Patent Application
20190239329
The present disclosure relates to an extreme ultraviolet light generation apparatus.
Recently, miniaturization of semiconductor processes has involved increasing miniaturization of transfer patterns for use in photolithography of the semiconductor processes. In the next generation, microfabrication at 70 nm to 45 nm and further microfabrication at 32 nm or less will be required. Thus, to satisfy the requirement for the microfabrication at, for example, 32 nm or less, development of an exposure device is expected including a combination of an extreme ultraviolet light generation apparatus configured to generate an extreme ultraviolet (EUV) light having a wavelength of about 13 nm and reduced projection reflection optics.
Three types of EUV light generation apparatuses have been proposed: an LPP (Laser Produced Plasma) type apparatus using plasma generated by irradiating a target substance with a pulse laser beam, a DPP (Discharge Produced Plasma) type apparatus using plasma generated by discharge, and an SR (Synchrotron Radiation) type apparatus using synchrotron radiation light.
Patent Document 1: US Published Patent Application No. 2014/077099
Patent Document 2: US Published Patent Application No. 2005/129177
An extreme ultraviolet light generation apparatus according to an aspect of the present disclosure includes: a target supply unit configured to output a target toward a predetermined region; a laser system configured to output a first laser beam to be applied to the target, a second laser beam to be applied to the target irradiated with the first laser beam, and a third laser beam to be applied to the target irradiated with the second laser beam; and a control unit configured to control the laser system such that the third laser beam is applied to the target after ions of elements constituting the target are eliminated from at least an optical path of the third laser beam.
An extreme ultraviolet light generation apparatus according to another aspect of the present disclosure includes: a target supply unit configured to output a target toward a predetermined region; a laser system configured to output a first laser beam to be applied to the target, a second laser beam to be applied to the target irradiated with the first laser beam, and a third laser beam to be applied to the target irradiated with the second laser beam; and a control unit configured to control the laser system such that the third laser beam is applied to neutral particles that remain after ions of elements constituting the target are eliminated.
An extreme ultraviolet light generation apparatus according to a further aspect of the present disclosure includes: a target supply unit configured to output a target toward a predetermined region; a laser system configured to output a first laser beam to be applied to the target, a second laser beam to be applied to the target irradiated with the first laser beam, and a third laser beam to be applied to the target irradiated with the second laser beam; and a control unit configured to control the laser system such that the third laser beam is applied to a part of the target but is not applied to ions of elements constituting the target.
With reference to the accompanying drawings, some embodiments of the present disclosure will be described below merely by way of example.
1. General description of extreme ultraviolet light generation system
1.1 Configuration
1.2 Operation
2. EUV light generation system configured to apply first to third laser beams to target
2.1 Configuration
2.1.1 Target supply unit
2.1.2 Target sensor and light-emitting unit
2.1.3 Laser system
2.1.4 Laser beam traveling direction control unit
2.1.5 Focusing optics and EUV light focusing mirror
2.2 Operation
2.2.1 Output of target
2.2.2 Detection of target
2.2.3 Output of pulse laser beam
2.2.4 Transmission of pulse laser beam
2.2.5 Focusing of pulse laser beam
2.3 Changes in target irradiated with pulse laser beam
2.3.1 Primary target 271
2.3.2 Secondary target 272
2.3.3 Tertiary target 273
2.4 Problem
2.5 Behavior of tertiary target 273
2.6 Irradiation with main pulse after elimination of
ions
3. EUV light generation system including timer for measuring time after irradiation with second pre-pulse laser beam P2
3.1 Example of timer holding required time
3.2 Example of memory holding required time
3.3 Others
4. EUV light generation system including ion detector
4.1 Example of continuous monitoring of presence of ions
4.2 Example of determination of presence of ions at specific timing
4.3 Others
Now, with reference to the drawings, embodiments of the present disclosure will be described in detail. The embodiments described below illustrate some examples of the present disclosure, and do not limit contents of the present disclosure. Also, all configurations and operations described in the embodiments are not necessarily essential as configurations and operations of the present disclosure. Like components are denoted by like reference numerals, and overlapping descriptions are omitted.
