Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact humidity and pressure sensor with temperature control
- Patent number 12,163,938
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Vivek Saraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical package and method of fabrication
- Patent number 12,165,944
- Issue date Dec 10, 2024
- Rockley Photonics Limited
- Shuhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaged semiconductor device
- Patent number 12,159,818
- Issue date Dec 3, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer circuit, semiconductor integrated circuit device, oscillator...
- Patent number RE50208
- Issue date Nov 12, 2024
- Seiko Epson Corporation
- Kenji Hayashi
Information Patent Grant
Embedded system module thermal installation verification
- Patent number 12,144,118
- Issue date Nov 12, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Craig K. Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested architectures for enhanced heterogeneous integration
- Patent number 12,142,545
- Issue date Nov 12, 2024
- Intel Corporation
- Ravindranath Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit arrangement with a thermal interface
- Patent number 12,107,026
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Raphael Hellwig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite structure for image plane normalization of a microelectro...
- Patent number 12,087,704
- Issue date Sep 10, 2024
- Raytheon Company
- Thomas Sprafke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 12,080,630
- Issue date Sep 3, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-die heater devices for memory devices and memory modules
- Patent number 12,073,908
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- William A. Lendvay
- G11 - INFORMATION STORAGE
Information Patent Grant
Wide bandgap semiconductor device with sensor element
- Patent number 12,074,079
- Issue date Aug 27, 2024
- Wolfspeed, Inc.
- Joohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,074,110
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,074,158
- Issue date Aug 27, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module
- Patent number 12,068,209
- Issue date Aug 20, 2024
- Siemens Aktiengesellschaft
- Stephan Jonas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing thermal wear leveling
- Patent number 12,068,215
- Issue date Aug 20, 2024
- Advanced Micro Devices, Inc.
- David A. Roberts
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Storage device unit
- Patent number 12,069,796
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigehito Morita
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,062,655
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Jun Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,062,617
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,046,798
- Issue date Jul 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Corey Reichman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with resistive ele...
- Patent number 12,040,178
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for dynamic cooling in a multi-chip package with progr...
- Patent number 12,035,507
- Issue date Jul 9, 2024
- Intel Corporation
- Scott Rider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stiffener ring having elevated opening
- Patent number 12,033,960
- Issue date Jul 9, 2024
- Amazon Technologies, Inc.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,021,012
- Issue date Jun 25, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal diode device for a telematic control unit of a vehicle
- Patent number 12,010,821
- Issue date Jun 11, 2024
- Continental Automotive GmbH
- Jean-Philippe Boyer
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package comprising heat dissipation plates
- Patent number 11,996,342
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hsiang Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head unit and liquid discharge apparatus
- Patent number 11,996,341
- Issue date May 28, 2024
- Seiko Epson Corporation
- Shunsuke Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced cooling for cryogenic powered vehicles
- Patent number 11,993,403
- Issue date May 28, 2024
- The Boeing Company
- John H. Blumer
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Apparatus And Oscillator
- Publication number 20240421091
- Publication date Dec 19, 2024
- SEIKO EPSON CORPORATION
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421022
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Hirokatsu UMEGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...
- Publication number 20240421032
- Publication date Dec 19, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Gang ZHANG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN ACTIVE DEVICE REGION AND A CURRENT SEN...
- Publication number 20240421021
- Publication date Dec 19, 2024
- Infineon Technologies Austria AG
- Alim Karmous
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Improved Thermal and Electrical Conductivity Between Metal Contacts
- Publication number 20240410939
- Publication date Dec 12, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PROVIDING THERMAL WEAR LEVELING
- Publication number 20240413035
- Publication date Dec 12, 2024
- ADVANCED MICRO DEVICES, INC.
- David A. Roberts
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20240412769
- Publication date Dec 12, 2024
- WINBOND ELECTRONICS CORP.
- Chih-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND MANUFACTURE METHOD THEREOF
- Publication number 20240404958
- Publication date Dec 5, 2024
- Nexperia Technology (Shanghai) Ltd.
- Regnerus Hermannus Poelma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...
- Publication number 20240387498
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATOR HAVING VARIABLE OUTPUT CAPACITANCE AND METHODS FO...
- Publication number 20240387516
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP SEMICONDUCTOR DEVICE WITH SENSOR ELEMENT
- Publication number 20240379667
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Joohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER STRUCTURE, MULTILAYER STRUCTURE, PROCESSING APPARATUS AND ME...
- Publication number 20240379483
- Publication date Nov 14, 2024
- Kokusai Electric Corporation
- Shuhei SAIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-DIE HEATER DEVICES FOR MEMORY DEVICES AND MEMORY MODULES
- Publication number 20240371414
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- William A. Lendvay
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240363542
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20240363622
- Publication date Oct 31, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Application
MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES
- Publication number 20240347505
- Publication date Oct 17, 2024
- Lodestar Licensing Group LLC
- Sui Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20240339429
- Publication date Oct 10, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND DISPLAY PANEL
- Publication number 20240332315
- Publication date Oct 3, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bo WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332111
- Publication date Oct 3, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240332781
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Corey REICHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY
- Publication number 20240321668
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Thomas D. Burd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...
- Publication number 20240312968
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF TH...
- Publication number 20240290616
- Publication date Aug 29, 2024
- DENSO CORPORATION
- Tomohiro MIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240282659
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsiang Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT POWER MODULE
- Publication number 20240274584
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATING BATTERIES TO MAINTAIN VOLATILE...
- Publication number 20240264648
- Publication date Aug 8, 2024
- Arbor Company, LLLP
- Darrel James Guzy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTROL OF BOOST CONVERTER CURRENT LIMIT
- Publication number 20240266948
- Publication date Aug 8, 2024
- Cirrus Logic International Semiconductor Ltd.
- John B. BOWLERWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SENSOR DEVICE BY BACK END OF LINE METAL RESISTOR
- Publication number 20240249991
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and temperature measurement method

