by melting or evaporation of solids

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4275by melting or evaporation of solids

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,100,638
- Issue date Sep 24, 2024
- Denso Corporation
- Shohei Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite thermal interface materials and associated devices, syste...
- Patent number 11,943,899
- Issue date Mar 26, 2024
- Deeia Inc.
- Himanshu Pokharna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system providing cooling to an infrastructure having a plur...
- Patent number 11,937,406
- Issue date Mar 19, 2024
- OVH
- Ali Chehade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compensation layers with core-shell phase change particles...
- Patent number 11,933,546
- Issue date Mar 19, 2024
- Toyota Motor North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink with protrusions on multiple sides thereof and apparatus...
- Patent number 11,864,348
- Issue date Jan 2, 2024
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink assemblies for transient cooling
- Patent number 11,864,347
- Issue date Jan 2, 2024
- GE Aviation Systems LLC
- Michel Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal peak suppression device
- Patent number 11,848,250
- Issue date Dec 19, 2023
- Global Unichip Corporation
- Chih-Chieh Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure assembly
- Patent number 11,818,869
- Issue date Nov 14, 2023
- MICRO-STAR INT'L CO., LIMITED.
- Cheng-Lung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Phase change heat-storing mechanisms for substrates of electronic a...
- Patent number 11,754,343
- Issue date Sep 12, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Circuit board with phase change material
- Patent number 11,742,259
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Manish Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having flexible, heat conductive layer and associ...
- Patent number 11,665,856
- Issue date May 30, 2023
- Eagle Technology, LLC
- Jason Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shape-memory heat absorbers
- Patent number 11,599,166
- Issue date Mar 7, 2023
- Lenovo (Singapore) Pte. Ltd.
- Bouziane Yebka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat pipe tapered down in fin stack region and oppositely tapered f...
- Patent number 11,477,911
- Issue date Oct 18, 2022
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat sink with protrusions on multiple sides thereof and apparatus...
- Patent number 11,425,840
- Issue date Aug 23, 2022
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling systems adapted to be thermally connected to heat-generatin...
- Patent number 11,406,047
- Issue date Aug 2, 2022
- OVH
- Ali Chehade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a heat dissipation structure
- Patent number 11,380,603
- Issue date Jul 5, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable thermal ride-through for immersion-cooled server systems
- Patent number 11,357,130
- Issue date Jun 7, 2022
- Microsoft Technology Licensing, LLC
- Ioannis Manousakis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3DIC package comprising perforated foil sheet
- Patent number 11,257,690
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating device with interfacial enhancements
- Patent number 11,181,323
- Issue date Nov 23, 2021
- QUALCOMM Incorporated
- Sean Charles Andrews
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink with condensing fins and phase change material
- Patent number 11,156,408
- Issue date Oct 26, 2021
- United Arab Emirates University
- Salah Addin Burhan Al Omari
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface materials including polymeric phase-change materials
- Patent number 11,130,845
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Dylan J. Boday
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling devices including a variable angle contact surface and meth...
- Patent number 11,098,960
- Issue date Aug 24, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Self-heating thermal interface material
- Patent number 11,085,672
- Issue date Aug 10, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compensation layers with core-shell phase change particles...
- Patent number 11,067,343
- Issue date Jul 20, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic power module comprising a dielectric support
- Patent number 11,049,795
- Issue date Jun 29, 2021
- SUPERGRID INSTITUTE
- Cyril Buttay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with phase change material
- Patent number 11,049,794
- Issue date Jun 29, 2021
- Advanced Micro Devices, Inc.
- Manish Arora
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling devices, packaged semiconductor devices, and methods of pac...
- Patent number 11,004,771
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase changing on-chip thermal heat sink
- Patent number 11,004,770
- Issue date May 11, 2021
- International Business Machines Corporation
- Mattias E. Dahlstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials including polymeric phase-change materials
- Patent number 10,968,320
- Issue date Apr 6, 2021
- International Business Machines Corporation