1.1 Configuration
The wall of the chamber 2 has at least one through hole. A window 21 is provided in the through hole. A pulse laser beam 32 output from the laser system 3 passes through the window 21. In the chamber 2, an EUV light focusing mirror 23 having, for example, a spheroidal reflective surface is arranged. The EUV light focusing mirror 23 has first and second focuses. On a surface of the EUV light focusing mirror 23, a multilayer reflective film including, for example, alternately stacked molybdenum and silicon is formed. The EUV light focusing mirror 23 is arranged such that, for example, its first focus is located in a plasma generation region 25 and its second focus is located in an intermediate focal (IF) point 292. A through hole 24 is provided in a center of the EUV light focusing mirror 23. A pulse laser beam 33 passes through the through hole 24.
The EUV light generation apparatus 1 includes an EUV light generation control unit 5, a target sensor 4, or the like. The target sensor 4 has an imaging function, and is configured to detect presence, a path, a position, a speed, or the like of the target 27.
The EUV light generation apparatus 1 includes a connecting portion 29 configured to provide communication between an interior of the chamber 2 and an interior of an exposure device 6. In the connecting portion 29, a wall 291 having an aperture is provided. The wall 291 is arranged such that the aperture is located in a second focal position of the EUV light focusing mirror 23.
Further, the EUV light generation apparatus 1 includes a laser beam traveling direction control unit 34, a laser beam focusing mirror 22, a target recovery unit 28 for recovering the target 27, or the like. The laser beam traveling direction control unit 34 includes an optical element for defining a traveling direction of a laser beam, and an actuator for adjusting a position, an attitude, or the like of the optical element.
1.2 Operation
With reference to
The target supply unit 26 outputs the target 27 toward the plasma generation region 25 in the chamber 2. The target 27 is irradiated with at least one pulse contained in the pulse laser beam 33. The target 27 irradiated with the pulse laser beam is turned into plasma, and radiation light 251 is radiated from the plasma. The EUV light focusing mirror 23 reflects EUV light contained in the radiation light 251 with higher reflectance than light in a different wavelength range. Reflected light 252 containing the EUV light reflected by the EUV light focusing mirror 23 is focused at the intermediate focal point 292 and output to the exposure device 6. One target 27 may be irradiated with a plurality of pulses contained in the pulse laser beam 33.
The EUV light generation control unit 5 collectively controls the entire EUV light generation system 11. The EUV light generation control unit 5 processes image data or the like of the target 27 captured by the target sensor 4. Also, the EUV light generation control unit 5 controls, for example, output timing of the target 27, an output direction of the target 27, or the like. Further, the EUV light generation control unit 5 controls, for example, oscillation timing of the laser system 3, a traveling direction of the pulse laser beam 32, a focusing position of the pulse laser beam 33, or the like. These various controls are mere examples, and other controls may be added as required.
2.1 Configuration
Outside the chamber 2, a laser system 3, a laser beam traveling direction control unit 34a, and an EUV light generation control unit 5 are provided. The EUV light generation control unit 5 includes an EUV controller 50.
2.1.1 Target Supply Unit
The target supply unit 26 has a reservoir 61. A part of the reservoir 61 extends through a through hole 2a formed in a wall surface of the chamber 2, and a front end of the reservoir 61 is located in the chamber 2. The front end of the reservoir 61 has an opening 62. Near the opening 62 in the front end of the reservoir 61, a vibrating device (not shown) is arranged. The reservoir 61 stores a target substance therein. A flange portion 61a of the reservoir 61 is closely secured to the wall surface of the chamber 2 around the through hole 2a.
2.1.2 Target Sensor and Light-Emitting Unit
The target sensor 4 and the light-emitting unit 45 are arranged on opposite sides with a trajectory of a target 27 therebetween. Windows 21a and 21b are mounted to the chamber 2. The window 21a is located between the light-emitting unit 45 and the trajectory of the target 27. The window 21b is located between the trajectory of the target 27 and the target sensor 4.
