Claims
- 1. A polishing head for holding a substrate during polishing, comprising:a backing member including a pressurizable pocket open to and facing a back surface of the substrate; a seal surrounding the pocket and positioned to contact a perimeter portion of the back surface of the substrate; an opening in the backing member to the pocket for controlling a pressure therein by the use of fluid passing into and out of the pocket through the opening; a retainer at least partially circumscribing the backing member, the retainer controllably positionable with respect to the backing member; a first chamber to provide a first downward force on the backing member; and a second chamber to provide a second independently adjustable downward force on the retainer.
- 2. The polishing head of claim 1, further comprising a support member to hold the backing member over a polishing surface.
- 3. The polishing head of claim 2, further comprising a pressurizable chamber disposed between the mounting member and the support member.
- 4. The polishing head of claim 2, wherein a pressure in the pocket provides a force to load the substrate against the polishing surface.
- 5. The polishing head of claim 2, wherein the pocket is maintainable at a reduced pressure to maintain the substrate in contact with the backing member when a front surface of substrate is not positioned against the polishing surface.
- 6. The polishing head of claim 1, wherein the seal is a lip seal.
- 7. A carrier head for a chemical mechanical polishing apparatus, comprising:a housing support member; a backing member to hold a substrate against a polishing pad, said backing member movable relative to said housing support member; an opening in the backing member to provide a vacuum to a back surface of the substrate and thereby maintain the substrate on the backing member; a retainer assembly including a retainer surrounding and projecting below said backing member to contact said polishing pad, said retainer movable relative to said housing support member and said backing member; a first adjustable loading mechanism positioned between said housing support member and said backing member to cause said backing member to press said substrate against said polishing pad; and a second independently adjustable loading mechanism positioned between said housing support member and said retainer assembly to cause said retainer assembly to press said retainer against said polishing pad.
- 8. The carrier head of claim 7 wherein said second loading mechanism including a first mechanism to provide a force to urge said retainer toward said polishing pad and a second mechanism to urge said retainer away from said polishing pad.
- 9. The carrier head of claim 7 wherein said first loading mechanism includes a bellows.
- 10. The carrier head of claim 7 wherein said second loading mechanism includes an inflatable bladder to urge said retainer toward said polishing pad.
- 11. The carrier head of claim 10 wherein said second loading mechanism further includes an elastic member to urge said retainer away from said polishing pad.
- 12. The carrier head of claim 7, wherein a substrate facing side of the backing member includes a recess, and a seal is disposed around the recess.
- 13. The carrier head of claim 12, wherein the recess extends across substantially all of the backside of the substrate.
- 14. The carrier head of claim 7, wherein the first loading mechanism includes a first pressurizable chamber.
- 15. The carrier head of claim 14, further comprising a passage in the backing member fluidly coupled to connect the opening to a vacuum source.
- 16. The carrier head of claim 15, further comprising a fluid line extending through the pressurizable chamber to couple the passage in the backing member to a passage in the support structure.
- 17. The carrier head of claim 14, wherein the second loading mechanism includes a second pressurizable chamber.
Parent Case Info
This application is a continuation of U.S. application Ser. No. 08/488,921, filed Jun. 9, 1995 Now U.S. Pat. No. 6,024,630.
US Referenced Citations (34)
Foreign Referenced Citations (10)
Number |
Date |
Country |
8631087 |
Apr 1987 |
DE |
0156746 A1 |
Oct 1985 |
EP |
0653270 A1 |
Aug 1994 |
EP |
61-25768 |
Feb 1986 |
JP |
63-114870 |
May 1988 |
JP |
63-300858 |
Dec 1988 |
JP |
1-109066 |
Apr 1989 |
JP |
1-216768 |
Aug 1989 |
JP |
2-243263 |
Sep 1990 |
JP |
WO 9419153 |
Sep 1994 |
WO |
Non-Patent Literature Citations (1)
Entry |
Research Disclosure, n. 322, Feb. 1, 1991, p. 95, XPO 00168310 “Pressurized Wafer Holder for Uniform Polishing”. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
08/488921 |
Jun 1995 |
US |
Child |
09/406027 |
|
US |