Claims
- 1. An integrated circuit system comprising:
- an integrated circuit, said integrated circuit having a temperature range within which it can safely operate;
- a fusible material that melts from a solid phase to a liquid phase at a temperature within said temperature range;
- a heat sink body of body material that does not melt within said temperature range, said body defining a cavity containing and enclosing said fusible material, said body physically separating said fusible material from said integrated circuit, said body thermally coupling said fusible material to said integrated circuit;
- phase means for monitoring said fusible material to determine when said fusible material changes from its solid phase to its liquid phase and when said fusible material changes from its liquid phase to its solid phase; and
- power reduction means for reducing the power dissipated by said integrated circuit, said power reduction means being coupled to said phase means so that said power reduction means reduces the power dissipated by said integrated circuit in response to a determination by said phase means that said fusible material is in its liquid phase.
- 2. An integrated circuit system as recited in claim 1 wherein said power reduction means is also for restoring full power operation in response to a determination by said phase means that said fusible material has resumed its solid phase.
- 3. An integrated circuit system as recited in claim 1 wherein said power reduction means is a power switch that turns off power to said integrated circuit in response to a determination by said phase means that said material is in its liquid phase.
- 4. An integrated circuit system as recited in claim 1 wherein said power reduction means is a clock frequency means that reduces the clock frequency of said integrated circuit in response to a determination by said phase means that said fusible material is in its liquid phase.
- 5. An integrated circuit as recited in claim 1 wherein said phase means includes:
- an object within said fusible material;
- means for applying force to said object sufficient to move said object a predetermined amount through said material when said fusible material is in its liquid phase but not sufficient to move said object said predetermined amount when said fusible material is in its solid phase; and
- means for detecting whether said object has moved by said predetermined amount.
- 6. An integrated circuit system comprising:
- an integrated circuit, said integrated circuit having a temperature range within which it can safely operate;
- a fusible material that melts from a solid phase to a liquid phase at a temperature within said temperature range;
- a heat sink body of body material that does not melt within said temperature range, said body defining a cavity containing and enclosing said fusible material, said body physically separating said fusible material from said integrated circuit, said body thermally coupling said fusible material to said integrated circuit, wherein said heat sink cavity is dimensioned so that, upon return to its solid phase, said fusible material is restored to the position it had prior to its most recent transition to its liquid phase.
- 7. A method of controlling the heating of an integrated circuit having an thermal operating range, said method comprising the steps of:
- thermally coupling a fusible material to said integrated circuit by attaching to said integrated circuit a heat sink body with a cavity containing said fusible material, said fusible material having a liquid phase and a solid phase, said fusible material having a melting point within said thermal operating range, said heat sink body having a melting point above said thermal operating range;
- monitoring the phase of said fusible material so as to determine when its changes from its solid phase to its liquid phase and when it changes from its liquid phase to its solid phase;
- reducing power consumption by said integrated circuit when said phase is liquid; and
- restoring full-power operation when said material resumes its solid phase.
- 8. A method of controlling the heating of an integrated circuit having an thermal operating range, said method comprising the steps of:
- thermally coupling a fusible material to said integrated circuit by attaching to said integrated circuit a heat sink body with a cavity containing said fusible material, said fusible material having a liquid phase and a solid phase, said fusible material having a melting point within said thermal operating range, said heat sink body having a melting point above said thermal operating range;
- monitoring the phase of said fusible material so as to determine when its changes from its solid phase to its liquid phase and when it changes from its liquid phase to its solid phase; and
- reducing power consumption by said integrated circuit when said phase is liquid by lowering a clock frequency driving said integrated circuit.
- 9. A method of controlling the heating of an integrated circuit having an thermal operating range, said method comprising the steps of:
- thermally coupling a fusible material to said integrated circuit by attaching to said integrated circuit a heat sink body with a cavity containing and configining said fusible material so that when it melts and then resolidifies it resumes the form and position it had before melting, said fusible material having a liquid phase and a solid phase, said fusible material having a melting point within said thermal operating range, said heat sink body having a melting point above said thermal operating range;
- monitoring the phase of said fusible material so as to determine when its changes from its solid phase to its liquid phase and when it changes from its liquid phase to its solid phase; and
- reducing power consumption by said integrated circuit when said phase is liquid.
Parent Case Info
This application is a continuation of Ser. No. 158,124, U.S. Pat. No. 5,477,409, filed Nov. 24, 1993.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4057101 |
Ruba et al. |
Nov 1977 |
|
5455458 |
Quon et al. |
Oct 1995 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
158124 |
Nov 1993 |
|