The target sensor 4 includes an optical sensor 41, focusing optics 42, and a casing 43. The casing 43 is secured to an outside of the chamber 2. The optical sensor 41 and the focusing optics 42 are secured in the casing 43. The light-emitting unit 45 includes a light source 46, focusing optics 47, and a casing 48. The casing 48 is secured to the outside of the chamber 2. The light source 46 and the focusing optics 47 are secured in the casing 48.
2.1.3 Laser System
The laser system 3 includes a first pre-pulse laser device La1, a second pre-pulse laser device La2, and a main pulse laser device Lb. The first pre-pulse laser device La1 and the second pre-pulse laser device La2 are constituted by, for example, YAG laser devices. Alternatively, the first pre-pulse laser device La1 and the second pre-pulse laser device La2 are constituted by laser devices using Nd:YVO4. The main pulse laser device Lb is constituted by a CO2 laser device. These laser devices each include a laser oscillator and a laser amplifier as required. The YAG laser device uses a YAG crystal as a laser medium in one or both of the laser oscillator and the laser amplifier. The CO2 laser device uses a CO2 gas as a laser medium in one or both of the laser oscillator and the laser amplifier.
2.1.4 Laser Beam Traveling Direction Control Unit
The laser beam traveling direction control unit 34a includes high reflection mirrors 340, 341 and 342, and beam combiners 343 and 344. The high reflection mirror 340 is supported by a holder 345. The high reflection mirror 341 is supported by a holder 346. The high reflection mirror 342 is supported by a holder 347.
The beam combiner 343 is supported by a holder 348. The beam combiner 343 is constituted by a polarizer.
The beam combiner 344 is supported by a holder 349. The beam combiner 344 is constituted by a dichroic mirror.
2.1.5 Focusing Optics and EUV Light Focusing Mirror
The plate 82 is secured to the chamber 2. The plate 82 supports the plate 83 and a position adjustment mechanism 84. The focusing optics 22a includes an off axis paraboloid mirror 221 and a plane mirror 222. The off axis paraboloid mirror 221 is supported by a holder 223. The plane mirror 222 is supported by a holder 224. The holders 223 and 224 are secured to the plate 83.
The EUV light focusing mirror 23 is secured to the plate 82 via the EUV light focusing mirror holder 81.
2.2 Operation
2.2.1 Output of Target
The EUV controller 50 included in the EUV light generation control unit 5 outputs a control signal to the target supply unit 26.
In the target supply unit 26, the target substance in the reservoir 61 is maintained at a temperature equal to or higher than a melting point of the target substance by a heater (not shown) provided in the reservoir 61. The target substance in the reservoir 61 is pressurized by an inert gas supplied into the reservoir 61.
The target substance pressurized by the inert gas is output as a jet through the opening 62. The vibrating device vibrates the reservoir 61. The vibration separates the jet of the target substance into a plurality of droplets. The droplets constitute the target 27. The target 27 moves in an arrow Y direction along the trajectory from the target supply unit 26 to the plasma generation region 25.
The target recovery unit 28 recovers the target 27 having passed through the plasma generation region 25.
2.2.2 Detection of Target
The light-emitting unit 45 focuses light output from the light source 46 substantially on the trajectory of the target 27 between the target supply unit 26 and the plasma generation region 25. The target 27 passes through a light focusing position by the light-emitting unit 45. At this time, the target sensor 4 detects a change in intensity of the light passing through the trajectory of the target 27 and therearound. The target sensor 4 outputs a target detection signal based on the change in the light intensity. The EUV controller 50 receives the target detection signal.
2.2.3 Output of Pulse Laser Beam
The EUV controller 50 outputs a first trigger signal to the first pre-pulse laser device La1 based on the target detection signal. The first trigger signal is output when a first delay time has elapsed with respect to a receiving timing of the target detection signal. The first pre-pulse laser device La1 outputs a first pre-pulse laser beam P1 according to the first trigger signal. The first pre-pulse laser beam P1 corresponds to a first laser beam in the present disclosure.
The EUV controller 50 outputs a second trigger signal to the second pre-pulse laser device La2. The second trigger signal is output when a second delay time longer than the first delay time has elapsed with respect to the receiving timing of the target detection signal. The second pre-pulse laser device La2 outputs a second pre-pulse laser beam P2 according to the second trigger signal. The second pre-pulse laser beam P2 corresponds to a second laser beam in the present disclosure.
