This invention relates to floor panels and methods for manufacturing floor panels.
More particularly, the invention relates to floor panels of the type which is at least composed of a substrate and a top layer provided on this substrate, wherein said top layer comprises a motif. As known, above said motif a transparent or translucent synthetic material layer can be provided, which layer then forms part of said top layer.
In particular, the present invention relates to floor panels of the type which, at two or more opposite edges, comprises coupling means or coupling parts, with which two of such floor panels can be coupled at the respective edges, such that they are locked together in a horizontal direction perpendicular to the respective edge the floor panels, as well as in a vertical direction perpendicular to the plane of the floor panels. Such floor panels can be applied for composing a so-called floating floor covering, wherein the floor panels are interconnected at their edges, however, are lying freely on the underlying floor.
From WO 97/47834, laminate floor panels are known for forming a floating floor covering. However, laminate floor panels show the disadvantage that they mostly are provided with a moisture-sensitive substrate, namely MDF or HDF (Medium Density Fiberboard or High Density Fiberboard), and that the top layer provided on said substrate, when the floor covering is in use, leads to the development of ticking noises. Mostly, laminate floor panels have a thickness situated between 6 and 12 millimeters, wherein the thickness of the top layer mostly is less than 0.5 millimeters. Moreover, the high density of the substrate material leads to high impact sensitivity.
From EP 1 290 290, it is known to provide laminate floor panels with a structured surface, for example, with a structure imitating wood pores. According to EP 1 290 290, such structure can be provided by means of a press device of the short-cycle type and an associated structured press element or press platen. Herein, the structure can be provided in such a manner that it corresponds to the pattern of the laminate floor panels.
From EP 1 938 963, vinyl-based floor panels are known for forming such floating floor covering. Such vinyl-based floor panels mostly have a thickness of 3 to 5 millimeters and have a high material density. Inherent to these floor panels is their limited bending stiffness and their high deformability. These features lead to problems when the floor panels are applied on an uneven underlying surface. Namely, after a certain period of time the unevennesses of the underlying surface may migrate to the surface of the floor covering. With a local load, for example, underneath the legs of tables or chairs, permanent impressions will occur, which are undesired as well. Such floor panels also lead to problems with the propagation of sound towards underlying rooms.
The present invention relates to an alternative panel, which in particular is intended as a floor panel for forming a floating floor covering. According to various preferred embodiments of the invention, also a solution is offered for one or more problems with the floor panels of the state of the art.
To this aim, the invention, according to its first independent aspect, relates to a floor panel of the type which comprises at least a substrate and a top layer provided thereon, wherein said top layer comprises a motif, with the characteristic that said substrate substantially consists of a foamed synthetic material layer, which preferably has an average density of more than 300 kilograms per cubic meter. In that a foamed synthetic material layer is applied, a less moisture-sensitive floor panel is obtained than in the case of an MDF or HDF substrate. By foaming, with a comparable amount of synthetic material as with the floor panels of EP 1 938 963, a thicker and stiffer substrate is obtained, such that the risk of the occurrence of migration effects from the underlying layer to the surface of the floor covering can be minimized. This is in particular the case when an average density is applied of more than 300 kilograms per cubic meter. Said substrate preferably has a thickness of more than five millimeters. With such thickness of the substrate, the risk of the occurrence of said migration effects is minimized even further. The minimum thickness of five millimeters also allows that sturdy mechanical coupling means can be formed in one piece with the synthetic material board, for example, in that those can be provided at least partially directly in the synthetic material board as milled profiles.
The preferred minimum average density of the foamed synthetic material board is also advantageous when providing, more particularly milling, the profiles and can result in coupling means offering a strong vertical and/or horizontal locking. With said minimum density, it is avoided that the edges of the synthetic material board are deformed too much. Boards of a lower density namely have a higher risk of pushing up the edges, wherein such pushed-up edges will protrude above the actual board surface. Such effect is undesired. Another advantage of said minimum density is that it results in a better resistance against local loads.
Preferably, said synthetic material board has an average density of 450 to 900 kilograms
per cubic meter, preferably 500 to 600 kilograms per cubic meter. It is clear that the above-mentioned advantages of the preferred minimum density are more pronounced with a higher density of the foamed board material. However, too high a density will lead to disadvantageous effects, such as high impact sensitivity and increased sensitivity for possible unevennesses in the underlying surface, whereby sound boxes can be created, which effect an amplification of possible sound developed during the use of the floor covering.
Preferably, said synthetic material board has a local density on one or both flat sides which is higher than in a central layer of the foamed synthetic material board. With such construction, an optimal combination of an average low density and sufficient dimensional stiffness can be obtained. The locally higher density, preferably at least 5 or 10 percent higher than the average density, of course can be situated on the surface itself, as well as at a certain distance underneath the surface of the respective side, however, at a distance from a central layer of the substrate. In the cases where the locally higher density substantially is realized on one of both flat sides only, this preferably relates to the side of the substrate which is situated closest to said top layer. By means of such embodiment, the risk of the occurrence of permanent impressions can be minimized, while the floor panel as a whole has a low weight.
Preferably, said foamed synthetic material board relates to a foamed PVC (polyvinyl chloride) board, or a foamed synthetic material board which substantially consists of another vinyl compound, such as polyvinyl dichloride, polyvinyl butyrate, polyvinyl acetate and the like. As an alternative, as a basis material for the substrate use can also be made of melamine foam, polyurethane or polyisocyanurate.
According to a particular embodiment, said foamed synthetic material board is of the closed cell type, still better it relates to a closed cell foamed PVC board. It is known as such that with foamed synthetic material of the closed cell type the chambers of the foam practically are not interconnected, or at least to a much lesser extent than this is the case with foamed synthetic materials of the open cell type. A foamed synthetic material board of the closed cell type offers a very high stiffness, dimensional stability and water-resistance, with a limited density of, for example, 600 kilograms per cubic meter or less. The limited density offers interesting advantages in logistics, such as in transport. Also, the limited density offers a more ergonomic whole, when 5 to 10 of such floor panels are offered together in a packaging unit. It is clear that the present invention also relates to such packaging unit. The package applied therewith as such preferably consists at least of a cardboard box or open-top box, and shrink film. For example, the packaging materials can be applied which are known as such from WO 2006/103565.
As also mentioned above, an average density of the synthetic material board situated between 500 and 600 kilograms per cubic meter leads to an optimum result of all advantageous and disadvantageous effects. Such density can be realized by means of synthetic materials of the closed cell type, such contrary to the usual hard foams of the open cell type, for example, polyester hard foams or the hard foams known from U.S. Pat. No. 3,853,685, which have a density of 150 kilograms per cubic meter or less and typically are applied for cushions or mattresses.
According to another embodiment, said synthetic material board comprises separate layers which increase the bending stiffness thereof. Such layers preferably are situated at a distance of the center of said synthetic material board, preferably at both sides of this center. Such layers can consist, for example, of a glass fiber cloth or glass fiber fabric. Preferably, this particular embodiment is combined with a locally higher density on one or both flat sides, as also mentioned above.
Preferably, said top layer substantially consists of synthetic material. For example, said top layer can consist substantially of a vinyl compound or of a polyurethane compound. Preferably, said motif herein is formed by a printed synthetic material film, for example, a printed PVC film or a printed PUR (polyurethane) film. However, the invention does not exclude that the pattern can be formed in another manner, for example, by means of a print performed directly on said substrate, or on a primer layer provided on this substrate. The top layer preferably also includes a transparent or translucent layer based on synthetic material and situated above the motif, which layer is provided as a film, whether or not together with said printed film, or is provided in liquid form and subsequently is hardened on the substrate.
Preferably, the adherence between the top layer and the substrate is obtained in that these two are hardened against each other. For example, a top layer of synthetic material can be hardened on an already foamed synthetic material board or vice versa, or a top layer of synthetic material can be hardened while said synthetic material board is foamed against this hardening top layer or vice versa, or the synthetic material board and at least a portion of the top layer can be extruded together, namely, coextruded. According to a variant, said top layer can also be glued to the substrate, for example, with contact glue. According to another variant, the top layer and the substrate can be welded to each other, for example, in that they both are heated and pressed against each other. Herein, the heating preferably is performed at least on the sides of the top layer and the substrate which have to be adhered to each other. To this aim, for example, heating with infrared radiation can be chosen.
It is clear that the entire layer composition of the floor panel can be obtained by a combination of the possibilities or variants therefor mentioned herein. Namely, the top layer as such can consist of different layers, which each as such are provided on the substrate or another adjoining layer according to any of these possibilities.
Preferably, said top layer has a higher density than said substrate, or at least a density of more than 500 kilograms per cubic meter. By using a top layer of high density, nevertheless a substrate consisting of a foamed synthetic material layer of lower density can obtain a good impact resistance. The density of said top layer can be adapted, for example, by the use of filler materials, such as chalk.
It is noted that within the scope of the invention the foamed synthetic material substrate can be provided with filler materials, such as chalk, wood fiber, sand and the like. In such embodiment, savings on the amount of synthetic material can be obtained.
According to a particular preferred embodiment, said top at layer as such of at least a back layer, a motif or pattern provided thereon, and a transparent or translucent wear layer. Said back layer preferably has a thickness which is 45 percent or more of the overall thickness of the top layer. Such back layer preferably consists of a vinyl compound or polyurethane compound, wherein preferably use is made of fillers, such as chalk. The synthetic material applied therewith preferably comprises recycled synthetic material or substantially consists thereof. Preferably, the back layer is made with a higher density than the wear layer. Amongst others, to this aim the application of filler materials in the back layer is of interest. As aforementioned, for the motif or the pattern, use can be made of a printed material sheet, such as a synthetic material film or a print performed directly on the substrate. For said translucent or transparent wear layer, preferably use is made of a vinyl layer or polyurethane layer having a thickness of at least 0.2 millimeters and still better having a thickness of at least 0.3 millimeters.
Preferably, this translucent or transparent layer is made not thicker than 1 millimeter. By means of a transparent layer of 0.25 to 0.7 millimeters, a wear resistance can be obtained which is comparable to that of laminate floor panels. The transparent or translucent layer can either be applied as a film, whether or not together with the aforementioned printed film, or can be applied in liquid form and subsequently be hardened on the substrate. Preferably, the transparent or translucent layer has a thickness which corresponds to at least 25 percent of the overall thickness of the top layer. Optionally, the top layer can include a surface layer on the basis of a UV-hardened substance.
It is noted that according to the above particular embodiment, the back layer, the motif and the wear layer can be manufactured according to various possibilities. According to a first possibility, originally they all are made as a synthetic material layer, which, for example, are bonded to each other at least with the use of heat. This bond can be obtained, for example, in a heated press device, such as in a short-cycle press. Subsequently, such composed layer can be adhered to the substrate, for example, by means of an adhesive connection or by means of a welding connection, wherein the substrate and the top layer are melted together. According to a second possibility, at least the back layer and/or the wear layer are provided in liquid or paste-like form on a carrier material, such as glass fiber non-wovens, where they harden. According to this second possibility, the motif then either can be provided by means of a separate printed film, or can be printed directly on the back layer or on the bottom side of the wear layer, for example, by means of offset printing or inkj et printing, preferably by means of UV-based inks or solvent inks.
