Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
MEMS resonator integrated cicruit fabrication
- Patent number 12,365,582
- Issue date Jul 22, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
IGBT chip integrating temperature sensor
- Patent number 12,368,082
- Issue date Jul 22, 2025
- Huawei Technologies Co., Ltd.
- Boning Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,362,253
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for effective reading of multiple temperature s...
- Patent number 12,359,981
- Issue date Jul 15, 2025
- Dell Product, LP
- Vaishnavi Suchindran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor module
- Patent number 12,334,409
- Issue date Jun 17, 2025
- Fuji Electric Co., Ltd.
- Yasufumi Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Meeting performance and temperature requirements in electronic circ...
- Patent number 12,327,774
- Issue date Jun 10, 2025
- MARVELL ASIA PTE. LTD.
- Seid Alireza Razavi Majomard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D flash memory module chip and method of fabricating the same
- Patent number 12,327,594
- Issue date Jun 10, 2025
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package, wearable device, and temperature detection m...
- Patent number 12,322,740
- Issue date Jun 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having power tran...
- Patent number 12,308,356
- Issue date May 20, 2025
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package unit and chip packaging method
- Patent number 12,300,565
- Issue date May 13, 2025
- Richtek Technology Corporation
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,300,694
- Issue date May 13, 2025
- Rohm Co. Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure with heating element
- Patent number 12,293,954
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Tsung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensor circuits for integrated circuit devices
- Patent number 12,294,357
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Darryl G. Walker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for temperature measurement in data processing sy...
- Patent number 12,295,126
- Issue date May 6, 2025
- Dell Products L.P.
- Curtis Ray Genz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for integrating batteries to maintain volatile...
- Patent number 12,287,687
- Issue date Apr 29, 2025
- Arbor Company, LLLP
- Darrel James Guzy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling systems, cooling structures and electronic devices and meth...
- Patent number 12,284,793
- Issue date Apr 22, 2025
- Intel Corporation
- Ritu Bawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor system, method for operating a sensor system
- Patent number 12,270,824
- Issue date Apr 8, 2025
- Robert Bosch GmbH
- Wolfram Geiger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
- Patent number 12,255,196
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photon number resolving detector with thermal diode
- Patent number 12,249,641
- Issue date Mar 11, 2025
- PSIQUANTUM CORP.
- Faraz Najafi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested architectures for enhanced heterogeneous integration
- Patent number 12,243,806
- Issue date Mar 4, 2025
- Intel Corporation
- Ravindranath Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Independent power control for integrated circuit (IC) chips
- Patent number 12,243,827
- Issue date Mar 4, 2025
- Auradine Inc.
- Guangbin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,243,795
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Shinya Soneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to trim temperature sensors
- Patent number 12,235,168
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Nathan Richard Schemm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,230,556
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor structure with same
- Patent number 12,224,244
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hailin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BioFET device having a metal crown structure as a sensing layer dis...
- Patent number 12,216,077
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,218,024
- Issue date Feb 4, 2025
- Fuji Electric Co., Ltd.
- Motoyoshi Kubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 12,211,784
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method for preparing same
- Patent number 12,198,942
- Issue date Jan 14, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT
- Publication number 20250239502
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Tsung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250233030
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Hwanjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20250234637
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20250218889
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Min Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics IC (PIC) with Extended Operating Temperature Range
- Publication number 20250216602
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Sujit Handanhal Ramachandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250221011
- Publication date Jul 3, 2025
- BYD COMPANY LIMITED
- Rui HU
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20250219030
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR AMBIENT TEMPERATURE SENSOR DESIGN IN A COM...
- Publication number 20250210438
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Abhijeet PAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING A HOTSPOT DETECTION CIRCUIT
- Publication number 20250211221
- Publication date Jun 26, 2025
- Cambridge GaN Devices Limited
- Florin UDREA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210439
- Publication date Jun 26, 2025
- RENESAS ELECTRONICS CORPORATION
- Yoshinori HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER AND SEMICONDUCTOR MODULE
- Publication number 20250210445
- Publication date Jun 26, 2025
- NIDEC CORPORATION
- Yuki YANAGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...
- Publication number 20250201646
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250183112
- Publication date Jun 5, 2025
- Fuji Electric Co., Ltd.
- Motoyoshi KUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION
- Publication number 20250183111
- Publication date Jun 5, 2025
- Joby Aero, Inc.
- Robert Ramm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
- Publication number 20250183245
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20250174523
- Publication date May 29, 2025
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
- Publication number 20250172434
- Publication date May 29, 2025
- DENSO CORPORATION
- Kazuaki FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO TRIM TEMPERATURE SENSORS
- Publication number 20250164322
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nathan Richard Schemm
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167063
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takeshi TOKOROZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20250167102
- Publication date May 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20250167101
- Publication date May 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCURATE AND FAST POWER MODULE PROPERTIES ASSESSMENT
- Publication number 20250157871
- Publication date May 15, 2025
- GE AVIATION SYSTEMS LLC
- Shung Ik Lee
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250149418
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
- Publication number 20250149397
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Seonhaeng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149528
- Publication date May 8, 2025
- Mitsubishi Electric Corporation
- Kazuhiro NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD
- Publication number 20250140630
- Publication date May 1, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component holder with a temperature-control function
- Publication number 20250140631
- Publication date May 1, 2025
- BESI Switzerland AG
- Uwe BAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118687
- Publication date Apr 10, 2025
- Fuji Electric Co., Ltd.
- Daisuke ISOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY
- Publication number 20250118614
- Publication date Apr 10, 2025
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATOR TYPE HEATING ELEMENT FOR INTEGRATED CIRCUITS
- Publication number 20250112104
- Publication date Apr 3, 2025
- OpenLight Photonics, Inc.
- John Sonkoly
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS resonator integrated cicruit fabrication

