Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including semiconductor chip having power tran...
- Patent number 12,308,356
- Issue date May 20, 2025
- Renesas Electronics Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package unit and chip packaging method
- Patent number 12,300,565
- Issue date May 13, 2025
- Richtek Technology Corporation
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,300,694
- Issue date May 13, 2025
- Rohm Co. Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure with heating element
- Patent number 12,293,954
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Tsung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensor circuits for integrated circuit devices
- Patent number 12,294,357
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Darryl G. Walker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for temperature measurement in data processing sy...
- Patent number 12,295,126
- Issue date May 6, 2025
- Dell Products L.P.
- Curtis Ray Genz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for integrating batteries to maintain volatile...
- Patent number 12,287,687
- Issue date Apr 29, 2025
- Arbor Company, LLLP
- Darrel James Guzy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling systems, cooling structures and electronic devices and meth...
- Patent number 12,284,793
- Issue date Apr 22, 2025
- Intel Corporation
- Ritu Bawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor system, method for operating a sensor system
- Patent number 12,270,824
- Issue date Apr 8, 2025
- Robert Bosch GmbH
- Wolfram Geiger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
- Patent number 12,255,196
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photon number resolving detector with thermal diode
- Patent number 12,249,641
- Issue date Mar 11, 2025
- PSIQUANTUM CORP.
- Faraz Najafi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested architectures for enhanced heterogeneous integration
- Patent number 12,243,806
- Issue date Mar 4, 2025
- Intel Corporation
- Ravindranath Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Independent power control for integrated circuit (IC) chips
- Patent number 12,243,827
- Issue date Mar 4, 2025
- Auradine Inc.
- Guangbin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,243,795
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Shinya Soneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to trim temperature sensors
- Patent number 12,235,168
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Nathan Richard Schemm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,230,556
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor structure with same
- Patent number 12,224,244
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hailin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BioFET device having a metal crown structure as a sensing layer dis...
- Patent number 12,216,077
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,218,024
- Issue date Feb 4, 2025
- Fuji Electric Co., Ltd.
- Motoyoshi Kubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 12,211,784
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method for preparing same
- Patent number 12,198,942
- Issue date Jan 14, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures and methods of manufacturing the same
- Patent number 12,199,000
- Issue date Jan 14, 2025
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact power module
- Patent number 12,199,071
- Issue date Jan 14, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and electronic apparatus
- Patent number 12,185,502
- Issue date Dec 31, 2024
- Fujitsu Limited
- Shinya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensor circuits for integrated circuit devices
- Patent number 12,184,271
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Darryl G. Walker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact humidity and pressure sensor with temperature control
- Patent number 12,163,938
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Vivek Saraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical package and method of fabrication
- Patent number 12,165,944
- Issue date Dec 10, 2024
- Rockley Photonics Limited
- Shuhe Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ACCURATE AND FAST POWER MODULE PROPERTIES ASSESSMENT
- Publication number 20250157871
- Publication date May 15, 2025
- GE AVIATION SYSTEMS LLC
- Shung Ik Lee
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250149418
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
- Publication number 20250149397
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Seonhaeng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149528
- Publication date May 8, 2025
- Mitsubishi Electric Corporation
- Kazuhiro NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD
- Publication number 20250140630
- Publication date May 1, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component holder with a temperature-control function
- Publication number 20250140631
- Publication date May 1, 2025
- BESI Switzerland AG
- Uwe BAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118687
- Publication date Apr 10, 2025
- Fuji Electric Co., Ltd.
- Daisuke ISOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY
- Publication number 20250118614
- Publication date Apr 10, 2025
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATOR TYPE HEATING ELEMENT FOR INTEGRATED CIRCUITS
- Publication number 20250112104
- Publication date Apr 3, 2025
- OpenLight Photonics, Inc.
- John Sonkoly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT POWER MODULE
- Publication number 20250112211
- Publication date Apr 3, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT
- Publication number 20250105081
- Publication date Mar 27, 2025
- DENSO CORPORATION
- Keita FUKUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOFET WITH INCREASED SENSING AREA
- Publication number 20250102460
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...
- Publication number 20250096102
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR STRUCTURE WITH SAME
- Publication number 20250096144
- Publication date Mar 20, 2025
- Changxin Memory Technologies, Inc.
- Hailin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION
- Publication number 20250087554
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Chetan Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT HUMIDITY AND PRESSURE SENSOR WITH TEMPERATURE CONTROL
- Publication number 20250067713
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- Vivek SARAF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069997
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Kazuki OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Vapor Chamber for Heat Dissipation in Electronic Devices
- Publication number 20250062187
- Publication date Feb 20, 2025
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE REGULATION OF INTEGRATED CIRCUIT ELEMENTS
- Publication number 20250063635
- Publication date Feb 20, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Ahmed Hassan Fahmy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly comprising a semiconductor component and a temperature sen...
- Publication number 20250052623
- Publication date Feb 13, 2025
- SEG Automotive Germany GmbH
- Nima SAADAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL STRUCTURE, AND SEMICONDUCTOR CHIP CARRYING MODULE AND MET...
- Publication number 20250046666
- Publication date Feb 6, 2025
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250048685
- Publication date Feb 6, 2025
- Rohm Co., Ltd.
- Yuji OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20250022832
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP SYSTEM AND ELECTRONIC DEVICE
- Publication number 20250014976
- Publication date Jan 9, 2025
- Huawei Technologies Co., Ltd
- Yilu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY
- Publication number 20250014973
- Publication date Jan 9, 2025
- Wolfspeed, Inc.
- Paul WHEELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006581
- Publication date Jan 2, 2025
- WAVEPIA CO., LTD.
- Sang Hun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ovenized MEMS
- Publication number 20250007455
- Publication date Jan 2, 2025
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421022
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Hirokatsu UMEGAMI
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including semiconductor chip having power tran...