Preferably, said floor panel has a thickness of 5 to 10 millimeters, wherein said top layer as such has a thickness of 0.5 to 3 millimeters.
As aforementioned, the floor panel of the invention is intended in particular for composing floating floor coverings. To this aim, the floor panel of the invention comprises preferably at least at two opposite edges coupling means, with which two of such floor panels can be locked to each other in horizontal direction as well as in vertical direction. Preferably, herein this relates to coupling means of the type known as such from WO 97/47834. Preferably, said coupling means substantially are made as a tongue-in-groove coupling, which is provided with locking means or locking parts, wherein said tongue-in-groove coupling realizes said vertical locking, whereas said locking means or parts are provided for realizing said locking in horizontal direction.
Preferably, said coupling means substantially are realized in said foamed synthetic material board. Preferably, said coupling means are provided by means of a milling treatment with rotating milling tools. Preferably, the floor panel of the invention relates to a rectangular, either oblong or square, panel, which, at both pairs of opposite sides, is provided with mechanical coupling means.
According to a particular embodiment, the floor panel, at least at two opposite edges, for example, at the long edges of an oblong floor panel, and preferably at all opposite edges, is provided with a recessed edge having, for example, the shape of a chamfer. Such chamfer preferably is limited in depth to the thickness of said transparent or translucent layer. In the case that a deeper recessed edge is intended, the surface of the recessed edge can be provided with a separate decorative covering, or the color and/or the appearance of a possible back layer and/or the substrate can be adapted to the desired effect to be obtained. Said recessed edge preferably is realized by removing a material portion on the respective edges. As an alternative, they can also be realized by means of a deformation exerted at the location of the edge material.
According to an alternative for the above particular embodiment, said recessed edge also be provided respectively on one edge of a pair opposite edges.
According to a second independent aspect, the present invention relates to a method for manufacturing panels, wherein these panels comprise at least a substrate and a top layer provided on said substrate, wherein said top layer comprises a thermoplastic, translucent or transparent layer, with the characteristic that said method comprises at least the following steps:
the step of providing said top layer, including said thermoplastic layer, on the substrate; the step of heating at least said thermoplastic layer; and
the step of structuring said thermoplastic layer at least by means of a mechanical press element.
It is clear that according to the second aspect of the invention, said thermoplastic layer as such, before being heated, already is layer-shaped. Preferably, said heating relates to heating from a temperature of less than 100° C. to a temperature of more than 100° C. Preferably, a temperature of minimum 120° C. and still better minimum 130° C. is obtained. Preferably, the temperature does not rise above 175° C. Preferably, said thermoplastic layer, before being heated, has a temperature of less than 60° C. and still better of less than 40° C. and/or is it not in a paste-like form.
For heating said thermoplastic layer, use can be made of a radiation source, preferably infrared light. As an alternative, also one or more hot-air ovens or hot-air pistols can be applied.
It is clear that the method of the second aspect preferably is applied for realizing the floor panels of the first aspect. Generally, it can also be applied, independently from the substrate material, for floor panels where such top layer, or at least said thermoplastic layer, substantially consists of a vinyl compound or a polyurethane compound. For examples of such top layers, also reference is made to the preferred first aspect, wherein then again not necessarily use is made of a foamed synthetic material board. Instead, use can be made of other synthetic material boards or of wood-based substrates, such as MDF or HDF, or of mineral boards, such as plasterboards. In any case, according to the second aspect, use preferably is made of a substrate having an average density of more than 450 kilograms per cubic meter, with a thickness situated between 5 and 12 millimeters, such that a sufficient dimensional stability is obtained.
Preferably, for the step of structuring, use is made of a press device of the cyclic type, more particular the short-cycle type; in German better known as a Kurztaktpresse. It is not excluded that the press device is applied for the step of heating the thermoplastic layer. Preferably, however, said heating of the thermoplastic layer is performed at least partially and preferably substantially or entirely prior to the press treatment. Instead of a Kurztaktpresse, use can also be made of a multiple-opening press, wherein then a plurality of thermoplastic layers are structured during the same press cycle.
Preferably, said press device is not heated. In other words, the press device preferably is applied at ambient temperature, wherein it is not excluded that the press element, by the contact with the surface of the thermoplastic layer to be structured, increases its temperature. The inventors have found that such method reduces the risk of deformations of the product. Moreover, such method results in a lower risk of the springing-back of the thermoplastic layer, such that sharp structural details can be realized.
When a heated press device is applied, such heated press cycle preferably is followed by a cold press cycle, whether or not performed in the same press device. If it is not performed in the same press device, preferably at least the same structured press element is applied. In this manner, problems with registering between two press elements can be avoided. For example, the thermoplastic layer with the press element provided thereon can be brought from one to the other press device as one stack, without interrupting the contact between the press element and the thermoplastic layer. It is noted that with a heated press cycle, preferably a temperature of more than 100° C. is reached at the surface of the thermoplastic layer, whereas with a cold press cycle preferably a temperature of less than 60° C. is reached at the surface of the thermoplastic layer.
According to a variant, the press element can be provided on the thermoplastic layer before the whole unit of at least the press element and the thermoplastic layer is fed into the press device. In such method, the thermoplastic layer, prior to the press treatment, can be at least partially heated in that the press element is heated. The heating or warming up of the press element can be performed, for example, by applying magnetic induction. In such method, it is possible to exclude a separate heating of the thermoplastic layer. As aforementioned, said press device preferably as such is not or almost not heated, such that a cooling down of the thermoplastic layer is obtained and the risk of springing back of the layer is minimized.
Preferably, a pressure of the press between 20 and 65 bar is applied, wherein a pressure of approximately 40 bar is a good value.
Preferably, pressing is performed during 12 to 60 seconds, still better during 15 to 30 seconds, and such preferably in the case of a press device of the short-cycle type.
Preferably, as the press element a flat press element or a so-called press platen is applied, which is provided with a structure. Such press element can be manufactured, for example, of metal, namely, a steel alloy, a copper alloy or an aluminum alloy, wherein the structure then can be obtained, for example, by means of etching, laser and/or milling treatments. As an alternative, use can also be made of press elements on the basis of synthetic material, for example, on the basis of melamine or Perspex (PMMA).
It is noted that a method wherein a press element on the basis of melamine or another thermo-hardening synthetic material is applied for structuring a thermoplastic layer, as such forms an independent inventive idea of the present patent application. Such press element as such can consist, for example, of one or more material sheets provided with such thermo-hardening synthetic material, such as paper layers, which are consolidated in a press device. The structure of such press element can be realized in any manner, for example, in that this press element as such is consolidated by means of a structured press element of metal, which, by means of etching, laser, and/or milling treatments, is provided with a relief. The advantage of such method is that the metal press element shows almost no wear, whereas the actual press element on the basis of a thermo-hardening synthetic material is cheap and can be considered a disposable tool. It is clear that the press element of this inventive idea preferably relates to a flat press element, or example, a press element for use in a press device of the cyclic type, in a Kurztaktpresse or in a multiple-opening press. The press element of the invention can be applied in an ideal manner in press treatments in which the press device does not have to be heated. In those applications, the reduced heat transfer of the thermo-harder is of no importance. In applications where heat transfer indeed is of importance, possibly additives in the thermo-harder can be used, which improve the heat conduction thereof, such as, for example, the addition of metal particles, carbon particles and the like. The inventors have found that a thermo-harder shows ideal detachment properties when providing a thermoplastic layer with a structure. Moreover, a thermo-harder can be provided with a sharp structure, such that the freedom of design does not have to be restricted.
Preferably, during the step of warming up, at least a pattern or motif, for example, a printed decor film, is situated on the lower side of said thermoplastic layer. Such method allows that in a smooth manner a structure can be obtained, which corresponds to the pattern or the motif. To this aim, a relative positioning between at least the pattern and the press element can be performed. Still better, the step of applying said top layer on the substrate is performed prior to or possibly at the same time with the step of heating up the thermoplastic layer. In such case, said press treatment preferably is performed a stack comprising at least the substrate and the top layer, including said thermoplastic layer. In the case of a multiple-opening press, then a plurality of such stacks are present in the same press, respectively separated by one or more structured press elements.
It is also noted that said top layer further can also comprise an UV surface coating. Such coating can be intended, for example, for obtaining a resistance against stains, in particular resulting from shoe soles, on the surface of the floor panel. Preferably, such surface coating is applied after said pressing step. Namely, the inventors have found that such surface coating results in an inferior pressing process.
It is clear that the structure, which according to the second aspect is provided in the surface of the thermoplastic layer, relates to a decorative relief, such as, for example, a relief imitating wood. Such relief can consist, for example, of separate impressions, which imitate wood pores and which together form a structure with the appearance of a wood nerve. Preferably, a plurality of such wood pores follow a wood nerve depicted in the motif. Of course, other structures can be realized, too, such as stone structures.
According to a third independent aspect, the present invention also relates to a method for manufacturing the floor panels of the first aspect and/or the preferred embodiments thereof, with the characteristic that this method comprises at least the steps of manufacturing said synthetic material board and of providing said top layer on this synthetic material board, wherein these two steps are performed continuously on the same production line. Preferably, herein said synthetic material board is extruded. The third aspect of the invention provides for an extremely smooth production process for such floor panels.
Preferably, the top layer is at least partially obtained from polyvinyl chloride (PVC) or other vinyl compounds. According to a first possibility for this, it can be started from extruded PVC, which, via heated rollers, is placed as a layer-shaped substance on a carrier material and hardens there. Herein, the carrier material either can comprise said synthetic material board, or can comprise a separate carrier material, such as a glass fiber cloth. Preferably, the carrier material is heated. Possibly, in said vinyl compounds use can be made of plasticizers, such as phthalate plasticizers isosorbide plasticizers, and/or of waxes, for obtaining a smoother process. According to a second possibility hereof, it can be started from one or more vinyl-containing synthetic material films, which are adhered to the synthetic material board, preferably after supplying heat.
Preferably, on the production line of the third aspect, larger boards consisting of foamed synthetic material layers with top layers are formed, from which afterwards, by means of at least a dividing operation, such as a sawing operation, a plurality of floor panels can be obtained.
Of course, the method of the third aspect can be combined with a method having the characteristics of the second aspect.
According to all aspects, the present invention relates to floor panels or other panels, which as such are rigid and thus as such can not be wound up. Preferably, the final panel shows a thickness of more than 5 millimeters, however, preferably less of than 15 millimeters. A good value for the thickness is 7 to 10 millimeters. Such panels are very suitable for providing mechanical coupling means thereon, which allow to couple two or more such panels at their edges to each other. Preferably, herein use is made of mechanical coupling means, such as of the type known from WO 97/47834. It is clear that also the possible larger boards, from which a plurality of such floor panels are formed, and the substrates as such are rigid. Preferably, the floor panels, boards and substrates are so rigid that they will bend less than 10 centimeters per meter under their own weight.