IGBT chip integrating temperature sensor

Semiconductor package and method of fabricating the same

Systems and methods for effective reading of multiple temperature s...

Semiconductor module

Meeting performance and temperature requirements in electronic circ...

3D flash memory module chip and method of fabricating the same

Semiconductor package, wearable device, and temperature detection m...

Semiconductor device including semiconductor chip having power tran...

Chip package unit and chip packaging method

Semiconductor device and semiconductor module

Method of fabricating semiconductor structure with heating element

Temperature sensor circuits for integrated circuit devices

System and method for temperature measurement in data processing sy...

Systems and methods for integrating batteries to maintain volatile...

Cooling systems, cooling structures and electronic devices and meth...

Sensor system, method for operating a sensor system

Semiconductor package with thermal relaxation block and manufacturi...

Photon number resolving detector with thermal diode

Nested architectures for enhanced heterogeneous integration

Independent power control for integrated circuit (IC) chips

Motor controller heat dissipating systems and methods

Semiconductor device

Methods and apparatus to trim temperature sensors

Semiconductor package and method of fabricating the same

Package substrate and semiconductor structure with same

BioFET device having a metal crown structure as a sensing layer dis...

Semiconductor device and fabrication method thereof

SOI substrate and related methods

Packaging structure and method for preparing same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

Photonics IC (PIC) with Extended Operating Temperature Range

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

METHOD AND APPARATUS FOR AMBIENT TEMPERATURE SENSOR DESIGN IN A COM...

INTEGRATED CIRCUIT COMPRISING A HOTSPOT DETECTION CIRCUIT

SEMICONDUCTOR DEVICE

HEAT DISSIPATION MEMBER AND SEMICONDUCTOR MODULE

SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION

SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE

METHODS AND APPARATUS TO TRIM TEMPERATURE SENSORS

SEMICONDUCTOR DEVICE

SOI SUBSTRATE AND RELATED METHODS

SOI SUBSTRATE AND RELATED METHODS

ACCURATE AND FAST POWER MODULE PROPERTIES ASSESSMENT

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE

SEMICONDUCTOR DEVICE

CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD

Component holder with a temperature-control function

SEMICONDUCTOR DEVICE

MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY

RADIATOR TYPE HEATING ELEMENT FOR INTEGRATED CIRCUITS