BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic sectional view showing a structure of an exposure apparatus according to one aspect of the present invention.
FIG. 2 is a schematic sectional view of heat-treated porous SiC.
FIG. 3 is a schematic sectional view of porous SiC having an oxide film on its surface layer.
FIG. 4 is a schematic sectional view around a final lens of a projection optical system when the exposure apparatus shown in FIG. 1 exposes peripheral or edge areas on a substrate.
FIG. 5 is a flowchart for explaining a fabrication of a device.
FIG. 6 is a flowchart for a wafer process of step 4 shown in FIG. 5.