Combinations of two or more optical elements

Industry

CPC
G02B6/12004

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/12004Combinations of two or more optical elements

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Trimming of optical response for tunable photonic devices
- Patent number 12,181,709
- Issue date Dec 31, 2024
- II-VI DELAWARE, INC.
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit platform and optical phase array device...
- Patent number 12,174,416
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Dongjae Shin
- G02 - OPTICS
Information Patent Grant
Optoelectronic transmitter with phased array antenna comprising an...
- Patent number 12,174,514
- Issue date Dec 24, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Daivid Fowler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Monolithically integrated system on chip for silicon photonics
- Patent number 12,174,781
- Issue date Dec 24, 2024
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,174,415
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- G02 - OPTICS
Information Patent Grant
Integrated waveguide coupler
- Patent number 12,169,311
- Issue date Dec 17, 2024
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit-based transmissive/reflective wavefront...
- Patent number 12,164,146
- Issue date Dec 10, 2024
- Raytheon Company
- Stephen P. Palese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichannel optical tap devices
- Patent number 12,164,149
- Issue date Dec 10, 2024
- Panduit Corp.
- Jose M. Castro
- G02 - OPTICS
Information Patent Grant
Optical device and method of manufacturing the same
- Patent number 12,153,253
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chewn-Pu Jou
- G02 - OPTICS
Information Patent Grant
Silicon photonics integration circuit
- Patent number 12,153,251
- Issue date Nov 26, 2024
- MARVELL ASIA PTE. LTD.
- Xiaoguang Tu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing photoelectric composite circuit board
- Patent number 12,153,252
- Issue date Nov 26, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low non-linear loss silicon waveguides with sweep-out diodes
- Patent number 12,153,293
- Issue date Nov 26, 2024
- Ayar Labs, Inc.
- Derek M. Kita
- G02 - OPTICS
Information Patent Grant
MEMS optical microphone
- Patent number 12,155,997
- Issue date Nov 26, 2024
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Taimoor Ali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid manufacturing for integrating photonic and electronic compon...
- Patent number 12,147,083
- Issue date Nov 19, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for disposing photonic integrated cir...
- Patent number 12,147,043
- Issue date Nov 19, 2024
- Meta Platforms Technologies, LLC
- Poer Sung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual grating-coupled lasers
- Patent number 12,149,051
- Issue date Nov 19, 2024
- II-VI DELAWARE, INC.
- Shiyun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated coherent optical transceiver, light engine
- Patent number 12,136,951
- Issue date Nov 5, 2024
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a photodetector with reduced dark c...
- Patent number 12,136,679
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIC die and package with multiple level and multiple depth connecti...
- Patent number 12,130,470
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Optical element mounting module
- Patent number 12,130,471
- Issue date Oct 29, 2024
- Kyocera Corporation
- Takayuki Nejime
- G02 - OPTICS
Information Patent Grant
Manufacture of optical light guides
- Patent number 12,130,454
- Issue date Oct 29, 2024
- ams Sensors Singapore Pte. Ltd.
- Nicola Spring
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Light emitting device
- Patent number 12,130,481
- Issue date Oct 29, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuki Nakamura
- G01 - MEASURING TESTING
Information Patent Grant
Optical waveguide package and light-emitting device
- Patent number 12,124,079
- Issue date Oct 22, 2024
- Kyocera Corporation
- Yoshiaki Itakura
- G02 - OPTICS
Information Patent Grant
Photonic communication platform
- Patent number 12,124,081
- Issue date Oct 22, 2024
- Lightmatter, Inc.
- Nicholas C. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic chip and method for testing photonic circuits of suc...
- Patent number 12,123,910
- Issue date Oct 22, 2024
- STMicroelectronics (Crolles 2) SAS
- Patrick Le Maitre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic communication platform
- Patent number 12,124,082
- Issue date Oct 22, 2024
- Lightmatter, Inc.
- Nicholas C. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptable optical neural network system
- Patent number 12,111,492
- Issue date Oct 8, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sean P. Rodrigues
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multiple-tip edge couplers with segmented waveguide cores
- Patent number 12,111,495
- Issue date Oct 8, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G02 - OPTICS