Compact humidity and pressure sensor with temperature control

Electro-optical package and method of fabrication

Multi-chip packaged semiconductor device

Buffer circuit, semiconductor integrated circuit device, oscillator...

Embedded system module thermal installation verification

Nested architectures for enhanced heterogeneous integration

Plurality of transistors attached to a heat sink with a periphery n...

Circuit arrangement with a thermal interface

Composite structure for image plane normalization of a microelectro...

3D semiconductor device and structure with metal layers and a conne...

On-die heater devices for memory devices and memory modules

Wide bandgap semiconductor device with sensor element

Method for manufacturing semiconductor device

Semiconductor device

Power module

Method and apparatus for providing thermal wear leveling

Storage device unit

Semiconductor device and method for manufacturing same

Semiconductor package

Semiconductor devices and methods of manufacturing semiconductor de...

Method for manufacturing semiconductor structure with resistive ele...

Technologies for dynamic cooling in a multi-chip package with progr...

Semiconductor package with stiffener ring having elevated opening

Semiconductor device

Thermal diode device for a telematic control unit of a vehicle

Semiconductor package comprising heat dissipation plates

Head unit and liquid discharge apparatus

Advanced cooling for cryogenic powered vehicles

MEMS resonator system

Patents Applicationslast 30 patents

Integrated Circuit Apparatus And Oscillator

SEMICONDUCTOR DEVICE

MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...

SEMICONDUCTOR DEVICE WITH AN ACTIVE DEVICE REGION AND A CURRENT SEN...

Improved Thermal and Electrical Conductivity Between Metal Contacts

METHOD AND APPARATUS FOR PROVIDING THERMAL WEAR LEVELING

THREE-DIMENSIONAL INTEGRATED CIRCUIT

POWER MODULE PACKAGE AND MANUFACTURE METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...

VOLTAGE REGULATOR HAVING VARIABLE OUTPUT CAPACITANCE AND METHODS FO...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

WIDE BANDGAP SEMICONDUCTOR DEVICE WITH SENSOR ELEMENT

HEATER STRUCTURE, MULTILAYER STRUCTURE, PROCESSING APPARATUS AND ME...

ON-DIE HEATER DEVICES FOR MEMORY DEVICES AND MEMORY MODULES

SEMICONDUCTOR PACKAGE

Semiconductor Device

MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES

PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

ARRAY SUBSTRATE AND DISPLAY PANEL

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...

SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF TH...

SEMICONDUCTOR PACKAGE

COMPACT POWER MODULE

SYSTEMS AND METHODS FOR INTEGRATING BATTERIES TO MAINTAIN VOLATILE...

CONTROL OF BOOST CONVERTER CURRENT LIMIT

THERMAL SENSOR DEVICE BY BACK END OF LINE METAL RESISTOR