Claims
- 1. A method comprising the steps of:
forming a film on a wafer using a processing vessel; a gas supply mechanism for supplying a processing gas for film formation into the processing vessel; a susceptor provided in the processing vessel, on which an object to be processed may be placed; a clamp support mechanism for supporting the object to be processed on said susceptor while clamping the object to be processed with said susceptor; and a heating source for heating the object to be processed on said susceptor, to form a film having a desired thickness on the object to be processed, by the processing gas, said clamp support mechanism comprising a ring-shaped clamp body having an inner peripheral contact surface, which defines an opening having an inner diameter smaller than an outer diameter of the object to be processed so as to overlap with an outer peripheral portion of the object to be processed along an entire periphery thereof by a length L, the peripheral contact surface being inclined downwardly at a predetermined angle θ, and outwardly in the direction of the diameter of the object to be processed, the clamp body having an outer diameter larger than the outer diameter of the object to be processed, the clamp support mechanism including a drive mechanism for pressing said ring-shaped member toward the object to be processed and making said inner peripheral contact surface abut on an outer peripheral edge of the object to be processed, wherein the length L and the angle θ range from 0.7 to 2.35 mm and from 2 to 15 degrees, respectively, such that the film formed on the object to be processed has a thickness of at least 90% of said desired thickness, in a central region 0.4 mm remote from the outer peripheral edge of the object to be processed, and that the film is not formed on a back surface of the object; and flattening the film on the wafer using an etch back process.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-011191 |
Jan 1999 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] The present application is a Division of U.S. patent application Ser. No. 09/646,391, filed on Sep. 18, 2000, and now abandoned.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09646391 |
Sep 2000 |
US |
Child |
10460183 |
Jun 2003 |
US |