With the intention of better showing the characteristics of the invention, hereafter, as an example without any limitative character, some preferred embodiments are described, with reference to the accompanying drawings.
In the example of
The coupling means 9 represented here also comprise locking means or locking parts 18-19, which result in a locking in a horizontal direction H1 perpendicular to the coupled edges 5-6 and in the plane of the coupled floor panels 1. In the example, the locking parts 18-19 are formed as an upstanding part 19 on the lower lip 13 and a recess 18 on the lower side of the tongue 10. These locking parts 18-19 are provided in each other when coupling two or more of such floor panels 1. Herein, one or more, preferably two, pairs 20-21-22-23 of horizontally active locking surfaces are created. In the example, one pair of horizontally active locking surfaces 20-21 is situated on said upstanding part 19 and cooperating therewith surface 20 of said recess 18. This pair of horizontal locking surfaces 20-21 is formed from the material of the particular substrate 2 of the invention. The respective locking surfaces 20-21 are oriented at an angle A with the surface of the floor panels 1. This angle A preferably is more than 30 degrees, and still better more than 45 degrees. Angles A of 90 degrees or more are not excluded. The second pair of horizontal locking surfaces 22-23 of the example is situated next to the floor surface, at the height of the location where the top layers 3 of two floor panels, which are coupled to each other, are flanking each other. In this case, this second pair of locking surfaces 22-23 is made substantially vertical. Moreover, this pair of horizontally active locking surfaces 22-23 is substantially and here even exclusively formed of the material of the top layer 3.
Many of the characteristics listed up above and represented in
The particularity of the present invention, at least according to its first aspect, consists in that said substrate 2 substantially consists of a foamed synthetic material board. In the example, the substrate 2 relates to a foamed PVC board of the closed cell type. The board 2 concerned has an average density of 450 kilograms per cubic meter, however, also has a local density on both flat sides 24-25, namely, a density of 500 kilograms per cubic meter or more, which is higher than the density of a central layer 26 of the synthetic material board 2. Moreover, the substrate 2 comprises separate layers 27, in this case layers of glass fiber, which increase the bending stiffness thereof. In the example, these separate layers 27 are situated on both flat sides 24-25 of the substrate 2.
The top layer 3 of the floor panel 1 of the example is a top layer 3 which substantially consists of synthetic material, namely, of a vinyl compound such as PVC (polyvinyl chloride). This top layer 3 has a higher density than the average density of the substrate 2. The represented top layer 3 as such consists of a back layer 28, a provided thereon motif 4 and a transparent wear layer 29. The back layer 28 is the thickest and densest layer of the top layer 3. It consists of recycled synthetic material, here PVC, which comprises filler material, preferably chalk. For said motif 4, use is made of a printed synthetic material film 30. For example, use can be made of a synthetic material film 30 which is printed by means of solvent inks. Such inks may result in a high-resolution print quality. The synthetic material film 30 as such can consist of PVC or another vinyl compound. For the transparent layer or wear layer 29, use is made of vinyl, such as PVC.
Preferably, said transparent layer 29 is free from filler materials or hard particles, such as aluminum oxide. The inventors have found that a transparent or translucent layer 29 of 0.2 millimeters of vinyl as such is sufficient for obtaining an acceptable wear resistance. Of course, it is not excluded that use should be made of a wear layer 29 which comprises hard particles. However, these have a negative influence on the transparency of such wear layer and lead to accelerated wear of machines which are applied when manufacturing such floor panels 1. When hard particles are applied, preferably a wear layer 29 is used having a thickness of less than 0.3 millimeters, or even less than 0.2 millimeters. Preferably, in such case use is made of hard particles in a concentration of 5 to 20 grams per square meter, wherein 10 grams per square meter represent a good value. Preferably, the applied hard particles have an average grain size between 30 and 120 micrometers, and still better between 50 and 90 micrometers.
As is mentioned in the introduction, however, not represented here, the floor panel 1 can be provided with a surface layer at its surface, for example, on the basis of a UV-hardened substance. Such layer preferably has a thickness of less than 0.1 millimeter, or still better of less than 50 micrometers. It is not excluded that such surface layer includes hard particles, such as aluminum oxide particles, wherein these hard particles preferably have an average grain size of less than 50 micrometers. Possibly, flat particles may be used here.
In dashed line 31, it is represented on
The method comprises a step S1 where in the top layer 3 is provided on the substrate 2, and a step S2 wherein a thermoplastic translucent or transparent layer 29, which forms part of the top layer 3, is structured by means of a mechanical press element 33. In the example of
Preferably, by means of the step S2 of structuring, impressions 36 are obtained which in location and/or size correspond to the motif 4.
Prior to the press treatment, a step S0 is performed, wherein two thermoplastic layers 29-30 are adhered to each other. Namely, the synthetic material film 30 and the transparent thermoplastic layer 29 are welded or melted to each other by means of a calender device 37. To this aim, use is made of infrared heating 38 and one or more rollers 39. The obtained whole is cut to sheets 41 by means of the cutting tool 40 and, together with the back layer 28, the substrate 2 and a backing layer 32, is brought into the press device 34.
During said press treatment, a third step S3 is performed, too. Herein, the thermoplastic translucent or transparent layer 29 is heated again, by which providing a structure by means of the press element 33 becomes possible. Moreover, by means of this heat an adherence of the thermoplastic layer 29, the synthetic material film 30, the back layer 28, the substrate 2 and the backing layer 32 is obtained. Preferably, the hot press cycle is followed by a cold or cooled press cycle, whether or not taking place in the same press device 34. Such cool cycle prevents an excessive springing back of the realized structure of impressions 36.
According to a not represented variant of
In accordance with the second aspect of the invention, in
It is possible that the thermoplastic layer 29 is provided with a structure at least partially prior to the step S1 of applying this layer 29 on the substrate 2. To this aim, for example, a structured roller 45 can be applied.
In the example of
According to an alternative, which is not represented here, the substrate 2 and one or more partial layers 28-29-30 of the top layer 3 and/or the backing layer 32 are extruded together via so-called coextrusion. Preferably, in such case at least the back layer 28 and/or the backing layer 32 are extruded together with a synthetic material board 2, preferably a foamed synthetic material layer, such as described by means of the first aspect of the invention.
It is clear that the method illustrated in
According to the embodiments of
It is clear that the infrared heating units 38, as mentioned and/or represented in connection with the figures, can be replaced by any other heating apparatus. According to a particular variant, the press element 33 is provided on the thermoplastic layer 29 prior to the step S2 of providing a structure and this press element 33 is heated, wherein the heating of the thermoplastic layer 29 then occurs at least partially by the contact with the press element 33. In the case of a metallic press element 33, the warming up of the press element 33 can be performed by means of magnetic induction.
