The present invention relates to optical modules as used in various types of communication systems and, more particularly, to the utilization of a flexible substrate to support various optical, electronic, and opto-electronic module components in a manner that can accommodate various packaging constraints.
Various configurations and components of optical communication systems have utilized “flexible” substrates (such as polyimide films) to support complicated patterns and topologies of optical fiber. In these systems, an adhesive-coated flexible substrate is provided and a length of optical fiber is pressed into a pressure-sensitive adhesive coating and routed across the surface of the flexible substrate in a configuration that is appropriate and efficient for the specific arrangement. Two-dimensional fiber arrangements have also been formed, with a first group of fibers routed along and attached to a first adhesive-coated substrate, and the first substrate then covered with a second sheet of the same material, and the fiber routing process repeated.
While the use of an adhesive-coated flexible sheet for maintaining large quantities of optical fiber in a fixed position is well-known and used, there remains the need to interconnect these “fiber sheets” with other optical components to form a desired optical module.
The needs remaining in the prior art are addressed by the present invention, which relates to optical modules as used in various types of communication systems and, more particularly, to the utilization of a flexible substrate to support various optical, electronic, and opto-electronic module components in a manner that can accommodate various packaging constraints.
A flexible polyimide film is known to exhibit excellent electrical isolation properties, even though the films are generally relatively thin (on the order of 10-100 μms, in most cases). In the application of the present invention, the flexible polyimide film is sized to accommodate the constraints of a given package “footprint”; more particularly, sized to fit an open ‘floor area’ within package, allowing for a populated film to be placed around various other “fixed-in-place” elements (such as, for example, a line card element that has been previously soldered in place, a stand-alone pump source attached to a submount in a specific package location, etc.). The polyimide film is easily cut and trimmed to exhibit whatever topology is convenient, while providing enough surface area to support the affixed components and optical fiber (the fiber disposed as in the prior art, along traces formed in the adhesive coating).
In accordance with an exemplary embodiment of the present invention, the various individual optical components necessary to form a specific module (such as an amplifier, a channel monitor, a switch, etc.) are placed upon, and attached to, the same adhesive-coated flexible substrate material as the optical fiber.
In one exemplary configuration, the various passive and optical components necessary to form a specific module (e.g., lenses, filters, laser diodes, photodiodes, etc.) are positioned at appropriate locations on a pressure-sensitive adhesive coating and pressed down (slightly) so that the devices adhere to the adhesive coating on the surface of a flexible substrate. The associated fiber pigtails (as well as necessary electrical signal paths) are also affixed to the adhesive coating. Indeed, it is also possible to include necessary electrical components on the flexible substrate as well.
In another embodiment, multiple layers of adhesive-coated flexible substrate material may be disposed within a particular package so as to allow for different devices and configurations to be accommodated in a compact arrangement.
A specific embodiment of the present invention takes the form of an optical module comprising a plurality of optical components, a plurality of electro-optic components, sections of optical fiber interconnecting the plurality of optical components and the plurality of electro-optic components in a predetermined configuration, and a flexible substrate including an adhesive-coated surface layer, where the plurality of optical components and the plurality of electro-optic components are affixed to the adhesive-coated surface layer and the sections of optical fiber are disposed in paths formed within the adhesive-coated surface layer.
Other and further aspects and embodiments of the present invention will become apparent during the course of the following discussion and by reference to the accompanying drawings.
Referring now to the drawings, where like numerals represent like parts in several views:
The use of a flexible substrate material to support and connect various optical and electrical components of an optical module is considered to be an efficient and relatively inexpensive approach to creating any desired configuration of components in a manner that adheres to given packaging constraints. Various issues well-known in the art with respect to wasted space within a fixed-frame module, footprint requirements and dimension restrictions in certain environments, and the like, can all be easily addressed by the use of a flexible substrate, which may be form-fit to accommodate specific design requirements. Indeed, the shape of the flexible optical module made be easily managed to fit around other modules or elements found in a larger system (e.g., line cards and the like).
As with the two-dimensional fiber sheets, the configuration of the present invention is anticipated to also be able to use multiple layers of adhesive-coated flexible substrate material. Instead of using separate sheets of substrate material, multi-dimensional configuration may also be created by folding over the flexible substrate sheet (or bending the sheet as necessary). Additional elements for providing necessary heating and/or cooling of the structure may also be incorporated in the module, including for example, a heating element disposed in parallel with a section of doped fiber used in an optical amplifier. In configurations where cooling paths are required (such as, for example, when a laser diode is included as part of the optical module), a suitable type of cooler/thermal management element may also be included.
The use of an adhesive-coated flexible substrate allows for conventional “pick-and-place” robotic assembly systems to be used to attach the components to the adhesive surface, with other well-known arrangements used to route the fiber and adhere it to the flexible material. Of course, a manual assembly system may also be used.
Additionally, the use of a flexible film material as the “substrate” upon which an optical module is built allows for the module to be fully constructed, with its various components optically and electrically interconnected, prior to installing any portion of this module in an associated larger assembly. Said another way, an optical module formed on a flexible substrate can be first built, and then laid into place within a housing or packaging where the additional structures of final assembly are located. This approach removes the issue of current manufacturing processes that restrict fiber pigtail lengths to those that match the manufacturing equipment set-up and/or built-in winding form (as well as having to always accommodate the fixed locations of places and components within the mechanical housing).
In most conventional optical modules, the mechanical structure dictates the specific locations where the passive components, splices and fibers can be placed. Due to the risk of a failed splice, the various fiber pigtails have to be made longer than the minimum distance between components, in case a splice needs to be repaired. This results in increasing the fiber density within the module. Conventional arrangements also require that the fiber pigtails be positioned, wound and fit within very cramped and difficult to access locations between the fixed-in-place components.
The approach of the present invention addresses these concerns by allowing for the optical module to be assembled and all of the necessary fiber connections to be made prior to placing the “flexible” module within a larger mechanical housing structure. As a further benefit, the physical length of the fiber path from the input to the output of the optical module can be made relatively short. Thus, signal transfer latency through the module can be significantly reduced - a key parameter in various important optical communication applications.
In the example shown in
In the particular arrangement shown in
As mentioned above, it is an aspect of the present invention that the various fiber interconnects required to couple together the components forming the module are routed along (and affixed to) surface coating 10-P of flexible substrate 10. Various fiber segments are shown as elements 30 in
Once flexible substrate 10 has been fully populated with the desired components forming the optical module as shown in
Besides using multiple, separate pieces of flexible substrate material across the “floor” of a particular package, it is also possible to use multiple layers of flexible substrate material to provide for a two-dimensional stacking of various components and/or fibers.
The examples and embodiments disclosed in this application are to be considered in all respects as illustrative and not limiting in terms of defining the scope of the present invention. That is, the scope of the invention is intended to be indicated by the appended claims rather than the foregoing description; and all changes which come within the meaning and range of equivalency of the claims are intended to be embraced therein.
This application claims the benefit of U.S. Provisional Application Ser. No. 62/136,476, filed Mar. 21, 2015 and herein incorporated by reference.
Number | Date | Country | |
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62136476 | Mar 2015 | US |