- Dylan J. Boday
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing an ultrathin heat dissipation structure
- Patent number 10,923,411
- Issue date Feb 16, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Ning Hou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20250038066
- Publication date Jan 30, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTE...
- Publication number 20240389274
- Publication date Nov 21, 2024
- Deeia Inc.
- Himanshu Pokharna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
- Publication number 20240170366
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR RING TYPE INTEGRATED CIRCUITS
- Publication number 20240105549
- Publication date Mar 28, 2024
- Cisco Technology, Inc.
- Yongguo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230395461
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20230369166
- Publication date Nov 16, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY MODULE WITH THERMAL STORAGE
- Publication number 20230238301
- Publication date Jul 27, 2023
- GE AVIATION SYSTEMS LLC
- Rinaldo Luigi Miorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID CONDUIT WITHIN A PACKAGE SUBSTRATE FOR TWO-PHASE IMMERSION CO...
- Publication number 20230163047
- Publication date May 25, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus...
- Publication number 20220369498
- Publication date Nov 17, 2022
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING SYSTEM PROVIDING COOLING TO AN INFRASTRUCTURE HAVING A PLUR...
- Publication number 20220304194
- Publication date Sep 22, 2022
- OVH
- Ali CHEHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220285245
- Publication date Sep 8, 2022
- DENSO CORPORATION
- Shohei NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PEAK SUPPRESSION DEVICE
- Publication number 20220270953
- Publication date Aug 25, 2022
- Global Unichip Corporation
- Chih-Chieh LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH PHASE CHANGE MATERIAL
- Publication number 20210313248
- Publication date Oct 7, 2021
- ADVANCED MICRO DEVICES, INC.
- MANISH ARORA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE HEAT-STORING MECHANISMS FOR SUBSTRATES OF ELECTRONIC A...
- Publication number 20210131740
- Publication date May 6, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus...
- Publication number 20210059069
- Publication date Feb 25, 2021
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SINK INCORPORATING MICROENCAPSULATED PHASE-CHANGE MATERIAL
- Publication number 20200321265
- Publication date Oct 8, 2020
- Raytheon Company
- PETER A. BELLUS
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
3DIC Package Comprising Perforated Foil Sheet
- Publication number 20200294817
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200286849
- Publication date Sep 10, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING DEVICE WITH INTERFACIAL ENHANCEMENTS
- Publication number 20200271388
- Publication date Aug 27, 2020
- QUALCOMM Incorporated
- Sean Charles ANDREWS
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Combined Integration Of Phase Change Materials Into Conduction-Conv...
- Publication number 20200126891
- Publication date Apr 23, 2020
- BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS
- David Huitink
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus...
- Publication number 20200093028
- Publication date Mar 19, 2020
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SINK ASSEMBLIES FOR TRANSIENT COOLING
- Publication number 20200053908
- Publication date Feb 13, 2020
- GE AVIATION SYSTEMS LLC
- Michel ENGELHARDT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING A HEAT DISSIPATION STRUCTURE
- Publication number 20200043827
- Publication date Feb 6, 2020
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS, METHOD OF CONTROLLING ELECTRONIC APPARATUS, P...
- Publication number 20200044472
- Publication date Feb 6, 2020
- SONY CORPORATION
- Masakazu Yajima
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Electronic Power Module Comprising a Dielectric Support
- Publication number 20190385930
- Publication date Dec 19, 2019
- SUPERGRID INSTITUTE
- Cyril Buttay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Expanding Thermal Device and System for Effecting Heat Transfer wit...
- Publication number 20190261502
- Publication date Aug 22, 2019
- Raytheon Company
- Brian W. Johansen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIALS INCLUDING POLYMERIC PHASE-CHANGE MATERIALS
- Publication number 20190256665
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Dylan J. Boday
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Cooling Devices, Packaged Semiconductor Devices, and Methods of Pac...
- Publication number 20190252294
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Delivery roll and method for manufacturing thereof
- Publication number 20190237387
- Publication date Aug 1, 2019
- NOLATO SILIKONTEKNIK AB
- Xiongwei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIALS INCLUDING POLYMERIC PHASE-CHANGE MATERIALS
- Publication number 20190135987
- Publication date May 9, 2019
- International Business Machines Corporation
- Dylan J. Boday
- H01 - BASIC ELECTRIC ELEMENTS

