Claims
- 1. A carrier for a substrate polishing apparatus, comprising:
- a housing connectable to a drive shaft;
- a first biasing member including a flexible membrane defining a first pressure chamber, a lower surface of the flexible membrane providing a substrate receiving surface; and
- a second biasing member connecting the first biasing member to the housing, the second biasing member providing a downward pressure on the first biasing member, the second biasing member including a second pressure chamber.
- 2. The carrier of claim 1 further comprising a retainer projecting below the lower surface of the flexible membrane to form a substrate receiving recess.
- 3. The carrier of claim 1 wherein different portions of the flexible membrane have different thicknesses.
- 4. The carrier of claim 1 wherein a first pressure in the first pressure chamber is less than a second pressure in the second pressure chamber.
- 5. The carrier of claim 1 wherein the second biasing member is connectable to the drive shaft.
- 6. The carrier of claim 1 wherein the first biasing member includes the housing and wherein the flexible membrane extends across an opening in a bottom side of the housing.
- 7. The carrier of claim 1 wherein the second biasing member includes a bellows connected to an upper end of the first biasing member.
- 8. The carrier of claim 1 wherein the second biasing member includes a substantially cylindrical wall circumferentially enclosing the first biasing member.
- 9. An apparatus for polishing a substrate, comprising:
- a polishing pad; and
- a carrier including
- a housing connectable to a drive shaft,
- a first biasing member including a flexible membrane to form a first pressure chamber, a lower surface of the flexible membrane providing a substrate-receiving surface, and
- a second biasing member to generate a downward pressure on the first biasing member, the second biasing member connecting the first biasing member to the housing and including a second pressure chamber.
- 10. A carrier for a chemical mechanical polishing apparatus, comprising:
- a housing connectable to a drive shaft;
- a first pressurizable chamber to load a substrate against a polishing pad, the first pressurizable chamber being closed at one end by a flexible member that forms a substrate receiving surface; and
- a second pressurizable chamber connecting the first pressurizable chamber to the housing to apply a downward pressure on the first pressurizable chamber.
- 11. A carrier for a substrate polishing apparatus, comprising:
- a first biasing member within a housing connectable to a drive shaft, the first biasing member including a flexible membrane defining a first pressure chamber, a lower surface of the flexible membrane providing a substrate receiving surface; and
- a second biasing member within the housing and connected to the first biasing member, the second biasing member providing a downward pressure on the first biasing member, the second biasing member including a second pressure chamber.
RELATED APPLICATIONS
This application is a continuation of application Ser. No. 08/205,276 now U.S. Pat. No. 5,643,053, filed Mar. 2, 1994, which is a continuation-in-part of application Ser. No. 08/173,846, filed Dec. 27, 1993 now U.S. Pat. No. 5,582,534.
US Referenced Citations (29)
Foreign Referenced Citations (6)
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Oct 1984 |
EPX |
0593057 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
205276 |
Mar 1994 |
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Continuation in Parts (1)
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Number |
Date |
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Parent |
173846 |
Dec 1993 |
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