The present invention is in no way limited to the embodiments described herein above, on the contrary, such methods and floor panels can be realized according to various variants, without leaving the scope of the present invention. Moreover, the panels, instead as floor panels 1, may also be realized as wall panels or ceiling panels or even as furniture panels. Of course, the methods of the invention, mutatis mutandis, can be applied for manufacturing wall panels, ceiling panels, furniture panels or the like.
Number | Date | Country | Kind |
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2010/0283 | May 2010 | BE | national |
This application is a continuation application of U.S. patent application Ser. No. 15/695,163, filed Sep. 5, 2017, which is a continuation of U.S. patent application Ser. No. 15/045,389 filed Feb. 17, 2016, now U.S. Pat. No. 9,783,995 issued Oct. 10, 2017, which is a continuation application of U.S. patent application Ser. No. 14/015,307 filed Aug. 30, 2013, now U.S. Pat. No. 9,322,184 issued Apr. 26, 2016, which is a divisional application of U.S. patent application Ser. No. 13/696,769 filed Nov. 7, 2012, now U.S. Pat. No. 8,549,807 issued Oct. 8, 2013, which is a US National Phase Application of International Application No. PCT/IB2011/051884 filed Apr. 28, 2011, the entire content of all which are incorporated herein by reference. This application claims priority under 35 USC § 119(a)-(d) to Belgian Patent Application No. 2010/0283 filed May 10, 2010, the entire content of which is incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
1387011 | Ratcliff | Aug 1921 | A |
1448180 | Atwood et al. | Mar 1923 | A |
1887011 | Carr et al. | Sep 1930 | A |
1921164 | Lewis | Aug 1933 | A |
1971067 | Fess | Aug 1934 | A |
2143220 | Cheney | Jan 1939 | A |
3038363 | Miessner | Jun 1962 | A |
3173804 | Standfuss | Mar 1965 | A |
3282010 | King, Jr. | Nov 1966 | A |
3305419 | Voelker | Feb 1967 | A |
3383262 | Ettore et al. | May 1968 | A |
3434861 | Luc | Mar 1969 | A |
3483057 | Mittman | Dec 1969 | A |
3498870 | Fritchey | Mar 1970 | A |
3554827 | Yamagishi | Jan 1971 | A |
3740914 | Diez | Jun 1973 | A |
3741851 | Erb et al. | Jun 1973 | A |
3810774 | Pittman | May 1974 | A |
3811915 | Burrell et al. | May 1974 | A |
3853685 | Friedrich et al. | Dec 1974 | A |
3905849 | Bomboire | Sep 1975 | A |
3962507 | McCreary et al. | Jun 1976 | A |
4050409 | Duchenaud et al. | Sep 1977 | A |
4097635 | Hernández et al. | Jun 1978 | A |
4208468 | Cunningham et al. | Jun 1980 | A |
4225374 | Kaufmann | Sep 1980 | A |
4233343 | Barker et al. | Nov 1980 | A |
4242390 | Nemeth | Dec 1980 | A |
4312686 | Smith | Jan 1982 | A |
4379198 | Jaeschke et al. | Apr 1983 | A |
4396566 | Brinkmann et al. | Aug 1983 | A |
4397896 | Moran | Aug 1983 | A |
4400862 | Ignell | Aug 1983 | A |
4426820 | Terbrack et al. | Jan 1984 | A |
4471012 | Maxwell | Sep 1984 | A |
4614680 | Fry et al. | Sep 1986 | A |
4654099 | Sandman | Mar 1987 | A |
4690434 | Schmidt | Sep 1987 | A |
4778547 | Becker et al. | Oct 1988 | A |
4833855 | Winter, IV | May 1989 | A |
4844763 | Robbins | Jul 1989 | A |
4913858 | Miekka et al. | Apr 1990 | A |
4948653 | Dinter et al. | Aug 1990 | A |
4975008 | Wagner | Dec 1990 | A |
5023140 | Glotfelter et al. | Jun 1991 | A |
5034084 | Schäfer et al. | Jul 1991 | A |
5077112 | Hensel et al. | Dec 1991 | A |
5082495 | Ijima | Jan 1992 | A |
5098357 | Asada et al. | Mar 1992 | A |
5112671 | Diamond et al. | May 1992 | A |
5261508 | Kikuchi | Nov 1993 | A |
5275862 | Ramadan et al. | Jan 1994 | A |
5282859 | Eisenberg | Feb 1994 | A |
5287678 | Leitzel | Feb 1994 | A |
5344704 | O'Dell et al. | Sep 1994 | A |
5394672 | Seem | Mar 1995 | A |
5437934 | Witt et al. | Aug 1995 | A |
5437964 | Witt et al. | Aug 1995 | A |
5466320 | Burt et al. | Nov 1995 | A |
5494707 | Wang et al. | Feb 1996 | A |
5506031 | Spain et al. | Apr 1996 | A |
5516472 | Laver | May 1996 | A |
5560797 | Burt | Oct 1996 | A |
5588166 | Burnett | Dec 1996 | A |
5728476 | Harwood et al. | Mar 1998 | A |
5755068 | Ormiston | May 1998 | A |
5769219 | Shimel | Jun 1998 | A |
5769835 | Fell et al. | Jun 1998 | A |
5787675 | Futagi | Aug 1998 | A |
5836128 | Groh et al. | Nov 1998 | A |
5863632 | Bisker | Jan 1999 | A |
5880307 | Daugherty et al. | Mar 1999 | A |
5899038 | Stroppiana | May 1999 | A |
5916662 | Schmidt | Jun 1999 | A |
5928772 | Shiraishi et al. | Jul 1999 | A |
5952076 | Foster | Sep 1999 | A |
5961903 | Eby et al. | Oct 1999 | A |
5976288 | Ekendahl | Nov 1999 | A |
5988503 | Kuo | Nov 1999 | A |
6006486 | Moriau et al. | Dec 1999 | A |
6098357 | Franklin et al. | Aug 2000 | A |
6216409 | Roy et al. | Apr 2001 | B1 |
6247285 | Moebus | Jun 2001 | B1 |
6256959 | Palmersten | Jul 2001 | B1 |
6282859 | Van Der Heijden | Sep 2001 | B1 |
6287678 | Spengler | Sep 2001 | B1 |
6296732 | Enlow et al. | Oct 2001 | B1 |
6306318 | Ricciardelli et al. | Oct 2001 | B1 |
6333094 | Schneider et al. | Dec 2001 | B1 |
6345481 | Nelson | Feb 2002 | B1 |
6356481 | Micheloni et al. | Mar 2002 | B1 |
6385936 | Schneider | May 2002 | B1 |
6428871 | Cozzolino | Aug 2002 | B1 |
6444073 | Reeves et al. | Sep 2002 | B1 |
6444075 | Schneider et al. | Sep 2002 | B1 |
6467224 | Bertolini | Oct 2002 | B1 |
6477948 | Nissing et al. | Nov 2002 | B1 |
6490836 | Moriau et al. | Dec 2002 | B1 |
6505452 | Hannig et al. | Jan 2003 | B1 |
6536178 | Pålsson et al. | Mar 2003 | B1 |
6588166 | Martensson et al. | Jul 2003 | B2 |
6589379 | Harwood | Jul 2003 | B1 |
6591568 | Pålsson | Jul 2003 | B1 |
6617009 | Chen et al. | Sep 2003 | B1 |
6647690 | Martensson | Nov 2003 | B1 |
6764741 | Kawasumi et al. | Jul 2004 | B2 |
6769219 | Schwitte et al. | Aug 2004 | B2 |
6769835 | Stridsman | Aug 2004 | B2 |
6772568 | Thiers et al. | Aug 2004 | B2 |
6804926 | Eisermann | Oct 2004 | B1 |
6874282 | Moriau et al. | Apr 2005 | B1 |
6880307 | Schwitte et al. | Apr 2005 | B2 |
6918221 | Williams | Jul 2005 | B2 |
6928779 | Moriau et al. | Aug 2005 | B2 |
6931811 | Thiers | Aug 2005 | B2 |
6933043 | Son et al. | Aug 2005 | B1 |
6955020 | Moriau et al. | Oct 2005 | B2 |
6979487 | Scarbrough et al. | Dec 2005 | B2 |
6986934 | Chen et al. | Jan 2006 | B2 |
6991830 | Hansson et al. | Jan 2006 | B1 |
6993877 | Moriau et al. | Feb 2006 | B2 |
7040068 | Moriau et al. | May 2006 | B2 |
7063768 | Tsujimoto et al. | Jun 2006 | B2 |
7093399 | Thiers et al. | Aug 2006 | B2 |
7169460 | Chen et al. | Jan 2007 | B1 |
7211310 | Chen et al. | May 2007 | B2 |
7243469 | Miller et al. | Jul 2007 | B2 |
7261947 | Reichwein et al. | Aug 2007 | B2 |
7328536 | Moriau et al. | Feb 2008 | B2 |
7357959 | Bauer | Apr 2008 | B2 |
7377081 | Ruhdorfer | May 2008 | B2 |
7419717 | Chen et al. | Sep 2008 | B2 |
7451578 | Hannig | Nov 2008 | B2 |
7452440 | Tsujimoto et al. | Nov 2008 | B1 |
7467499 | Moriau et al. | Dec 2008 | B2 |
7484337 | Hecht | Feb 2009 | B2 |
7516588 | Pervan | Apr 2009 | B2 |
7584583 | Bergelin et al. | Sep 2009 | B2 |
7596920 | Konstanczak | Oct 2009 | B2 |
7600354 | Knauseder | Oct 2009 | B2 |
7603826 | Moebus | Oct 2009 | B1 |
7617645 | Moriau et al. | Nov 2009 | B2 |
7621092 | Groeke et al. | Nov 2009 | B2 |
7621094 | Moriau et al. | Nov 2009 | B2 |
7634886 | Moriau et al. | Dec 2009 | B2 |
7634887 | Moriau et al. | Dec 2009 | B2 |
7637066 | Moriau et al. | Dec 2009 | B2 |
7637067 | Moriau et al. | Dec 2009 | B2 |
7640708 | Moriau et al. | Jan 2010 | B2 |
7641963 | Grafenauer | Jan 2010 | B2 |
7644554 | Moriau et al. | Jan 2010 | B2 |
7644555 | Moriau et al. | Jan 2010 | B2 |
7644557 | Moriau et al. | Jan 2010 | B2 |
7647741 | Moriau et al. | Jan 2010 | B2 |
7647743 | Moriau et al. | Jan 2010 | B2 |
7650727 | Moriau et al. | Jan 2010 | B2 |
7650728 | Moriau et al. | Jan 2010 | B2 |
7654054 | Moriau et al. | Feb 2010 | B2 |
7658048 | Moriau et al. | Feb 2010 | B2 |
7661238 | Moriau et al. | Feb 2010 | B2 |
7665265 | Moriau et al. | Feb 2010 | B2 |
7665266 | Moriau et al. | Feb 2010 | B2 |
7665267 | Moriau et al. | Feb 2010 | B2 |
7665268 | Moriau et al. | Feb 2010 | B2 |
7669376 | Moriau et al. | Mar 2010 | B2 |
7669377 | Moriau et al. | Mar 2010 | B2 |
7673431 | Moriau et al. | Mar 2010 | B2 |
7677008 | Moriau et al. | Mar 2010 | B2 |
7681371 | Moriau et al. | Mar 2010 | B2 |
7698868 | Moriau et al. | Apr 2010 | B2 |
7698869 | Moriau et al. | Apr 2010 | B2 |
7707793 | Moriau et al. | May 2010 | B2 |
7712280 | Moriau et al. | May 2010 | B2 |
7726088 | Muehlebach | Jun 2010 | B2 |
7726089 | Moriau et al. | Jun 2010 | B2 |
7735288 | Moriau et al. | Jun 2010 | B2 |
7757453 | Moriau et al. | Jul 2010 | B2 |
