Claims
- 1. A fluid heat exchanger for cooling an electronic component comprising,
- a housing having a base for receiving heat from an electronic component,
- a plurality of spaced fins each having a top, bottom, and two ends, said bottoms connected to the base, and said fins being perpendicular to the base,
- a first fluid tube communicating with the housing opposite the base and having a longitudinal axis perpendicular to the base, said axis directed towards the fins between the ends of the fins for transmitting a cooling fluid between the first tube and the fins, the base and the ends of the fins, and a second fluid tube in communication with the fins,
- the tops of the fins including a recess in communication with the first tube for communicating fluid between all of the fins and the first tube, and
- a plate between the top and bottom of the fins extending generally parallel to the base and extending toward but spaced from the ends of the fins for directing the cooling fluid in a double pass against the fins.
- 2. The apparatus of claim 1 wherein the plate is positioned midway between the tops and bottoms of the fins.
- 3. The apparatus of claim 1 wherein the ends of the fins extend to the inside of the housing.
- 4. The apparatus of claim 1 wherein the first fluid tube and the second fluid tube are concentric tubes.
- 5. The apparatus of claim 1 wherein the top portions of each of the fins includes a plurality of upwardly directed projections separated by recesses, and
- said plate includes a plurality of spaced openings for receiving the projections of the fins for easily assembling and structurally connecting the fins to the plate.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of application Ser. No. 07/251,273 filed Sept. 30, 1988, now U.S. Pat. No. 4,909,315 granted Mar. 20, 1990 entitled "Fluid Heat Exchanger for an Electronic Component".
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
251273 |
Sep 1988 |
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