The EUV controller 50 outputs a third trigger signal to the main pulse laser device Lb. The third trigger signal is output when a third delay time longer than the second delay time has elapsed with respect to the receiving timing of the target detection signal. The main pulse laser device Lb outputs a main pulse laser beam M according to the third trigger signal. The main pulse laser beam M corresponds to a third laser beam in the present disclosure.
As such, the laser system 3 outputs the first pre-pulse laser beam P1, the second pre-pulse laser beam P2, and the main pulse laser beam M in this order. The first pre-pulse laser beam P1 preferably has a pulse time width of picosecond order. The picosecond order refers to 1 ps or more and less than 1 ns. A pulse time width of the second pre-pulse laser beam P2 is preferably smaller than a pulse time width of the main pulse laser beam M. A delay circuit (not shown) may measure the first to third delay times, and output the first to third trigger signals to the respective laser devices.
2.2.4 Transmission of Pulse Laser Beam
The high reflection mirror 340 included in the laser beam traveling direction control unit 34a is arranged on an optical path of the first pre-pulse laser beam P1 output by the first pre-pulse laser device La1. The high reflection mirror 340 reflects the first pre-pulse laser beam P1 with high reflectance.
The beam combiner 343 is arranged at a position where the optical path of the first pre-pulse laser beam P1 reflected by the high reflection mirror 340 crosses an optical path of the second pre-pulse laser beam P2 output by the second pre-pulse laser device La1.
The first pre-pulse laser beam P1 is a linearly polarized beam with a polarization direction parallel to the plane of
The high reflection mirrors 341 and 342 are arranged on an optical path of the main pulse laser beam M output by the main pulse laser device Lb. The high reflection mirrors 341 and 342 successively reflect the main pulse laser beam M with high reflectance.
The beam combiner 344 is arranged at a position where the optical paths of the first pre-pulse laser beam P1 and the second pre-pulse laser beam P2 cross the optical path of the main pulse laser beam M reflected by the high reflection mirror 342.
The first pre-pulse laser beam P1 and the second pre-pulse laser beam P2 contain a first wavelength component. The main pulse laser beam M contains a second wavelength component different from the first wavelength component. The first pre-pulse laser beam P1 and the second pre-pulse laser beam P2 enter the beam combiner 344 from the upper side in
If the first pre-pulse laser beam P1 and the second pre-pulse laser beam P2 have different wavelength components, the beam combiner 343 may be also constituted by a dichroic mirror.
2.2.5 Focusing of Pulse Laser Beam
The off axis paraboloid mirror 221 included in the focusing optics 22a is arranged on an optical path of the pulse laser beam 32. The off axis paraboloid mirror 221 reflects the pulse laser beam 32 toward the plane mirror 222. The plane mirror 222 reflects the pulse laser beam 32 reflected by the off axis paraboloid mirror 221 as a pulse laser beam 33. The pulse laser beam 33 is focused according to a shape of a reflective surface of the off axis paraboloid mirror 221.
The position adjustment mechanism 84 adjusts a position of the plate 83 relative to the plate 82. The position adjustment mechanism 84 is controlled by a control signal output from the EUV controller 50. The position of the plate 83 is adjusted to adjust positions of the off axis paraboloid mirror 221 and the plane mirror 222. The positions of the off axis paraboloid mirror 221 and the plane mirror 222 are adjusted such that the pulse laser beam 33 reflected by the mirrors is focused on the plasma generation region 25.
At or near the plasma generation region 25, one target 27 is irradiated with the first pre-pulse laser beam P1, the second pre-pulse laser beam P2, and the main pulse laser beam M in this order. A primary target 271, a secondary target 272, and a tertiary target 273 described later with reference to
When the target 27 is irradiated with the first pre-pulse laser beam P1, the second pre-pulse laser beam P2, and the main pulse laser beam M, the target 27 is turned into plasma, and EUV light is generated from the plasma. The present disclosure is not limited to this, but the target may be irradiated with a fourth laser beam between the first pre-pulse laser beam P1 and the second pre-pulse laser beam P2. The target may be irradiated with a fifth laser beam between the second pre-pulse laser beam P2 and the main pulse laser beam M.