7762035 | Cappelle | Jul 2010 | B2 |
7763345 | Chen et al. | Jul 2010 | B2 |
7770350 | Moriau et al. | Aug 2010 | B2 |
7810297 | Moriau et al. | Oct 2010 | B2 |
7827754 | Moriau et al. | Nov 2010 | B2 |
7827755 | Moriau et al. | Nov 2010 | B2 |
7836648 | Garcia et al. | Nov 2010 | B2 |
7841145 | Pervan et al. | Nov 2010 | B2 |
7861483 | Dammers | Jan 2011 | B2 |
7930862 | Bergelin et al. | Apr 2011 | B2 |
7980039 | Groeke et al. | Jul 2011 | B2 |
7984600 | Alford et al. | Jul 2011 | B2 |
8021741 | Chen et al. | Sep 2011 | B2 |
8038363 | Hannig et al. | Oct 2011 | B2 |
8056236 | Brouckaert et al. | Nov 2011 | B2 |
8071193 | Windmöller | Dec 2011 | B2 |
8099919 | Garcia | Jan 2012 | B2 |
8099924 | Braun | Jan 2012 | B2 |
8112891 | Pervan | Feb 2012 | B2 |
8132384 | Hannig | Mar 2012 | B2 |
8153234 | Nollet et al. | Apr 2012 | B2 |
8156705 | Alford et al. | Apr 2012 | B2 |
8166723 | Moriau et al. | May 2012 | B2 |
8171691 | Stone | May 2012 | B1 |
8191333 | Braun | Jun 2012 | B2 |
8204904 | Bonchi et al. | Jun 2012 | B2 |
8209928 | Garcia et al. | Jul 2012 | B2 |
8245477 | Pervan | Aug 2012 | B2 |
8245478 | Bergelin et al. | Aug 2012 | B2 |
8261508 | Thiers | Sep 2012 | B2 |
8272187 | Meersseman et al. | Sep 2012 | B2 |
8302361 | Braun et al. | Nov 2012 | B2 |
8302367 | Schulte | Nov 2012 | B2 |
8303743 | Youn et al. | Nov 2012 | B2 |
8335212 | Hovey et al. | Dec 2012 | B2 |
8336272 | Prager et al. | Dec 2012 | B2 |
8341915 | Pervan et al. | Jan 2013 | B2 |
8365494 | Moriau et al. | Feb 2013 | B2 |
8375672 | Hannig | Feb 2013 | B2 |
8381476 | Hannig | Feb 2013 | B2 |
8381477 | Pervan et al. | Feb 2013 | B2 |
8407963 | Schulte | Apr 2013 | B2 |
8465804 | Provoost et al. | Jun 2013 | B2 |
8475871 | Oldorff | Jul 2013 | B2 |
8511031 | Bergelin et al. | Aug 2013 | B2 |
8511040 | Braun et al. | Aug 2013 | B2 |
8516767 | Engstrom | Aug 2013 | B2 |
8584423 | Pervan et al. | Nov 2013 | B2 |
8621814 | Cappelle | Jan 2014 | B2 |
8631621 | Hannig | Jan 2014 | B2 |
8726513 | Braun et al. | May 2014 | B2 |
8789334 | Moriau et al. | Jul 2014 | B2 |
8806830 | Schacht et al. | Aug 2014 | B2 |
8820014 | Durnberger | Sep 2014 | B2 |
8839584 | Sokol | Sep 2014 | B2 |
8925275 | Meersseman et al. | Jan 2015 | B2 |
8956714 | Vermeulen | Feb 2015 | B2 |
8966852 | Cappelle | Mar 2015 | B2 |
8966853 | Hannig | Mar 2015 | B2 |
8991055 | Cappelle | Mar 2015 | B2 |
8997429 | Moriau et al. | Apr 2015 | B2 |
9080330 | Meersseman et al. | Jul 2015 | B2 |
9109366 | Schulte | Aug 2015 | B2 |
9145691 | Cappelle | Sep 2015 | B2 |
9169658 | Hecht | Oct 2015 | B2 |
9194133 | Thiers | Nov 2015 | B2 |
9200460 | Cappelle | Dec 2015 | B2 |
9222267 | Bergelin et al. | Dec 2015 | B2 |
9290040 | Verhaeghe | Mar 2016 | B2 |
9290948 | Cappelle et al. | Mar 2016 | B2 |
9290951 | Moriau et al. | Mar 2016 | B2 |
9322184 | Meersseman | Apr 2016 | B2 |
9366035 | Meersseman et al. | Jun 2016 | B2 |
9366037 | Cappelle | Jun 2016 | B2 |
9371654 | Cappelle | Jun 2016 | B2 |
9487957 | Cappelle | Nov 2016 | B2 |
9506256 | Thiers | Nov 2016 | B2 |
9528278 | Cappelle | Dec 2016 | B2 |
9534400 | Schacht et al. | Jan 2017 | B2 |
9670682 | Cappelle | Jun 2017 | B2 |
9670683 | Cappelle | Jun 2017 | B2 |
9695599 | Cappelle | Jul 2017 | B2 |
9745756 | Hannig | Aug 2017 | B2 |
9765530 | Bergelin et al. | Sep 2017 | B2 |
9783995 | Meersseman et al. | Oct 2017 | B2 |
9809984 | Meersseman et al. | Nov 2017 | B2 |
9890542 | Cappelle | Feb 2018 | B2 |
9932741 | Cappelle et al. | Apr 2018 | B2 |
10041259 | Meersseman et al. | Aug 2018 | B2 |
10094123 | Meersseman et al. | Oct 2018 | B2 |
10100532 | Schacht et al. | Oct 2018 | B2 |
10100533 | Meersseman et al. | Oct 2018 | B2 |
10125499 | Cappelle | Nov 2018 | B2 |
10213973 | Hawkins et al. | Feb 2019 | B2 |
10233655 | Meersseman et al. | Mar 2019 | B2 |
10240348 | Pervan et al. | Mar 2019 | B2 |
10267048 | Meersseman et al. | Apr 2019 | B2 |
10358831 | Cappelle | Jul 2019 | B2 |
10450760 | Bergelin et al. | Oct 2019 | B2 |
10519674 | Cappelle | Dec 2019 | B2 |
10597876 | Meersseman et al. | Mar 2020 | B2 |
20010034991 | Martensson et al. | Nov 2001 | A1 |
20020007909 | Mott et al. | Jan 2002 | A1 |
20020009598 | Lafave et al. | Jan 2002 | A1 |
20020020127 | Thiers et al. | Feb 2002 | A1 |
20020025446 | Chen et al. | Feb 2002 | A1 |
20020046527 | Nelson | Apr 2002 | A1 |
20020046528 | Pervan et al. | Apr 2002 | A1 |
20020056245 | Thiers | May 2002 | A1 |
20020090490 | Kawasumi et al. | Jul 2002 | A1 |
20020092252 | Kettler et al. | Jul 2002 | A1 |
20020092263 | Schulte | Jul 2002 | A1 |
20020136862 | Dong et al. | Sep 2002 | A1 |
20020142106 | Bethune et al. | Oct 2002 | A1 |
20020160680 | Laurence et al. | Oct 2002 | A1 |
20020170258 | Schwitte et al. | Nov 2002 | A1 |
20020189183 | Ricciardelli | Dec 2002 | A1 |
20030024199 | Pervan et al. | Feb 2003 | A1 |
20030024200 | Moriau et al. | Feb 2003 | A1 |
20030024201 | Moriau et al. | Feb 2003 | A1 |
20030029115 | Moriau et al. | Feb 2003 | A1 |
20030029116 | Moriau et al. | Feb 2003 | A1 |
20030029117 | Moriau et al. | Feb 2003 | A1 |
20030029119 | Coleman | Feb 2003 | A1 |
20030033777 | Thiers et al. | Feb 2003 | A1 |
20030033779 | Downey | Feb 2003 | A1 |
20030037504 | Schwitte et al. | Feb 2003 | A1 |
20030097808 | Sabatini | May 2003 | A1 |
20030101674 | Pervan et al. | Jun 2003 | A1 |
20030159385 | Thiers | Aug 2003 | A1 |
20030159777 | Tsujimoto et al. | Aug 2003 | A1 |
20030233809 | Pervan | Dec 2003 | A1 |
20040016196 | Pervan | Jan 2004 | A1 |
20040016197 | Ruhdorfer | Jan 2004 | A1 |
20040020145 | Matsufuji | Feb 2004 | A1 |
20040026017 | Taylor et al. | Feb 2004 | A1 |
20040028830 | Bauer | Feb 2004 | A1 |
20040068954 | Martensson | Apr 2004 | A1 |
20040071978 | Hallenbeck et al. | Apr 2004 | A1 |
20040086678 | Chen et al. | May 2004 | A1 |
20040102120 | Plusquellec et al. | May 2004 | A1 |
20040103602 | Geraud | Jun 2004 | A1 |
20040126550 | Grafenauer | Jul 2004 | A1 |
20040128934 | Hecht | Jul 2004 | A1 |
20040137248 | Elsasser | Jul 2004 | A1 |
20040139678 | Pervan | Jul 2004 | A1 |
20040139679 | Della Pepa | Jul 2004 | A1 |
20040146695 | Hardwick | Jul 2004 | A1 |
20040161588 | Mauk et al. | Aug 2004 | A1 |
20040168392 | Konzelmann et al. | Sep 2004 | A1 |
20040182036 | Sjoberg et al. | Sep 2004 | A1 |
20040191547 | Oldorff | Sep 2004 | A1 |
20040211143 | Hannig | Oct 2004 | A1 |
20040248489 | Hutchison et al. | Dec 2004 | A1 |
20040250914 | Olofsson | Dec 2004 | A1 |
20040255538 | Ruhdorfer | Dec 2004 | A1 |
20050003160 | Chen et al. | Jan 2005 | A1 |
20050016107 | Rosenthal et al. | Jan 2005 | A1 |
20050025934 | Thiers | Feb 2005 | A1 |
20050050827 | Schitter | Mar 2005 | A1 |
20050153243 | Rundle et al. | Jul 2005 | A1 |
20050183370 | Cripps | Aug 2005 | A1 |
20050186393 | Wilson | Aug 2005 | A1 |
20050208255 | Pervan | Sep 2005 | A1 |
20050221056 | Schwonke et al. | Oct 2005 | A1 |
20050224174 | Tsujimoto et al. | Oct 2005 | A1 |
20050249929 | Reichwein et al. | Nov 2005 | A1 |
20050281986 | Nam | Dec 2005 | A1 |
20050284075 | Moriau et al. | Dec 2005 | A1 |
20050284076 | Moriau et al. | Dec 2005 | A1 |
20060005499 | Moriau et al. | Jan 2006 | A1 |
20060008630 | Thiers | Jan 2006 | A1 |
20060032175 | Chen | Feb 2006 | A1 |
20060032177 | Moriau et al. | Feb 2006 | A1 |
20060062966 | Kang et al. | Mar 2006 | A1 |
20060064940 | Cappelle | Mar 2006 | A1 |
20060070332 | Palsson et al. | Apr 2006 | A1 |
20060075713 | Pervan et al. | Apr 2006 | A1 |
20060130416 | Mohr et al. | Jun 2006 | A1 |
20060144004 | Nollet | Jul 2006 | A1 |
20060156670 | Knauseder | Jul 2006 | A1 |
20060156672 | Laurent et al. | Jul 2006 | A1 |
20060174578 | Konstanczak | Aug 2006 | A1 |
20060179773 | Pervan | Aug 2006 | A1 |
20060196138 | Moriau et al. | Sep 2006 | A1 |
20060201095 | Moriau et al. | Sep 2006 | A1 |
20060204773 | Kwon et al. | Sep 2006 | A1 |
20060225370 | Moriau et al. | Oct 2006 | A1 |
20060225377 | Moriau et al. | Oct 2006 | A1 |
20060236630 | Moriau et al. | Oct 2006 | A1 |
20060236631 | Moriau et al. | Oct 2006 | A1 |
20060236632 | Moriau et al. | Oct 2006 | A1 |
20060236633 | Moriau et al. | Oct 2006 | A1 |
20060236634 | Moriau et al. | Oct 2006 | A1 |
20060236635 | Moriau et al. | Oct 2006 | A1 |
20060236636 | Moriau et al. | Oct 2006 | A1 |
20060236637 | Moriau et al. | Oct 2006 | A1 |
20060236638 | Moriau et al. | Oct 2006 | A1 |
20060236643 | Moriau et al. | Oct 2006 | A1 |
20060248829 | Moriau et al. | Nov 2006 | A1 |
20060248830 | Moriau et al. | Nov 2006 | A1 |