by melting or evaporation of solids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Composite thermal interface materials and associated devices, syste...

Cooling system providing cooling to an infrastructure having a plur...

Thermal compensation layers with core-shell phase change particles...

Heat sink with protrusions on multiple sides thereof and apparatus...

Heat sink assemblies for transient cooling

Thermal peak suppression device

Heat dissipation structure assembly

Phase change heat-storing mechanisms for substrates of electronic a...

Circuit board with phase change material

Electronic device having flexible, heat conductive layer and associ...

Shape-memory heat absorbers

Heat pipe tapered down in fin stack region and oppositely tapered f...

Heat sink with protrusions on multiple sides thereof and apparatus...

Cooling systems adapted to be thermally connected to heat-generatin...

Method for making a heat dissipation structure

Scalable thermal ride-through for immersion-cooled server systems

3DIC package comprising perforated foil sheet

Heat-dissipating device with interfacial enhancements

Heat sink with condensing fins and phase change material

Thermal interface materials including polymeric phase-change materials

Cooling devices including a variable angle contact surface and meth...

Self-heating thermal interface material

Thermal compensation layers with core-shell phase change particles...

Electronic power module comprising a dielectric support

Circuit board with phase change material

Cooling devices, packaged semiconductor devices, and methods of pac...

Phase changing on-chip thermal heat sink

Thermal interface materials including polymeric phase-change materials

Method for manufacturing an ultrathin heat dissipation structure

Patents Applicationslast 30 patents

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTE...

SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER

HEATSINK FOR RING TYPE INTEGRATED CIRCUITS

Semiconductor Device and Method Forming Same

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

POWER OVERLAY MODULE WITH THERMAL STORAGE

FLUID CONDUIT WITHIN A PACKAGE SUBSTRATE FOR TWO-PHASE IMMERSION CO...

Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus...

COOLING SYSTEM PROVIDING COOLING TO AN INFRASTRUCTURE HAVING A PLUR...

SEMICONDUCTOR MODULE

THERMAL PEAK SUPPRESSION DEVICE

CIRCUIT BOARD WITH PHASE CHANGE MATERIAL

PHASE CHANGE HEAT-STORING MECHANISMS FOR SUBSTRATES OF ELECTRONIC A...

Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus...

HEAT SINK INCORPORATING MICROENCAPSULATED PHASE-CHANGE MATERIAL

3DIC Package Comprising Perforated Foil Sheet

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...

HEAT-DISSIPATING DEVICE WITH INTERFACIAL ENHANCEMENTS

Combined Integration Of Phase Change Materials Into Conduction-Conv...

Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus...

HEAT SINK ASSEMBLIES FOR TRANSIENT COOLING

METHOD FOR MAKING A HEAT DISSIPATION STRUCTURE

ELECTRONIC APPARATUS, METHOD OF CONTROLLING ELECTRONIC APPARATUS, P...

Electronic Power Module Comprising a Dielectric Support

Expanding Thermal Device and System for Effecting Heat Transfer wit...

THERMAL INTERFACE MATERIALS INCLUDING POLYMERIC PHASE-CHANGE MATERIALS

Cooling Devices, Packaged Semiconductor Devices, and Methods of Pac...

Delivery roll and method for manufacturing thereof

THERMAL INTERFACE MATERIALS INCLUDING POLYMERIC PHASE-CHANGE MATERIALS