from a group consisting of: gold, Ag, PbSn solder, organic polymers and combination thereof.
  • 5. A probe card for testing semiconductor wafers, comprising: a substrate;a probe structure connected to the substrate; andthe probe structure further comprises an excess overdrive detecting structure made of a permanently deformable material;wherein the detecting structure is positioned such that it may come into contact with the substrate during excess overdrive.
  • 6. The probe card of claim 5, wherein excess overdrive is indicated by a permanent deformation of the excess overdrive detecting structure.
  • 7. The probe card of claim 5, wherein the deformable material is selected from a group consisting of: gold, Ag, PbSn solder, organic polymers and combination thereof.
  • 8. A method for detecting tip non-planarity of a probe card comprising: (a) providing a probe card that comprises a substrate, a plurality of probe structures and a plurality of excess overdrive detection structures;(b) inspecting the plurality of excess overdrive detection structures for deformation; and(c) determining that the deformation of the plurality of excess overdrive detection structures occurs in a region of the probe card, indicating that the probe card is tip non-planar.
Continuation in Parts (1)
Number Date Country
Parent 11369343 Mar 2006 US
Child 11535219 US