1. Technical Field
The exemplary disclosure generally relates to flow divider systems used in magnetron sputtering device.
2. Description of Related Art
Magnetron sputtering is a process whereby atoms are ejected from a solid target due to a bombardment of the target by energetic particles of a magnetron. It is commonly used for thin-film deposition, etching and analytical techniques. However, a typical flow divider system used in magnetron sputtering process can not be adjusted to adjust the flow to better control utilization rate of the target.
Therefore, there is room for improvement within the art.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the exemplary flow divider system. Moreover, in the drawings like reference numerals designate corresponding parts throughout the several views. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment.
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The shield 20 further includes a plurality of shield boards 30 fixed to the main body 21, and each shield board 30 has a length L2 equal to the width W1 of the main body 21. The shield boards 30 adjustably shield portions of the openings 42 to adjust the flow of the gas passing through the shield 20. In this exemplary embodiment, each shield board 30 is adjustably fixed to the main body 21 by a plurality of screws 60. To adjust the distances between the shield boards 30, the screws 60 are released, and then the shield boards 30 are moved on the main body 21 accordingly, and then the screws 60 are fastened again. As the shield boards 30 are adjusted, portions of the openings 42 being shielded are accordingly adjusted so the flow of the gas passing through the shield 20 is adjusted. In this exemplary embodiment, the distance between two adjacent shield boards 30 is between 10 millimeters and 400 millimeters.
In use, the workpieces are suspended from the hanging rods 142. The chamber 12 is evacuated through the outlet gate 50 by using the vacuum pump until a desired degree of vacuum formed in the chamber 12. The reacting gas (e., argon) is fed into the chamber 12 through the inlet pipe 40. The argon is ionized to argon ions to bombard the targets 70 so atoms are ejected from the targets 70 to coat the workpieces. If needed, the distances between the shield boards 30 can be adjusted to adjust the flow passing through the shield 20, and control utilization rate of the target 70.
It is to be understood, however, that even through numerous characteristics and advantages of the exemplary disclosure have been set forth in the foregoing description, together with details of the system and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201110110675.8 | Apr 2011 | CN | national |