2.3 Changes in Target Irradiated with Pulse Laser Beam
In
2.3.1 Primary Target 271
2.3.2 Secondary Target 272
When the primary target 271 is irradiated with the first pre-pulse laser beam P1, the primary target 271 is broken into a plurality of fine particles and diffused.
As shown in
2.3.3 Tertiary Target 273
When the secondary target 272 is irradiated with the second pre-pulse laser beam P2, a part of the secondary target 272 is broken into a plurality of finer particles. Another part of the secondary target 272 is sometimes turned into vapor. A further different part of the secondary target 272 is sometimes turned into plasma.
The tertiary target 273 sometimes further contains plasma 27d. The plasma 27d contains ions of the target substance. The plasma 27d is located on the upstream side of the optical path of the second pre-pulse laser beam P2 in the tertiary target 273. The plasma 27d may be generated by a part of the dome portion 27b of the secondary target 272 absorbing most of energy of the second pre-pulse laser beam P2. The tertiary target 273 is irradiated with the main pulse laser beam M.
When the tertiary target 273 is irradiated with the main pulse laser beam M, at least a part of the tertiary target 273 is turned into plasma, and EUV light is generated from the plasma.
2.4 Problem
The dispersion region 27c with the plurality of fine particles and the vapor in the tertiary target 273 has a low density of target substance. Thus, the plurality of fine particles and the vapor contained in the tertiary target 273 tend to absorb energy of the main pulse laser beam M. If the tertiary target 273 efficiently absorbs the energy of the main pulse laser beam M, the tertiary target 273 is efficiently turned into plasma.
However, the ions contained in the plasma 27d of the tertiary target 273 sometimes reflect or absorb the main pulse laser beam M. For example, it is reported that if the ions are irradiated with a CO2 laser beam, components of the laser beam reflected or absorbed by the ions increase at an ion density of higher than 1016 atoms/cm3. Components of the energy of the main pulse laser beam M reflected or absorbed by the ions contained in the plasma 27d sometimes do not reach the dispersion region 27c.
2.5 Behavior of Tertiary Target 273
The present inventor observed behavior of the plasma 27d contained in the tertiary target 273.
The images in
As shown in
As shown in
As shown in
The results in
2.6 Irradiation with Main Pulse after Elimination of Ions
In the tertiary target 273 in
The CE was measured under the following conditions.
Liquid tin was used as the target 27. A diameter of the target 27 was 21 μm to 22 μm.
As the first pre-pulse laser beam P1, a pulse laser beam having a wavelength of 1.06 μm was used. The pulse width of the first pre-pulse laser beam P1 with a full width at half maximum was 14 ps. A focus diameter of the first pre-pulse laser beam P1 was 70 μm when represented by a diameter of a portion having light intensity of 1/e2 or higher of peak intensity at the irradiation position of the target.
A fluence of the first pre-pulse laser beam P1 was 5.2 J/cm2. Irradiation timing of the first pre-pulse laser beam P1 was taken −1.1 μs back from the irradiation timing of the main pulse laser beam M as zero.
As the second pre-pulse laser beam P2, a pulse laser beam having a wavelength of 1.06 μm was used. The pulse width of the second pre-pulse laser beam P2 with a full width at half maximum was 5 ns. A focus diameter of the second pre-pulse laser beam P2 was 400 μm when represented by a diameter of a portion having light intensity of 1/e2 or higher of peak intensity at the irradiation position of the target.
Four fluences of the second pre-pulse laser beam P2 of 2.4 J/cm2, 1.6 J/cm2, 0.8 J/cm2, and 0 J/cm2 were set. The case with 0 J/cm2 corresponds to no second pre-pulse laser beam P2 being applied. For each set value of the fluence of the second pre-pulse laser beam P2, the CE was measured while the irradiation timing of the second pre-pulse laser beam P2 being changed between −0.6 μs to 0 μs.