20060248831 | Moriau et al. | Nov 2006 | A1 |
20060254183 | Moriau et al. | Nov 2006 | A1 |
20060254184 | Moriau et al. | Nov 2006 | A1 |
20060254185 | Moriau et al. | Nov 2006 | A1 |
20060260249 | Moriau et al. | Nov 2006 | A1 |
20060272263 | Moriau et al. | Dec 2006 | A1 |
20060280870 | Halot et al. | Dec 2006 | A1 |
20070006543 | Engstrom | Jan 2007 | A1 |
20070022694 | Chen et al. | Feb 2007 | A1 |
20070051064 | Thiers | Mar 2007 | A1 |
20070084368 | Vest et al. | Apr 2007 | A1 |
20070094978 | Svanholm et al. | May 2007 | A1 |
20070094986 | Moriau et al. | May 2007 | A1 |
20070094987 | Moriau et al. | May 2007 | A1 |
20070107360 | Moriau et al. | May 2007 | A1 |
20070107363 | Moriau et al. | May 2007 | A1 |
20070125021 | Thiers | Jun 2007 | A1 |
20070130872 | Goodwin et al. | Jun 2007 | A1 |
20070141316 | McGrath et al. | Jun 2007 | A1 |
20070151189 | Yang | Jul 2007 | A1 |
20070175148 | Bergelin et al. | Aug 2007 | A1 |
20070175160 | Groeke et al. | Aug 2007 | A1 |
20070193178 | Groeke et al. | Aug 2007 | A1 |
20070202314 | Youn et al. | Aug 2007 | A1 |
20070207290 | Oldorff | Sep 2007 | A1 |
20070251188 | Moriau et al. | Nov 2007 | A1 |
20070254175 | Song et al. | Nov 2007 | A1 |
20070266666 | Dammers | Nov 2007 | A1 |
20070294968 | Braun | Dec 2007 | A1 |
20080000183 | Bergelin et al. | Jan 2008 | A1 |
20080000186 | Pervan et al. | Jan 2008 | A1 |
20080005999 | Pervan | Jan 2008 | A1 |
20080010928 | Moriau et al. | Jan 2008 | A1 |
20080010929 | Moriau et al. | Jan 2008 | A1 |
20080010931 | Pervan et al. | Jan 2008 | A1 |
20080010938 | Hannig | Jan 2008 | A1 |
20080029926 | Steinwender et al. | Feb 2008 | A1 |
20080034701 | Pervan | Feb 2008 | A1 |
20080053027 | Moriau et al. | Mar 2008 | A1 |
20080053028 | Moriau et al. | Mar 2008 | A1 |
20080060308 | Pervan et al. | Mar 2008 | A1 |
20080060309 | Moriau et al. | Mar 2008 | A1 |
20080060310 | Moriau et al. | Mar 2008 | A1 |
20080060311 | Moriau et al. | Mar 2008 | A1 |
20080066416 | Moriau et al. | Mar 2008 | A1 |
20080066425 | Jacobsson et al. | Mar 2008 | A1 |
20080078181 | Mueller et al. | Apr 2008 | A1 |
20080107841 | Remillard et al. | May 2008 | A1 |
20080118713 | Bordener | May 2008 | A1 |
20080134607 | Pervan et al. | Jun 2008 | A1 |
20080134613 | Pervan | Jun 2008 | A1 |
20080134614 | Pervan et al. | Jun 2008 | A1 |
20080138560 | Windmoller | Jun 2008 | A1 |
20080152825 | Mukai et al. | Jun 2008 | A1 |
20080168737 | Pervan | Jul 2008 | A1 |
20080172856 | Brouckaert et al. | Jul 2008 | A1 |
20080261019 | Shen et al. | Oct 2008 | A1 |
20080295432 | Pervan et al. | Dec 2008 | A1 |
20080295438 | Knauseder | Dec 2008 | A1 |
20080295958 | Tsujimoto et al. | Dec 2008 | A1 |
20080305312 | Kim et al. | Dec 2008 | A1 |
20080311355 | Chen et al. | Dec 2008 | A1 |
20090019801 | Coghlan et al. | Jan 2009 | A1 |
20090019806 | Muehlebach | Jan 2009 | A1 |
20090019808 | Palsson et al. | Jan 2009 | A1 |
20090031662 | Chen et al. | Feb 2009 | A1 |
20090038254 | Steele et al. | Feb 2009 | A1 |
20090042010 | Stanhope | Feb 2009 | A1 |
20090047465 | Zafiroglu | Feb 2009 | A1 |
20090049786 | Hwang et al. | Feb 2009 | A1 |
20090061168 | Kim et al. | Mar 2009 | A1 |
20090064624 | Sokol | Mar 2009 | A1 |
20090100782 | Groeke et al. | Apr 2009 | A1 |
20090126308 | Hannig et al. | May 2009 | A1 |
20090133353 | Pervan et al. | May 2009 | A1 |
20090133358 | Hecht | May 2009 | A1 |
20090139170 | Thiers | Jun 2009 | A1 |
20090151290 | Liu | Jun 2009 | A1 |
20090155612 | Pervan et al. | Jun 2009 | A1 |
20090173032 | Prager et al. | Jul 2009 | A1 |
20090193741 | Cappelle | Aug 2009 | A1 |
20090217615 | Engstrom | Sep 2009 | A1 |
20090223162 | Chen et al. | Sep 2009 | A1 |
20090226662 | Dyczko-Riglin et al. | Sep 2009 | A1 |
20090249731 | Cappelle | Oct 2009 | A1 |
20090260307 | Thiers | Oct 2009 | A1 |
20090260313 | Segaert | Oct 2009 | A1 |
20090269522 | Liu | Oct 2009 | A1 |
20090296613 | Kahn et al. | Dec 2009 | A1 |
20090308001 | Wu et al. | Dec 2009 | A1 |
20090320402 | Schacht et al. | Dec 2009 | A1 |
20100015420 | Riebel et al. | Jan 2010 | A1 |
20100018149 | Thiers | Jan 2010 | A1 |
20100037550 | Braun | Feb 2010 | A1 |
20100043333 | Hannig | Feb 2010 | A1 |
20100055420 | Vermeulen | Mar 2010 | A1 |
20100058590 | Braun et al. | Mar 2010 | A1 |
20100083603 | Goodwin | Apr 2010 | A1 |
20100088993 | Grafenauer | Apr 2010 | A1 |
20100115874 | Nilsson | May 2010 | A1 |
20100129609 | Thiagarajan | May 2010 | A1 |
20100159213 | Przybylinski et al. | Jun 2010 | A1 |
20100192793 | Verhaeghe | Aug 2010 | A1 |
20100215875 | Yang et al. | Aug 2010 | A1 |
20100218450 | Braun et al. | Sep 2010 | A1 |
20100281803 | Cappelle | Nov 2010 | A1 |
20100281810 | Ruland | Nov 2010 | A1 |
20100300029 | Braun et al. | Dec 2010 | A1 |
20100319292 | Moriau et al. | Dec 2010 | A1 |
20110023405 | Moriau et al. | Feb 2011 | A1 |
20110045250 | De Zen | Feb 2011 | A1 |
20110056167 | Nilsson | Mar 2011 | A1 |
20110088346 | Hannig | Apr 2011 | A1 |
20110138722 | Hannig | Jun 2011 | A1 |
20110154763 | Bergelin et al. | Jun 2011 | A1 |
20110162312 | Schulte | Jul 2011 | A1 |
20110162777 | Youn et al. | Jul 2011 | A1 |
20110167744 | Whispell et al. | Jul 2011 | A1 |
20110225921 | Schulte | Sep 2011 | A1 |
20110225922 | Pervan et al. | Sep 2011 | A1 |
20110247285 | Wybo et al. | Oct 2011 | A1 |
20110268937 | Schacht et al. | Nov 2011 | A1 |
20110271632 | Cappelle et al. | Nov 2011 | A1 |
20110287237 | Riebel et al. | Nov 2011 | A1 |
20110300392 | Vermeulen | Dec 2011 | A1 |
20110308182 | Downey | Dec 2011 | A1 |
20120011796 | Hannig | Jan 2012 | A1 |
20120015107 | Schacht et al. | Jan 2012 | A1 |
20120055112 | Engstrom | Mar 2012 | A1 |
20120067461 | Braun | Mar 2012 | A1 |
20120124932 | Schulte et al. | May 2012 | A1 |
20120174519 | Schulte | Jul 2012 | A1 |
20120174521 | Schulte | Jul 2012 | A1 |
20120213973 | Clement et al. | Aug 2012 | A1 |
20120266555 | Cappelle | Oct 2012 | A1 |
20120276348 | Clausi et al. | Nov 2012 | A1 |
20120279154 | Bergelin et al. | Nov 2012 | A1 |
20130008118 | Baert et al. | Jan 2013 | A1 |
20130008127 | Braun et al. | Jan 2013 | A1 |
20130036695 | Durnberger | Feb 2013 | A1 |
20130042558 | Cordeiro | Feb 2013 | A1 |
20130062006 | Meersseman et al. | Mar 2013 | A1 |
20130067842 | Meersseman et al. | Mar 2013 | A1 |
20130081349 | Pervan et al. | Apr 2013 | A1 |
20130104485 | Meersseman et al. | May 2013 | A1 |
20130104487 | Moriau et al. | May 2013 | A1 |
20130295352 | Thiers et al. | Nov 2013 | A1 |
20130298487 | Bergelin et al. | Nov 2013 | A1 |
20130305649 | Thiers | Nov 2013 | A1 |
20140020820 | Meersseman et al. | Jan 2014 | A1 |
20140033635 | Pervan et al. | Feb 2014 | A1 |
20140033636 | Cappelle | Feb 2014 | A1 |
20140053497 | Pervan et al. | Feb 2014 | A1 |
20140109507 | Dossche et al. | Apr 2014 | A1 |
20140130437 | Cappelle | May 2014 | A1 |
20140150369 | Hannig | Jun 2014 | A1 |
20140255659 | Windmöller | Sep 2014 | A1 |
20140290158 | Meersseman et al. | Oct 2014 | A1 |
20140290174 | Moriau et al. | Oct 2014 | A1 |
20140318070 | Schacht et al. | Oct 2014 | A1 |
20150107178 | Meersseman et al. | Apr 2015 | A1 |
20150159379 | Meersseman et al. | Jun 2015 | A1 |
20150167317 | Cappelle | Jun 2015 | A1 |
20150204080 | Cappelle | Jul 2015 | A1 |
20150204081 | Cappelle | Jul 2015 | A1 |
20150211238 | Moriau et al. | Jul 2015 | A1 |
20160046144 | Thiers | Feb 2016 | A1 |
20160069089 | Bergelin et al. | Mar 2016 | A1 |
20160160508 | Meersseman et al. | Jun 2016 | A1 |
20160193857 | De Mondt et al. | Jul 2016 | A1 |
20160215505 | Cappelle et al. | Jul 2016 | A1 |
20160251861 | Cappelle | Sep 2016 | A1 |
20160258167 | Meersseman et al. | Sep 2016 | A1 |
20160265233 | Cappelle | Sep 2016 | A1 |
20160356047 | Cappelle | Dec 2016 | A1 |
20160369516 | Cappelle | Dec 2016 | A1 |
20170051514 | Cappelle | Feb 2017 | A1 |
20170089078 | Schacht et al. | Mar 2017 | A1 |
20170101785 | Cappelle | Apr 2017 | A1 |
20170101786 | Cappelle | Apr 2017 | A1 |
20170284106 | Cappelle | Oct 2017 | A1 |
20170335571 | Hannig | Nov 2017 | A1 |
20170350140 | Bergelin et al. | Dec 2017 | A1 |
20180023306 | Meersseman et al. | Jan 2018 | A1 |
20180127985 | Cappelle | May 2018 | A1 |
20180223540 | Cappelle | Aug 2018 | A1 |
20190048595 | Cappelle | Feb 2019 | A1 |
20190063080 | Meersseman et al. | Feb 2019 | A1 |
20190093370 | Pervan et al. | Mar 2019 | A1 |
20190330858 | Cappelle | Oct 2019 | A1 |
20200063444 | Cappelle | Feb 2020 | A1 |
Number | Date | Country |
---|---|---|
1011466 | Oct 1999 | BE |