Information Patent Grant
Illumination of optical analytical devices
- Patent number 12,105,310
- Issue date Oct 1, 2024
- Pacific Biosciences of California, Inc.
- Annette Grot
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Optoelectronic device and array thereof
- Patent number 12,099,267
- Issue date Sep 24, 2024
- Rockley Photonics Limited
- Abu Thomas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SWITCH BASED ON A PHASE-CHANGE MATERIAL
- Publication number 20240431218
- Publication date Dec 26, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Ismaël Charlet
- G02 - OPTICS
Information Patent Application
METHOD OF FORMING PHOTONICS STRUCTURES
- Publication number 20240411090
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLEXING FOR PHOTONIC CIRCUITS
- Publication number 20240405888
- Publication date Dec 5, 2024
- Psiquantum, Corp.
- Terence Rudolph
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL WAVEGUIDE DETECTION ELEMENT, VIDEO LASER MODULE, AND XR GLA...
- Publication number 20240402499
- Publication date Dec 5, 2024
- TDK Corporation
- Hideaki FUKUZAWA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240404900
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...
- Publication number 20240402421
- Publication date Dec 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Application
INTEGRATED SLOT WAVEGUIDE OPTICAL PHASE MODULATOR
- Publication number 20240393529
- Publication date Nov 28, 2024
- Shanghai Xizhi Technology Co., Ltd.
- Huaiyu MENG
- G02 - OPTICS
Information Patent Application
METHOD OF MEASURING ELECTRO-OPTIC CHARACTERISTIC OF A TRAVELING WAV...
- Publication number 20240393656
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Yang Jung
- G02 - OPTICS
Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240385370
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED 3DIC WITH STACKED PHOTONIC DIES AND METHOD FORMING SAME
- Publication number 20240385367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
Reconfigurable PIC Architecture for Both Phase and Amplitude Modula...
- Publication number 20240385368
- Publication date Nov 21, 2024
- Finisar Shanghai Incorporation
- Yao Sun
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED SILICON LENS
- Publication number 20240385369
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240377580
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ning Weng
- G02 - OPTICS
Information Patent Application
INTEGRATED BOUND-MODE SPECTRAL/ANGULAR SENSORS
- Publication number 20240377246
- Publication date Nov 14, 2024
- UNM Rainforest Innovations
- Steven R.J. BRUECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device And Method
- Publication number 20240369761
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mohammed Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICONDUCTOR-ON-INSULATO...
- Publication number 20240371943
- Publication date Nov 7, 2024
- ATOMERA INCORPORATED
- DONGHUN KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS CHIP STRUCTURES INCLUDING A LIGHT SOURCE AND AN EDGE COUPLER
- Publication number 20240369760
- Publication date Nov 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Arpan Dasgupta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A PHOTODETECTOR WITH REDUCED DARK C...
- Publication number 20240372018
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240361520
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Photonic Circuit with Redundant Portions
- Publication number 20240353615
- Publication date Oct 24, 2024
- II-VI Delaware, Inc.
- Argishti Melikyan
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED SIGNAL PROCESSING DEVICE
- Publication number 20240345326
- Publication date Oct 17, 2024
- Universiteit Gent
- Charis MESARITAKIS
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...
- Publication number 20240337800
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-LAYER EDGE COUPLERS WITH CURVED COUPLING-ASSISTANCE FEATURES
- Publication number 20240329299
- Publication date Oct 3, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G02 - OPTICS
Information Patent Application
EMBEDDED PHOTONIC INTEGRATED CIRCUITS
- Publication number 20240329301
- Publication date Oct 3, 2024
- Intel Corporation
- Kaveh Hosseini
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240332192
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-I WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE AND ELECTRONIC DEVICE
- Publication number 20240329300
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-I WU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Photonic Package and Method of Manufacture
- Publication number 20240329302
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING PHOTONIC INTEGRATED CIRCUIT
- Publication number 20240319438
- Publication date Sep 26, 2024
- Molex, LLC
- Chih-Chung Hsu
- G02 - OPTICS
Information Patent Application
METHOD FOR INTEGRATION OF ELECTRO-OPTICAL MATERIALS IN A PHOTONIC I...
- Publication number 20240319440
- Publication date Sep 26, 2024
- Cisco Technology, Inc.
- Long CHEN
- G02 - OPTICS

