Claims
- 1. An external storage device for storing data, comprising:a storage device module including: a substrate having a first face and a second face, the first face having a first region and a second region, a wiring pattern formed on the first face which extends from the first region to the second region, and the substrate having at least one through hole; a semiconductor element consisting essentially of at least one NAND type non-volatile semiconductor memory device capable of being electrically written with data to be stored, the semiconductor element having an input/output terminal, and being mounted in the first region of the first face of the substrate, and the input/output terminal connected with the wiring pattern in the first region; a bonding wire electrically connecting the semiconductor element to the wiring pattern; a sealing resin formed only on the first region of the first face of the substrate to seal the semiconductor element, the sealing resin formed into substantially a rectangular shape, wherein edges of the sealing resin are parallel to corresponding edges of the substrate, respectively; a flat type external connection terminal formed on the second face of the substrate, and the flat type external connection terminal connected to the wiring pattern via the at least one through hole; a card shaped support having a recess for receiving the storage device module so that the second face of the substrate is exposed to a surface of the support.
- 2. The external storage device as claimed in claim 1, wherein the edges of the sealing resin do not overlap the edges of the substrate.
- 3. The external storage device as claimed in claim 2, wherein the storage device module is independent of a driving and controlling circuit.
- 4. The external storage device as claimed in one of claims 1 and 3, wherein the external storage device further comprises an anti-electrostatic element.
- 5. The external storage device as claimed in one of claims 1 and 3, wherein a surface of the flat type external connection terminal of the storage device module is coated with a gold plated layer.
- 6. The external storage device as claimed in one of claims 1 or 3, wherein the card shaped support has a thickness of less than approximately 1 mm.
- 7. The external storage device as claimed in one of claims 1 or 3, wherein the storage device module is placed in the recess of the support so that a surface of the flat type external connection terminal is substantially flush with the surface of the support.
- 8. The external storage device as claimed in claim one of claims 1 or 3, wherein the card shaped support has an area less than half of a card size area specified in JEIDA standards.
- 9. The external storage device as claimed in one of claims 1 and 3, wherein the recess of the card shaped support has a step, wherein the step and the second region of the substrate are opposed.
- 10. The external storage device as claimed in one of claims 1 and 3, wherein the NAND flash type non-volatile semiconductor memory device and the flat type external connection terminal are connected so that the data to be stored can be directly communicated therebetween.
Priority Claims (1)
Number |
Date |
Country |
Kind |
5-182650 |
Jul 1993 |
JP |
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Parent Case Info
This is a division of application Ser. No. 08/657,383, filed Jun. 3, 1996, now U.S. Pat. No. 6,141,210, dated Oct. 31, 2000 which was a division of application Ser. No. 08/205,451, filed Mar. 4, 1994, now U.S. Pat. No. 5,550,709, dated Aug. 27, 1996, all of which are incorporated herein by reference.
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