Chip package unit and chip packaging method

Semiconductor device and semiconductor module

Method of fabricating semiconductor structure with heating element

Temperature sensor circuits for integrated circuit devices

System and method for temperature measurement in data processing sy...

Systems and methods for integrating batteries to maintain volatile...

Cooling systems, cooling structures and electronic devices and meth...

Sensor system, method for operating a sensor system

Semiconductor package with thermal relaxation block and manufacturi...

Photon number resolving detector with thermal diode

Nested architectures for enhanced heterogeneous integration

Independent power control for integrated circuit (IC) chips

Motor controller heat dissipating systems and methods

Semiconductor device

Methods and apparatus to trim temperature sensors

Semiconductor package and method of fabricating the same

Package substrate and semiconductor structure with same

BioFET device having a metal crown structure as a sensing layer dis...

Semiconductor device and fabrication method thereof

SOI substrate and related methods

Packaging structure and method for preparing same

Semiconductor device structures and methods of manufacturing the same

Compact power module

Semiconductor device

Semiconductor apparatus and electronic apparatus

Temperature sensor circuits for integrated circuit devices

Semiconductor device and temperature measurement method

Compact humidity and pressure sensor with temperature control

Electro-optical package and method of fabrication

Patents Applicationslast 30 patents

ACCURATE AND FAST POWER MODULE PROPERTIES ASSESSMENT

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE

SEMICONDUCTOR DEVICE

CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD

Component holder with a temperature-control function

SEMICONDUCTOR DEVICE

MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY

RADIATOR TYPE HEATING ELEMENT FOR INTEGRATED CIRCUITS

COMPACT POWER MODULE

SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT

BIOFET WITH INCREASED SENSING AREA

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...

PACKAGE SUBSTRATE AND SEMICONDUCTOR STRUCTURE WITH SAME

THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION

COMPACT HUMIDITY AND PRESSURE SENSOR WITH TEMPERATURE CONTROL

SEMICONDUCTOR DEVICE

Direct Vapor Chamber for Heat Dissipation in Electronic Devices

TEMPERATURE REGULATION OF INTEGRATED CIRCUIT ELEMENTS

Assembly comprising a semiconductor component and a temperature sen...

UNDERFILL STRUCTURE, AND SEMICONDUCTOR CHIP CARRYING MODULE AND MET...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

STACKED-DIE MEMS RESONATOR

CHIP SYSTEM AND ELECTRONIC DEVICE

POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY

SEMICONDUCTOR DEVICE

Ovenized MEMS

SEMICONDUCTOR DEVICE