1017703 | Apr 2009 | BE |
991373 | Jun 1976 | CA |
1237344 | May 1988 | CA |
2226286 | Dec 1997 | CA |
2734801 | Mar 2010 | CA |
2110047 | Jul 1992 | CN |
1119152 | Mar 1996 | CN |
2301491 | Dec 1998 | CN |
1239174 | Dec 1999 | CN |
2364121 | Feb 2000 | CN |
2415082 | Jan 2001 | CN |
1361844 | Jul 2002 | CN |
1399051 | Feb 2003 | CN |
2536701 | Feb 2003 | CN |
2536704 | Feb 2003 | CN |
1482166 | Mar 2004 | CN |
2654757 | Nov 2004 | CN |
2688807 | Mar 2005 | CN |
2705574 | Jun 2005 | CN |
2765969 | Mar 2006 | CN |
1911997 | Feb 2007 | CN |
2880971 | Mar 2007 | CN |
101023230 | Aug 2007 | CN |
101042014 | Sep 2007 | CN |
101045349 | Oct 2007 | CN |
101072691 | Nov 2007 | CN |
100354492 | Dec 2007 | CN |
101158226 | Apr 2008 | CN |
101168610 | Apr 2008 | CN |
201071580 | Jun 2008 | CN |
101300142 | Nov 2008 | CN |
101367977 | Feb 2009 | CN |
101368440 | Feb 2009 | CN |
101376277 | Mar 2009 | CN |
101397840 | Apr 2009 | CN |
101460688 | Jun 2009 | CN |
101487336 | Jul 2009 | CN |
201268019 | Jul 2009 | CN |
100523404 | Aug 2009 | CN |
101529032 | Sep 2009 | CN |
101544005 | Sep 2009 | CN |
101544082 | Sep 2009 | CN |
101545314 | Sep 2009 | CN |
101563511 | Oct 2009 | CN |
201339298 | Nov 2009 | CN |
101613503 | Dec 2009 | CN |
101614068 | Dec 2009 | CN |
101629446 | Jan 2010 | CN |
201381624 | Jan 2010 | CN |
101687386 | Mar 2010 | CN |
101698749 | Apr 2010 | CN |
101767362 | Jul 2010 | CN |
201679203 | Dec 2010 | CN |
101955614 | Jan 2011 | CN |
202324474 | Jul 2012 | CN |
202324517 | Jul 2012 | CN |
202483139 | Oct 2012 | CN |
202483140 | Oct 2012 | CN |
254920 | Dec 1912 | DE |
1534802 | Apr 1970 | DE |
2000274 | Jul 1970 | DE |
2202184 | Jul 1973 | DE |
2545854 | Oct 1976 | DE |
2721292 | Nov 1978 | DE |
2856391 | Jul 1980 | DE |
2940945 | Apr 1981 | DE |
254920 | Mar 1988 | DE |
19532819 | Mar 1997 | DE |
19725829 | Aug 1998 | DE |
19854475 | Jul 1999 | DE |
20002744 | Aug 2000 | DE |
19944399 | Apr 2001 | DE |
20206751 | Aug 2002 | DE |
10138285 | Mar 2003 | DE |
20300306 | Apr 2003 | DE |
10154767 | May 2003 | DE |
20300291 | Nov 2003 | DE |
10237397 | Feb 2004 | DE |
10230818 | Mar 2004 | DE |
102004055951 | Jul 2005 | DE |
102005002297 | Aug 2005 | DE |
102004009160 | Sep 2005 | DE |
102004023157 | Nov 2005 | DE |
202005019427 | Apr 2006 | DE |
202007000310 | Apr 2007 | DE |
102006054023 | Dec 2007 | DE |
102007018309 | Aug 2008 | DE |
202008008597 | Aug 2008 | DE |
102007015907 | Oct 2008 | DE |
202008011589 | Nov 2008 | DE |
102007026342 | Jan 2009 | DE |
102007032885 | Jan 2009 | DE |
102007035648 | Jan 2009 | DE |
102007042250 | Mar 2009 | DE |
102007043308 | Mar 2009 | DE |
202009004530 | Jun 2009 | DE |
102007062430 | Jul 2009 | DE |
102008003550 | Jul 2009 | DE |
102008022511 | Oct 2009 | DE |
102008021970 | Nov 2009 | DE |
102008003117 | Dec 2009 | DE |
102009038750 | Mar 2011 | DE |
102010022290 | Dec 2011 | DE |
102010023922 | Dec 2011 | DE |
202011111026 | Jun 2018 | DE |
0007230 | Jan 1980 | EP |
0130559 | Jan 1985 | EP |
0270291 | Jun 1988 | EP |
0562402 | Sep 1993 | EP |
0843763 | May 1998 | EP |
0864712 | Sep 1998 | EP |
0893473 | Jan 1999 | EP |
0903451 | Mar 1999 | EP |
0974713 | Jan 2000 | EP |
1026341 | Aug 2000 | EP |
1108529 | Jun 2001 | EP |
1138467 | Oct 2001 | EP |
1154090 | Nov 2001 | EP |
1229182 | Aug 2002 | EP |
1247641 | Oct 2002 | EP |
1262607 | Dec 2002 | EP |
1262609 | Dec 2002 | EP |
1290290 | Mar 2003 | EP |
1420125 | May 2004 | EP |
1454763 | Sep 2004 | EP |
1469140 | Oct 2004 | EP |
1493879 | Jan 2005 | EP |
1541778 | Jun 2005 | EP |
1593796 | Nov 2005 | EP |
1624130 | Feb 2006 | EP |
1650375 | Apr 2006 | EP |
1666247 | Jun 2006 | EP |
1705309 | Sep 2006 | EP |
1707705 | Oct 2006 | EP |
1808546 | Jul 2007 | EP |
1818478 | Aug 2007 | EP |
1872959 | Jan 2008 | EP |
1892352 | Feb 2008 | EP |
1938963 | Jul 2008 | EP |
2007230 | Dec 2008 | EP |
2063044 | May 2009 | EP |
2130991 | Dec 2009 | EP |
2202056 | Jun 2010 | EP |
2246188 | Nov 2010 | EP |
2287418 | Feb 2011 | EP |
2308678 | Apr 2011 | EP |
2333195 | Jun 2011 | EP |
2390437 | Nov 2011 | EP |
2562402 | Feb 2013 | EP |
2974713 | Jan 2016 | EP |
3270291 | Jan 2018 | EP |
1293043 | May 1962 | FR |
2149112 | Mar 1973 | FR |
2271365 | Dec 1975 | FR |
2609664 | Jul 1988 | FR |
2827529 | Jan 2003 | FR |
518239 | Feb 1940 | GB |
900958 | Jul 1962 | GB |
1015701 | Jan 1966 | GB |
1364685 | Aug 1974 | GB |
1467899 | Mar 1977 | GB |
1520964 | Aug 1978 | GB |
2020998 | Nov 1979 | GB |
2145371 | Mar 1985 | GB |
2202184 | Sep 1988 | GB |
2376916 | Dec 2002 | GB |
S60255843 | Dec 1985 | JP |
S62127225 | Jun 1987 | JP |
H03110258 | May 1991 | JP |
H03169967 | Jul 1991 | JP |
H05018028 | Jan 1993 | JP |
H05214803 | Aug 1993 | JP |
H0664108 | Mar 1994 | JP |
H07180333 | Jul 1995 | JP |
2624418 | Jun 1997 | JP |
H09165899 | Jun 1997 | JP |
2000170361 | Jun 2000 | JP |
2001096706 | Apr 2001 | JP |
3169967 | Aug 2011 | JP |
5214803 | Jun 2013 | JP |
7180333 | Nov 2022 | JP |
960005785 | Jul 1996 | KR |
19990036219 | May 1999 | KR |
19990036219 | May 1999 | KR |
20020053759 | Jul 2002 | KR |
20030050167 | Jun 2003 | KR |
20040000297 | Jan 2004 | KR |
200399316 | Oct 2005 | KR |
20060004828 | Jan 2006 | KR |
20060045871 | May 2006 | KR |
20070063046 | Jun 2007 | KR |
20080069896 | Jul 2008 | KR |
8000083 | Aug 1981 | NL |
9511333 | Apr 1995 | WO |
9606248 | Feb 1996 | WO |
9627721 | Sep 1996 | WO |
9718949 | May 1997 | WO |
9747824 | Dec 1997 | WO |
9747834 | Dec 1997 | WO |
9917930 | Apr 1999 | WO |
9945060 | Sep 1999 | WO |
0020705 | Apr 2000 | WO |
0020706 | Apr 2000 | WO |
0047841 | Aug 2000 | WO |
0109461 | Feb 2001 | WO |
0147724 | Jul 2001 | WO |
0147725 | Jul 2001 | WO |
0148333 | Jul 2001 | WO |
0151732 | Jul 2001 | WO |
0166877 | Sep 2001 | WO |
0175247 | Oct 2001 | WO |
0183488 | Nov 2001 | WO |
0196689 | Dec 2001 | WO |
0198603 | Dec 2001 | WO |
0198604 | Dec 2001 | WO |
0200449 | Jan 2002 | WO |
0204206 | Jan 2002 | WO |
0208542 | Jan 2002 | WO |
02060702 | Aug 2002 | WO |
03012224 | Feb 2003 | WO |
03016654 | Feb 2003 | WO |
03084746 | Oct 2003 | WO |
03087497 | Oct 2003 | WO |
03089736 | Oct 2003 | WO |
2004003314 | Jan 2004 | WO |
2004015221 | Feb 2004 | WO |
2004042168 | May 2004 | WO |
2004048716 | Jun 2004 | WO |
2004050359 | Jun 2004 | WO |
2004081316 | Sep 2004 | WO |
2005003489 | Jan 2005 | WO |
2005018833 | Mar 2005 | WO |
2005033204 | Apr 2005 | WO |
2005054599 | Jun 2005 | WO |
2006032378 | Mar 2006 | WO |
2006033706 | Mar 2006 | WO |
2006043893 | Apr 2006 | WO |
2006066776 | Jun 2006 | WO |
2006090287 | Aug 2006 | WO |
2006103565 | Oct 2006 | WO |
2006104436 | Oct 2006 | WO |
2007015669 | Feb 2007 | WO |
2007047834 | Apr 2007 | WO |
2007059967 | May 2007 | WO |
2007078181 | Jul 2007 | WO |
2007081267 | Jul 2007 | WO |
WO-2007079845 | Jul 2007 | WO |
2007113676 | Oct 2007 | WO |
2007141605 | Dec 2007 | WO |
2008004960 | Jan 2008 | WO |
2008017281 | Feb 2008 | WO |
2008060232 | May 2008 | WO |
2008068245 | Jun 2008 | WO |
2008078181 | Jul 2008 | WO |
2008083662 | Jul 2008 | WO |
2008091045 | Jul 2008 | WO |
2008116623 | Oct 2008 | WO |
2008119339 | Oct 2008 | WO |
2008122668 | Oct 2008 | WO |
2009021487 | Feb 2009 | WO |
2009033623 | Mar 2009 | WO |
2009061279 | May 2009 | WO |
2009065769 | May 2009 | WO |
2009066153 | May 2009 | WO |
2009101217 | Aug 2009 | WO |
2009116926 | Sep 2009 | WO |
2009118709 | Oct 2009 | WO |
2009139687 | Nov 2009 | WO |
2009141743 | Nov 2009 | WO |
2010023042 | Mar 2010 | WO |
2010028621 | Mar 2010 | WO |
2010042182 | Apr 2010 | WO |
2010075839 | Jul 2010 | WO |
2010081860 | Jul 2010 | WO |
2010082171 | Jul 2010 | WO |
2010087752 | Aug 2010 | WO |
2010088769 | Aug 2010 | WO |
2010102735 | Sep 2010 | WO |
2010108980 | Sep 2010 | WO |
2010142671 | Dec 2010 | WO |
2011001326 | Jan 2011 | WO |
2011012104 | Feb 2011 | WO |
2011012105 | Feb 2011 | WO |
2011028171 | Mar 2011 | WO |
2011061659 | May 2011 | WO |
2011085306 | Jul 2011 | WO |
2011085788 | Jul 2011 | WO |
2011085825 | Jul 2011 | WO |
2011087425 | Jul 2011 | WO |
2011096879 | Aug 2011 | WO |
2011127981 | Oct 2011 | WO |
2011141043 | Nov 2011 | WO |
2011141849 | Nov 2011 | WO |
2012001091 | Jan 2012 | WO |
2012001109 | Jan 2012 | WO |
2012004700 | Jan 2012 | WO |
2012061300 | May 2012 | WO |
Entry |
---|
Search Report and Written Opinion from corresponding EP Application No. EP09015885, May 25, 2010. |
Search Report from corresponding BE Application No. BE201000420, Feb. 15, 2011. |
Search Report from corresponding BE Application No. BE201000705, May 23, 2011. |