Combinations of two or more optical elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Trimming of optical response for tunable photonic devices

Photonic integrated circuit platform and optical phase array device...

Optoelectronic transmitter with phased array antenna comprising an...

Monolithically integrated system on chip for silicon photonics

Semiconductor package and manufacturing method thereof

Integrated waveguide coupler

Photonic integrated circuit-based transmissive/reflective wavefront...

Multichannel optical tap devices

Optical device and method of manufacturing the same

Silicon photonics integration circuit

Method for manufacturing photoelectric composite circuit board

Low non-linear loss silicon waveguides with sweep-out diodes

MEMS optical microphone

Hybrid manufacturing for integrating photonic and electronic compon...

Apparatus, system, and method for disposing photonic integrated cir...

Dual grating-coupled lasers

Integrated coherent optical transceiver, light engine

Semiconductor device comprising a photodetector with reduced dark c...

PIC die and package with multiple level and multiple depth connecti...

Optical element mounting module

Manufacture of optical light guides

Light emitting device

Optical waveguide package and light-emitting device

Photonic communication platform

Optoelectronic chip and method for testing photonic circuits of suc...

Photonic communication platform

Adaptable optical neural network system

Multiple-tip edge couplers with segmented waveguide cores

Illumination of optical analytical devices

Optoelectronic device and array thereof

Patents Applicationslast 30 patents

SWITCH BASED ON A PHASE-CHANGE MATERIAL

METHOD OF FORMING PHOTONICS STRUCTURES

MULTIPLEXING FOR PHOTONIC CIRCUITS

OPTICAL WAVEGUIDE DETECTION ELEMENT, VIDEO LASER MODULE, AND XR GLA...

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...

INTEGRATED SLOT WAVEGUIDE OPTICAL PHASE MODULATOR

METHOD OF MEASURING ELECTRO-OPTIC CHARACTERISTIC OF A TRAVELING WAV...

PACKAGE AND METHOD OF FORMING SAME

INTEGRATED 3DIC WITH STACKED PHOTONIC DIES AND METHOD FORMING SAME

Reconfigurable PIC Architecture for Both Phase and Amplitude Modula...

SEMICONDUCTOR DEVICES WITH EMBEDDED SILICON LENS

OPTICAL DEVICE AND METHODS OF MANUFACTURE

INTEGRATED BOUND-MODE SPECTRAL/ANGULAR SENSORS

Photonic Semiconductor Device And Method

SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICONDUCTOR-ON-INSULATO...

PHOTONICS CHIP STRUCTURES INCLUDING A LIGHT SOURCE AND AN EDGE COUPLER

SEMICONDUCTOR DEVICE COMPRISING A PHOTODETECTOR WITH REDUCED DARK C...

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Photonic Circuit with Redundant Portions

PHOTONIC INTEGRATED SIGNAL PROCESSING DEVICE

PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...

DUAL-LAYER EDGE COUPLERS WITH CURVED COUPLING-ASSISTANCE FEATURES

EMBEDDED PHOTONIC INTEGRATED CIRCUITS

PACKAGE STRUCTURE

PACKAGE DEVICE AND ELECTRONIC DEVICE

Photonic Package and Method of Manufacture

MEMS DIES EMBEDDED IN GLASS CORES

PACKAGE STRUCTURE HAVING PHOTONIC INTEGRATED CIRCUIT

METHOD FOR INTEGRATION OF ELECTRO-OPTICAL MATERIALS IN A PHOTONIC I...