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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic devices with through-substrate interconnects and as...
Patent number
12,368,096
Issue date
Jul 22, 2025
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
Patent number
12,363,878
Issue date
Jul 15, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding with passivated gold contacting metal
Patent number
12,363,877
Issue date
Jul 15, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Imaging device and method for manufacturing imaging device
Patent number
12,356,753
Issue date
Jul 8, 2025
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Masaya Nagata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
Patent number
12,356,553
Issue date
Jul 8, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
12,347,731
Issue date
Jul 1, 2025
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper alloy bonding wire for semiconductor devices
Patent number
12,300,658
Issue date
May 13, 2025
Nippon Micrometal Corporation
Daizo Oda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Hybrid bonding structures, semiconductor devices having the same, a...
Patent number
12,288,765
Issue date
Apr 29, 2025
Samsung Electronics Co., Ltd.
Kunmo Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
Patent number
12,283,559
Issue date
Apr 22, 2025
Texas Instruments Incorporated
Lin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device including forming a first...
Patent number
12,266,612
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective metallization of integrated circuit packages
Patent number
12,261,123
Issue date
Mar 25, 2025
Advanced Technical Ceramics Company
Aaron Fitzsimmons
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating a semiconductor device
Patent number
12,261,144
Issue date
Mar 25, 2025
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
12,255,168
Issue date
Mar 18, 2025
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding using metastable gas atoms
Patent number
12,245,379
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
Patent number
12,245,380
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
Patent number
12,245,381
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit package having wirebonded multi-die stack
Patent number
12,237,305
Issue date
Feb 25, 2025
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Superconducting bump bonds for quantum computing systems
Patent number
12,218,091
Issue date
Feb 4, 2025
Google LLC
Zhimin Jamie Yao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
Patent number
12,206,056
Issue date
Jan 21, 2025
Electronics and Telecommunications Research Institute
Kwang-Seong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing the same
Patent number
12,154,823
Issue date
Nov 26, 2024
Renesas Electronics Corporation
Katsuhiko Hotta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
12,113,026
Issue date
Oct 8, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for permanent connection of two metal surfaces
Patent number
12,107,057
Issue date
Oct 1, 2024
EV Group E. Thallner GmbH
Viorel Dragoi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connection structure and manufacturing method therefor
Patent number
12,100,923
Issue date
Sep 24, 2024
Resonac Corporation
Kunihiko Akai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with redundant thru-silicon-vias
Patent number
12,094,853
Issue date
Sep 17, 2024
Advanced Micro Devices, Inc.
Bryan Black
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device
Patent number
12,087,744
Issue date
Sep 10, 2024
Samsung Electronics Co., Ltd.
Dongkyu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with different types of semiconductor dies attached to a fl...
Patent number
12,080,660
Issue date
Sep 3, 2024
MACOM Technology Solutions Holdings, Inc.
Xikun Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method to minimize stress on stack via
Patent number
12,080,600
Issue date
Sep 3, 2024
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die contact structure and method
Patent number
12,074,127
Issue date
Aug 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having routable encapsulated conductive subst...
Patent number
12,062,588
Issue date
Aug 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Won Bae Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable via package and method
Patent number
12,035,472
Issue date
Jul 9, 2024
Amkor Technology Singapore Holding Ptd. Ltd.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE
Publication number
20250210574
Publication date
Jun 26, 2025
Kabushiki Kaisha Toshiba
Fumiyoshi KAWASHIRO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250201650
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT
Publication number
20250183124
Publication date
Jun 5, 2025
TEXAS INSTRUMENTS INCORPORATED
John Carlo C Molina
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
Publication number
20250167180
Publication date
May 22, 2025
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
Publication number
20250140730
Publication date
May 1, 2025
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250132278
Publication date
Apr 24, 2025
Advanced Semiconductor Engineering, Inc.
Chih-Jing HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250132214
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
Publication number
20250125307
Publication date
Apr 17, 2025
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...
Publication number
20250125309
Publication date
Apr 17, 2025
Taiwan Semiconductor Manufacturing Company Limited
Kai-Hsiang Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
Publication number
20250118641
Publication date
Apr 10, 2025
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF FABRICATING THE SAME
Publication number
20250105117
Publication date
Mar 27, 2025
Samsung Electronics Co., Ltd.
Sangseok HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250079251
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Fung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250062265
Publication date
Feb 20, 2025
ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
YUEH-MING TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20250046653
Publication date
Feb 6, 2025
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
Publication number
20250038101
Publication date
Jan 30, 2025
STATS ChipPAC Pte Ltd.
Ming-Che Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20240429173
Publication date
Dec 26, 2024
Intel Corporation
Henning BRAUNISCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
Publication number
20240421109
Publication date
Dec 19, 2024
EV GROUP E. THALLNER GMBH
Viorel Dragio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTOELECTRONIC SYSTEM
Publication number
20240421266
Publication date
Dec 19, 2024
EPISTAR CORPORATION
Min-Hsun HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME AND SEMICONDUCTOR DEVICE
Publication number
20240421050
Publication date
Dec 19, 2024
Shinko Electric Industries Co., Ltd.
Etsuo UEMATSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240413026
Publication date
Dec 12, 2024
Samsung Electronics Co., Ltd.
Yeongbeom KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS
Publication number
20240404980
Publication date
Dec 5, 2024
Western Digital Technologies, Inc.
MUHAMAD RIDHWAN HAFIZ BIN ROSDI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
Publication number
20240404880
Publication date
Dec 5, 2024
Lodestar Licensing Group LLC
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240404904
Publication date
Dec 5, 2024
InnoLux Corporation
Ker-Yih KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
Publication number
20240404902
Publication date
Dec 5, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Won Bae BANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240404908
Publication date
Dec 5, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Ki Yeul Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
Publication number
20240387393
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
Publication number
20240387432
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Fu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
Publication number
20240379591
Publication date
Nov 14, 2024
Canon Kabushiki Kaisha
TATSUYA MURAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240363576
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing company Ltd.
WEI-YU CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Stress Relief Vias in Mu...
Publication number
20240355760
Publication date
Oct 24, 2024
STATS ChipPAC Pte Ltd.
Peik Eng Ooi
H01 - BASIC ELECTRIC ELEMENTS