As the main pulse laser beam M, a pulse laser beam having a wavelength 10.6 μm was used. The pulse width of the main pulse laser beam M with a full width at half maximum was 15 ns. A focus diameter of the main pulse laser beam M was 300 μm when represented by a diameter of a portion having light intensity of 1/e2 or higher of peak intensity at the irradiation position of the target.
The results in
When the fluence of the second pre-pulse laser beam P2 was 1.6 J/cm2, the CE represented a maximum value at the irradiation timing of −0.14 μs of the second pre-pulse laser beam P2.
When the fluence of the second pre-pulse laser beam P2 was 0.8 J/cm2, the CE represented a maximum value at the irradiation timing of −0.3 μs of the second pre-pulse laser beam P2.
The results in
From the results in
In the embodiment described below, the target is irradiated with the main pulse laser beam M after the ions generated by the irradiation with the second pre-pulse laser beam P2 are eliminated.
This allows the target to efficiently absorb the energy of the main pulse laser beam to improve the CE. “The ions being eliminated” may refer to the ion density on the optical path of the main pulse laser beam M being 1016 atoms/cm3 or lower.
3. EUV Light Generation System Including Timer for Measuring Time after Irradiation with Second Pre-Pulse Laser Beam P2
3.1 Example of Timer Holding Required Time
The EUV controller 50 is configured to output a measurement start signal for the timer synchronized with the second trigger signal to the timer 52.
The EUV controller 50 is configured to receive an output signal of the timer 52. The EUV controller 50 is configured to output the third trigger signal based on the output signal of the timer 52.
The timer 52 is configured to receive the measurement start signal for the timer from the EUV controller 50. The timer 52 is configured to measure time after receiving the measurement start signal for the timer.
When the timer 52 finishes measurement of a predetermined time, the timer 52 outputs an output signal indicating the finish of the measurement to the EUV controller 50. The predetermined time corresponds to a required time before the ions generated by the irradiation with the second pre-pulse laser beam P2 are eliminated. The required time is, for example, 100 ns to 300 ns.
When the EUV controller 50 receives the output signal indicating the finish of the measurement from the timer 52, the EUV controller 50 outputs the third trigger signal.
3.2 Example of Memory Holding Required Time
The timer 52 may output, as necessary, an output signal indicating time after receiving the measurement start signal for the timer to the EUV controller 50 rather than measuring the predetermined time.
In that case, the EUV controller 50 previously reads, from the memory 53, data on the required time before the ions generated by the irradiation with the second pre-pulse laser beam P2 are eliminated. The required time is, for example, 100 ns to 300 ns. The memory 53 may hold, for example, a plurality of values according to required values of energy of the EUV light as the data on the required time. The EUV controller 50 compares the time after the start of the measurement received from the timer 52 with the required time read from the memory 53. The EUV controller 50 outputs the third trigger signal when the time after the start of the measurement received from the timer 52 reaches the required time read from the memory 53. The memory 53 corresponds to a memory unit in the present disclosure.
3.3 Others
With the above configuration, the target is irradiated with the main pulse laser beam M after the ions generated by the irradiation with the second pre-pulse laser beam P2 are eliminated. “The ions being eliminated” means that the ions are eliminated from at least the optical path of the main pulse laser beam M, and the ions may be present outside the optical path of the main pulse laser beam M.
In other words, the main pulse laser beam M is applied to the neutral particles that remain after the ions of elements constituting the target are eliminated.
Further in other words, the main pulse laser beam M is controlled so as to be applied to a part of the target but not applied to the ions of the elements constituting the target.
Alternatively, the main pulse laser beam M is applied to the target with the ion density of 1016 atoms/cm3 or lower.
Other points may be the same as the comparative example.
According to the first embodiment, the required time before the ions generated by the irradiation with the second pre-pulse laser beam P2 are eliminated can be precisely measured to apply the main pulse laser beam M to the target 27. This can improve the CE. It is not always necessary to check whether or not the ions have been eliminated in each case, but the required time may be previously calculated by an experiment.
4.1 Example of Continuous Monitoring of Presence of Ions
The ion detector 7 includes an optical sensor (not shown) and optics (not shown). The optical sensor is constituted by, for example, a photodiode. The optics is configured to focus light near the plasma generation region 25 on the photodiode.