Search Report from corresponding BE Application No. BE201000713, Jun. 14, 2011. |
Search Report from corresponding PCT Application No. PCT/IB2010/055693, Jun. 24, 2011. |
Search Report from corresponding BE Application No. BE201000719, Sep. 27, 2011. |
Search Report from corresponding BE Application No. BE201100247, Sep. 28, 2011. |
Search Report from corresponding PCT Application No. PCT/IB2011/051884, Nov. 22, 2011. |
Search Report from corresponding PCT Application No. PCT/IB2011/051886, Feb. 21, 2012. |
Search Report from corresponding BE Application No. BE201100128, Jun. 19, 2012. |
International Preliminary Report on Patentability from corresponding PCT Application No. PCT/IB2010/055693, Jun. 26, 2012. |
Search Report from corresponding PCT Application No. PCT/IB2011/052715, Aug. 21, 2012. |
Search Report from corresponding CN Application No. 201080063498, mailed on Jan. 6, 2014. |
Search Report from corresponding CN Application No. 2015101886353, mailed on Aug. 1, 2016. |
Search Report from corresponding CN Application No. 2015101885153, mailed on Aug. 19, 2016. |
Search Report from corresponding CN Application No. 20151018855562, mailed on Aug. 19, 2016. |
Search Report from corresponding CN Application No. 2015101878249, mailed on Aug. 22, 2016. |
Search Report from corresponding CN Application No. 2015101885346, mailed on Sep. 1, 2016. |
Search Report from corresponding CN Application No. 2015101876968, mailed on Oct. 17, 2016. |
Search Report from corresponding CN Application No. 2015101882070, mailed on Oct. 18, 2016. |
Supplementary Search Report from corresponding CN Application No. 2015101885562, mailed on Mar. 29, 2017. |
Supplementary Search Report from corresponding CN Application No. 2015101882070, mailed on May 26, 2017. |
Supplementary Search Report from corresponding CN Application No. 2015101885153, mailed on May 31, 2017. |
Supplementary Search Report from corresponding CN Application No. 2015101882070, mailed on Aug. 2, 2017. |
Supplementary Search Report from corresponding CN Application No. 2015101876968, mailed on Jan. 2, 2018. |
Supplementary Search Report from corresponding CN Application No. 2015101878249, mailed on Feb. 7, 2018. |
Supplementary Search Report from corresponding CN Application No. 2015101876968, mailed on Apr. 15, 2018. |
Search Report and Written Opinion from corresponding EP Application No. EP19175669, Sep. 26, 2019. |
Chang et al., Product Review: “Advances in Polyurethane Coatings (1969 to Early 1972)”, Industrial & Engineering Chemistry Product Research & Development, vol. 12, No. 4, pp. 278-288, Sep. 7, 1973. |
An et al., “Building and Ornament Materials,” China Architecture & Buildingpress, Feb. 2005, pp. 111-114. |
Zhong, “Building Plastic,” China Petrochemical Press, Jan. 2007, 6 Pages. |
WPI Database week 199338 Thomson Scientific, Lodon, GB; AN 1993-300138 XP002621436, 1 page, Feb. 16, 2011 08:59:55. |
Search Report from corresponding Belgian Application No. BE201000441, Feb. 25, 2011. |
Search Report and Written Opinion from corresponding EP Application No. EP16186084, Nov. 23, 2016. |
Search Report from corresponding CN Application No. 201510587784, mailed on Jan. 17, 2017. |
Search Report and Written Opinion from corresponding EP Application No. EP17192468, Feb. 5, 2018. |
Search Report and Written Opinion from corresponding EP Application No. EP17192992, Feb. 26, 2018. |
Search Report and Written Opinion from corresponding EP Application No. EP17193145, Feb. 26, 2018. |
Search Report and Written Opinion from corresponding EP Application No. EP17192967, Mar. 2, 2018. |
Search Report and Written Opinion from corresponding EP Application No. EP18195393, Jan. 23, 2019. |
Search Report from corresponding EP Application No. EP09015855, May 25, 2010. |
Search Report from corresponding BE Application No. BE201000749, Mar. 25, 2011. |
Search Report from corresponding BE Application No. BE20110719, Sep. 27, 2011. |
Search Report from corresponding BE Application No. BE20110247, Sep. 28, 2011. |
Search Report from corresponding PCT Application No. PCT/IB2011/054223, May 23, 2012. |
Search Report from corresponding BE Application No. 201100418, Jun. 11, 2012. |
Search Report from corresponding PCT Application No. PCT/IB2011/052714, Jun. 11, 2012. |
Search Report from corresponding PCT Application No. PCT/IB2011/052713, Jun. 22, 2012. |
Search Report from corresponding PCT Application No. PCT/IB2011/051523, Sep. 24, 2012. |
Search Report from corresponding BE Application No. BE201000602, Nov. 9, 2012. |
International Preliminary Report on Patentability from PCT Application No. PCT/IB2011/051885, Nov. 13, 2012. |
International Preliminary Report on Patentability from PCT Application No. PCT/IB2011/051884, Nov. 13, 2012. |
International Preliminary Report on Patentability from PCT Application No. PCT/IB2011/051886, Nov. 13, 2012. |
International Preliminary Report on Patentability from PCT Application No. PCT/IB2011/051523, Jan. 15, 2013. |
International Preliminary Report on Patentability from PCT Application No. PCT/IB2011/052713, Jan. 15, 2013. |
International Preliminary Report on Patentability from PCT Application No. PCT/IB2011/052714, Jan. 15, 2013. |
International Preliminary Report on Patentability from PCT Application No. PCT/IB2011/052715, Jan. 15, 2013. |
International Preliminary Report on Patentability from PCT Application No. PCT/IB2011/054223, Apr. 16, 2013. |
Search Report from corresponding CN Application No. 2011800231833, mailed on Feb. 19, 2014. |
Search Report from corresponding CN Application No. 2011800237219, mailed on Mar. 10, 2014. |
Search Report from corresponding CN Application No. 2011800341072, mailed on Jul. 23, 2014. |
Supplementary Search Report from corresponding CN Application No. 2011800231833, mailed on Aug. 6, 2014. |
Supplementary Search Report from corresponding CN Application No. 2011800237219, mailed on Oct. 15, 2014. |
Supplementary Search Report from corresponding CN Application No. 2011800237219, mailed on Jan. 9, 2015. |
Supplementary Search Report from corresponding CN Application No. 2011800237219, mailed on May 28, 2015. |
Search Report and Written Opinion from corresponding EP Application No. 16184900, Nov. 1, 2016. |
Search Report from corresponding CN Application No. 201505878943, mailed on Jan. 16, 2017. |
Search Report from corresponding CN Application No. 2015106053134, mailed on Mar. 24, 2017. |
Search Report from corresponding CN Application No. 201510618221, mailed on Mar. 22, 2017. |
Search Report and Written Opinion from corresponding EP Application No. EP17192481, Jan. 23, 2018. |
Search Report from corresponding EP Application No. EP18152924, Apr. 20, 2018. |
Search Report from corresponding PCT Application No. PCT/IB2011/051885, Feb. 9, 2020. |
Administrative Written Judgment from corresponding Chinese Application No. 201510605313.4, Aug. 31, 2021. |
“Acrylnitril-Butadien-Styrol-Copolymer”, Wikpedia retrieved from https://de.wikipedia.org/Acrylnitril-Butadien-Styrol-Copolymer on Mar. 14, 2018. |
“Polycarbonate”, Wikipedia retrieved from https://de.wikipedia.org/polycarbonate on Mar. 14, 2018. |
Standard Specification for Solid Vinyl Floor Tile, ASTM, Designation F 1700-96, Jul. 1996, pp. 719-721. |
Chanda et al., “Chapter 2 Fabrication Processes; Chapter 4 Industrial Polymers; Chapter 7 Trends in Polymer Applications”, Plastics Technology Handbook Third Edition, Revised and Expanded, 1998, 20 pages. |
High Pressure Laminates (HPL), Composite Panel Association, http://www.decorativesurfaces.org/products/decorative-surfaces/high-pressure-laminates.html/details/, downloaded from the internet on Jul. 3, 2017, 3 pages. |
Testing and characterization of Resins, Encyclopedia of PVC, vol. 1, 1976, 4 pages. |
U.S. Appl. No. 08/899,118, filed Jul. 23, 1997, 36 pages. |
Machine translation of DE202005019427 provided by the European Patent Office at Espacenet. |
United States Final Office Action from U.S. Appl. No. 16/796,208, May 14, 2021. |
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---|---|---|---|
20200190821 A1 | Jun 2020 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 13696769 | US | |
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Number | Date | Country | |
---|---|---|---|
Parent | 15695163 | Sep 2017 | US |
Child | 16796217 | US | |
Parent | 15045389 | Feb 2016 | US |
Child | 15695163 | US | |
Parent | 14015307 | Aug 2013 | US |
Child | 15045389 | US |