When light emitted from the ions generated by the irradiation with the second pre-pulse laser beam P2 enters the photodiode, an electromotive force is produced in the photodiode and a current flows. The current is output as an ion detection signal to the EUV controller 50.
Alternatively, the ion detector 7 may include an ion collector arranged near the plasma generation region 25. The ion collector includes a grid electrode (not shown) and a cathode electrode (not shown). The grid electrode is spaced apart from the cathode electrode between the plasma generation region 25 and the cathode electrode. A negative potential is applied to the grid electrode. A buffer circuit (not shown) is connected to the cathode electrode. When the ions pass through the grid electrode and reach the cathode electrode, the potential of the cathode electrode increases, and a current flows through the buffer circuit. The current is output as an ion detection signal to the EUV controller 50.
The EUV controller 50 outputs the second trigger signal to the second pre-pulse laser device La1 and then monitors the ion detection signal from the ion detector 7. The EUV controller 50 sets a time interval between the second trigger signal and the third trigger signal so as to output the third trigger signal after the ion detector 7 no longer detects ions.
4.2 Example of Determination of Presence of Ions at Specific Timing
Alternatively, the ion detector 7 may include a camera (not shown) that captures an image of an emission source near the plasma generation region 25. The camera includes a high speed shutter. The high speed shutter is controlled by the EUV controller 50 so as to open/close at predetermined timing after the EUV controller 50 outputs the second trigger signal.
The EUV controller 50 opens/closes the high speed shutter of the camera, for example, when 100 ns has elapsed since the output of the second trigger signal. The EUV controller 50 outputs the third trigger signal after opening/closing the high speed shutter. The EUV controller 50 measures brightness of a predetermined portion of the image captured by the camera.
When the brightness does not exceed a predetermined value, the EUV controller 50 determines that the ions are eliminated, and maintains opening/closing timing of the high speed shutter and output timing of the third trigger signal.
When the brightness exceeds the predetermined value, the EUV controller 50 determines that the ions are not eliminated, and changes the opening/closing timing of the high speed shutter, for example, from 100 ns mentioned above to 110 ns. The EUV controller 50 also changes the output timing of the third trigger signal according to the change of the opening/closing timing of the high speed shutter.
4.3 Others
With the above configuration, the target is irradiated with the main pulse laser beam M after the ions generated by the irradiation with the second pre-pulse laser beam P2 are eliminated. “The ions being eliminated” means that the ions are eliminated from at least the optical path of the main pulse laser beam M, and the ions may be present outside the optical path of the main pulse laser beam M.
In other words, the main pulse laser beam M is applied to the neutral particles that remain after the ions of elements constituting the target are eliminated.
Further in other words, the main pulse laser beam M is controlled so as to be applied to a part of the target but not applied to the ions of the elements constituting the target.
Alternatively, the main pulse laser beam M is applied to the target with the ion density of 1016 atoms/cm3 or lower.
Other points may be the same as the comparative example.
According to the second embodiment, whether or not the ions are eliminated can be determined to apply the main pulse laser beam M to the target 27 at appropriate timing. This can improve the CE. It is not always necessary to previously calculate the required time before the ions are eliminated, but changes in operating conditions such as the required value of the energy of the EUV light or the value of the fluence of the second pre-pulse laser beam P2 can be flexibly accommodated.
The above descriptions are intended to be illustrative only and not restrictive. Thus, it will be apparent to those skilled in the art that modifications may be made in the embodiments of the present disclosure without departing from the scope of the appended claims.
The terms used throughout the specification and the appended claims should be interpreted as “non-limiting.” For example, the term “comprising” or “comprised” should be interpreted as “not limited to what has been described as being comprised.” The term “having” should be interpreted as “not limited to what has been described as having”. Further, the modifier “a/an” described in the specification and the appended claims should be interpreted to mean “at least one” or “one or more”.
The present application is a continuation application of International Application No. PCT/JP2016/082418 filed on Nov. 1, 2016. The content of the application is incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2016/082418 | Nov 2016 | US |
| Child | 16375556 | US |
